LAE5U-12F-7BG381E
| Part Description |
LA-ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 381-FBGA |
|---|---|
| Quantity | 212 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 197 | Voltage | 1.04 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 589824 |
Overview of LAE5U-12F-7BG381E – ECP5 Automotive FPGA, 12k logic elements, 381-FBGA
The LAE5U-12F-7BG381E is a Lattice Semiconductor ECP5 Automotive family field programmable gate array (FPGA) offered in a 381-ball FBGA (17×17) package. It provides a mid-range logic capacity and a collection of on-chip resources suitable for vehicle-grade and industrial embedded designs.
Designed for applications that require automotive qualification and extended temperature operation, this device combines approximately 12,000 logic elements, roughly 0.59 Mbits of embedded RAM, and 197 general-purpose I/Os with a low-voltage core supply range of 1.04 V to 1.155 V.
Key Features
- Logic Capacity Approximately 12,000 logic elements for implementing glue logic, protocol bridging, and mid-density FPGA functions.
- Embedded Memory Approximately 0.59 Mbits of on-chip RAM to support FIFOs, buffering and small data stores.
- I/O Resources 197 user I/Os for flexible interfacing to sensors, serializers, and peripheral devices.
- Automotive Qualification AEC‑Q100 qualification and Automotive grade designation, suitable for designs that require automotive component qualification.
- Package and Mounting 381‑FBGA (381‑CABGA 17×17) surface-mount package that balances density and board-area efficiency.
- Operating Range Wide operating temperature range from −40 °C to 125 °C for harsh-environment operation.
- Low-Voltage Core Core supply range of 1.04 V to 1.155 V, enabling compatibility with modern low-voltage power rails.
- Series-Level Capabilities ECP5 Automotive family architecture includes system clock PLLs, clock distribution, SERDES and PCS blocks, DDR memory support, configurable I/O standards, and on‑chip oscillator features as described in the ECP5 Automotive datasheet.
- Compliance RoHS compliant.
Typical Applications
- Automotive Systems In-vehicle functions that require AEC‑Q100 qualified components, such as body electronics, gateway interfaces, and vehicle networking modules.
- High-Speed Communication Serial link and protocol bridging roles leveraging the ECP5 Automotive family SERDES/PCS and PCIe-capable building blocks described in the series datasheet.
- Video and Broadcast Interfaces SD/HD/3G‑SDI and related video interface processing as supported by the series’ documented timing and interface characteristics.
- Industrial Control and Sensor Bridging Sensor interfacing, aggregation and deterministic I/O tasks across a wide temperature range for industrial and vehicle environments.
Unique Advantages
- Automotive-Grade Qualification: AEC‑Q100 qualification provides component-level credibility for vehicle programs requiring qualified parts.
- Balanced Integration: Combines a mid-range logic element count with substantial I/O and embedded RAM to reduce external glue logic and BOM complexity.
- Wide Temperature Operation: −40 °C to 125 °C rating supports deployment in demanding thermal environments.
- Compact, High-Density Package: 381‑FBGA (17×17) offers a compact footprint while delivering nearly 200 I/Os for complex board-level routing.
- Low-Voltage Core: 1.04 V to 1.155 V core supply aligns with modern low-voltage power domains for efficient system design.
- Series-Level Interface and Timing Features: Access to ECP5 Automotive family features such as PLLs, clocking, DDR support and SERDES/PCS architecture for systems requiring high-performance serial and memory interfaces.
Why Choose LAE5U-12F-7BG381E?
The LAE5U-12F-7BG381E positions itself as a mid-density, automotive‑qualified FPGA that blends on‑chip logic, embedded memory, and extensive I/O in a compact 381‑FBGA package. Its AEC‑Q100 qualification, broad operating temperature range, and low-voltage core make it suitable for designers building vehicle or ruggedized systems that need a certified, board‑level programmable device.
Engineers seeking a scalable FPGA option within the ECP5 Automotive family will find this device appropriate for roles that require protocol bridging, serial communication interfaces, and deterministic I/O handling, while keeping board-level complexity and external component count under control.
Request a quote or submit an inquiry to obtain pricing, lead time and availability for the LAE5U-12F-7BG381E. Our team can provide the information needed to evaluate this device for your next design.