LAE5U-12F-7BG381E

IC FPGA 197 I/O 381CABGA
Part Description

LA-ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 381-FBGA

Quantity 212 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package381-CABGA (17x17)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case381-FBGANumber of I/O197Voltage1.04 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1500Number of Logic Elements/Cells12000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits589824

Overview of LAE5U-12F-7BG381E – ECP5 Automotive FPGA, 12k logic elements, 381-FBGA

The LAE5U-12F-7BG381E is a Lattice Semiconductor ECP5 Automotive family field programmable gate array (FPGA) offered in a 381-ball FBGA (17×17) package. It provides a mid-range logic capacity and a collection of on-chip resources suitable for vehicle-grade and industrial embedded designs.

Designed for applications that require automotive qualification and extended temperature operation, this device combines approximately 12,000 logic elements, roughly 0.59 Mbits of embedded RAM, and 197 general-purpose I/Os with a low-voltage core supply range of 1.04 V to 1.155 V.

Key Features

  • Logic Capacity  Approximately 12,000 logic elements for implementing glue logic, protocol bridging, and mid-density FPGA functions.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM to support FIFOs, buffering and small data stores.
  • I/O Resources  197 user I/Os for flexible interfacing to sensors, serializers, and peripheral devices.
  • Automotive Qualification  AEC‑Q100 qualification and Automotive grade designation, suitable for designs that require automotive component qualification.
  • Package and Mounting  381‑FBGA (381‑CABGA 17×17) surface-mount package that balances density and board-area efficiency.
  • Operating Range  Wide operating temperature range from −40 °C to 125 °C for harsh-environment operation.
  • Low-Voltage Core  Core supply range of 1.04 V to 1.155 V, enabling compatibility with modern low-voltage power rails.
  • Series-Level Capabilities  ECP5 Automotive family architecture includes system clock PLLs, clock distribution, SERDES and PCS blocks, DDR memory support, configurable I/O standards, and on‑chip oscillator features as described in the ECP5 Automotive datasheet.
  • Compliance  RoHS compliant.

Typical Applications

  • Automotive Systems  In-vehicle functions that require AEC‑Q100 qualified components, such as body electronics, gateway interfaces, and vehicle networking modules.
  • High-Speed Communication  Serial link and protocol bridging roles leveraging the ECP5 Automotive family SERDES/PCS and PCIe-capable building blocks described in the series datasheet.
  • Video and Broadcast Interfaces  SD/HD/3G‑SDI and related video interface processing as supported by the series’ documented timing and interface characteristics.
  • Industrial Control and Sensor Bridging  Sensor interfacing, aggregation and deterministic I/O tasks across a wide temperature range for industrial and vehicle environments.

Unique Advantages

  • Automotive-Grade Qualification: AEC‑Q100 qualification provides component-level credibility for vehicle programs requiring qualified parts.
  • Balanced Integration: Combines a mid-range logic element count with substantial I/O and embedded RAM to reduce external glue logic and BOM complexity.
  • Wide Temperature Operation: −40 °C to 125 °C rating supports deployment in demanding thermal environments.
  • Compact, High-Density Package: 381‑FBGA (17×17) offers a compact footprint while delivering nearly 200 I/Os for complex board-level routing.
  • Low-Voltage Core: 1.04 V to 1.155 V core supply aligns with modern low-voltage power domains for efficient system design.
  • Series-Level Interface and Timing Features: Access to ECP5 Automotive family features such as PLLs, clocking, DDR support and SERDES/PCS architecture for systems requiring high-performance serial and memory interfaces.

Why Choose LAE5U-12F-7BG381E?

The LAE5U-12F-7BG381E positions itself as a mid-density, automotive‑qualified FPGA that blends on‑chip logic, embedded memory, and extensive I/O in a compact 381‑FBGA package. Its AEC‑Q100 qualification, broad operating temperature range, and low-voltage core make it suitable for designers building vehicle or ruggedized systems that need a certified, board‑level programmable device.

Engineers seeking a scalable FPGA option within the ECP5 Automotive family will find this device appropriate for roles that require protocol bridging, serial communication interfaces, and deterministic I/O handling, while keeping board-level complexity and external component count under control.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the LAE5U-12F-7BG381E. Our team can provide the information needed to evaluate this device for your next design.

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