LAE5UM-25F-6BG381E

IC FPGA 197 I/O 381CABGA
Part Description

LA-ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192 24000 381-FBGA

Quantity 813 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package381-CABGA (17x17)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case381-FBGANumber of I/O197Voltage1.04 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3000Number of Logic Elements/Cells24000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits1032192

Overview of LAE5UM-25F-6BG381E – LA-ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192 24000 381-FBGA

The LAE5UM-25F-6BG381E is a LA‑ECP5 family FPGA delivering configurable logic, embedded memory, and high pin-count I/O in a compact surface-mount BGA package. It combines 24,000 logic elements with approximately 1.03 Mbits of on‑chip RAM and 197 I/O pins to support dense, programmable system designs.

Designed and qualified for automotive applications, this device offers AEC‑Q100 qualification and an extended operating range from -40°C to 125°C. Its combination of logic capacity, memory, and I/O density makes it suitable for in‑vehicle control, interface consolidation, and other embedded systems that demand configurability and rugged operation.

Key Features

  • Programmable Logic 24,000 logic elements for implementing custom logic, state machines, and data paths.
  • Embedded Memory Approximately 1.03 Mbits of on‑chip RAM to support buffers, FIFOs, and local storage.
  • High I/O Density 197 I/O pins enable extensive connectivity for sensors, actuators, peripherals, and communication buses.
  • Automotive Qualification & Temperature Range AEC‑Q100 qualified and rated for operation from -40°C to 125°C for automotive environment suitability.
  • Power Supply Core voltage range from 1.04 V to 1.155 V, permitting low‑voltage core operation and power management integration.
  • Package & Mounting 381‑FBGA package (supplier device package: 381‑CABGA, 17×17) with surface‑mount mounting for compact PCB integration.
  • Regulatory Compliance RoHS compliant.

Typical Applications

  • Automotive Body and Gateway Electronics Use the device to consolidate I/O, implement protocol translation, and handle control logic within vehicle gateways and body control modules.
  • Sensor Aggregation and Signal Conditioning Aggregate and pre‑process signals from multiple sensors using programmable logic and on‑chip memory for buffering and filtering.
  • In‑Vehicle Interface and Display Control Implement custom user interface logic, input handling, and peripheral control using the device's abundant I/O and logic resources.
  • Embedded Control and Actuation Deploy as application‑specific control logic for motor drivers, lighting systems, and other vehicle subsystems requiring deterministic programmable logic.

Unique Advantages

  • Highly configurable logic capacity: 24,000 logic elements let you implement complex, application‑specific functions without external ASICs.
  • On‑chip memory for real‑time buffering: Approximately 1.03 Mbits of embedded RAM supports data buffering, FIFOs, and small lookup tables directly on the device.
  • Substantial I/O integration: 197 I/O pins reduce the need for additional interface chips and simplify PCB routing for multi‑sensor and multi‑interface designs.
  • Automotive‑grade qualification: AEC‑Q100 qualification and a -40°C to 125°C operating range support deployment in vehicle environments.
  • Compact, manufacturable package: 381‑FBGA (381‑CABGA, 17×17) surface‑mount package enables high‑density board designs while meeting production assembly processes.
  • RoHS compliant: Meets common environmental and regulatory requirements for modern electronics manufacturing.

Why Choose LAE5UM-25F-6BG381E?

The LAE5UM-25F-6BG381E offers a balanced combination of programmable logic, embedded memory, and high I/O count in an automotive‑qualified package, making it well suited for engineers designing vehicle electronics and other embedded systems that require configurable hardware and robust operating margins. Its low‑voltage core and compact 381‑FBGA footprint simplify power and board design while delivering the integration needed to reduce BOM and consolidate functions.

For teams targeting scalable, production‑ready solutions, this FPGA provides a clear path to implement custom logic functions with on‑chip memory and extensive connectivity, backed by automotive qualification and RoHS compliance.

If you would like pricing, availability, or to request a quote for the LAE5UM-25F-6BG381E, please submit a quote request or contact sales to get started.

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