LAE3-35EA-6LFN484E

The LAE3-35EA-6LFN484E is a LA-ECP3 family Field Programmable Gate Array (FPGA) IC designed for automotive and embedded system applications. It combines a high-density reconfigurable fabric with on-chip memory and flexible high-speed I/O to support complex signal processing, protocol bridging and system integration tasks.

As an AEC-Q100 qualified, automotive-grade device, this FPGA targets designs that require elevated temperature range, high I/O count and integrated serial connectivity while retaining the flexibility of a programmable logic solution.

Key Features

• Logic Capacity — Approximately 33,000 logic elements provide substantial gate count for medium-to-high complexity designs.
• Embedded Memory — Approximately 1.36 Mbits of on-chip RAM (1,358,848 bits) for frame buffers, FIFOs and working storage.
• High I/O Count — 295 user I/Os delivered in a single device to enable dense interfacing to sensors, networks and peripherals.
• High‑speed SERDES and Protocol Support — Series-level capabilities include embedded SERDES supporting data rates from 150 Mbps to 3.2 Gbps and multi-protocol support (PCI Express, Ethernet, CPRI, SMPTE, Serial RapidIO), enabling high-bandwidth serial links.
• sysDSP and Multiply/Accumulate — Series-level sysDSP architecture with cascaded slices and support for wide MAC operations and multiple multiplier configurations for signal processing acceleration.
• Power and Supply — Specified voltage supply of 1.14 V for core operation.
• Automotive Qualification — AEC-Q100 qualified and graded for automotive use with an operating temperature range of −40 °C to 125 °C.
• Package & Mounting — 484‑FPBGA (23 × 23 mm) package in tray format, surface-mount mounting for PCB assembly.

Typical Applications

• Automotive Networking & Telematics — High I/O count and automotive qualification make this FPGA suitable for in-vehicle gateways, telematics modules and protocol bridging.
• High‑Speed Serial Interfaces — Built-in SERDES and support for industry protocols enable applications such as in-car Ethernet, camera links and CPRI front-ends.
• Signal Processing & Sensor Fusion — Embedded memory and sysDSP capabilities support filtering, aggregation and real-time processing for ADAS and sensor systems.
• Broadcast & Video Processing — Series-level SMPTE 3G support and high bandwidth I/O are appropriate for video transport, formatting and timing tasks.

Unique Advantages

• Automotive-Grade Confidence: AEC-Q100 qualification and −40 °C to 125 °C operating range reduce qualification burden for automotive designs.
• High Integration: 33,000 logic elements and approximately 1.36 Mbits of embedded RAM reduce external component count and simplify board-level design.
• Broad I/O and Serial Reach: 295 I/Os plus high-speed SERDES support enable dense connectivity and scalable serial link implementations.
• Flexible Packaging: 484‑FPBGA (23 × 23 mm) surface-mount package balances pin density with manufacturability for production PCBs.
• Design Reuse and Scalability: LA-ECP3 family architecture and series-level features support migration and reuse across related device densities and configurations.

Why Choose LAE3-35EA-6LFN484E?

The LAE3-35EA-6LFN484E positions itself as a robust, automotive-qualified FPGA offering a strong combination of logic density, embedded memory and high-speed serial capability. It is well suited for engineers developing vehicle electronics, high-speed data interfaces and embedded signal processing systems that require a programmable, integrable solution rated for automotive environments.

With extensive I/O, series-level SERDES and DSP features, and an industrial temperature range, this part provides a scalable platform that supports feature-rich system designs while reducing external components and simplifying integration.

Request a quote or submit an RFQ to get pricing and availability for the LAE3-35EA-6LFN484E and to discuss how it fits your next automotive or embedded design.