LAE3-35EA-6FN484E

The LAE3-35EA-6FN484E is a field programmable gate array (FPGA) IC from Lattice Semiconductor’s LA‑LatticeECP3 automotive family. It provides 33,000 logic elements, approximately 1.36 Mbits of embedded memory, and up to 295 user I/Os in a 484‑BBGA package, targeted for high‑reliability, automotive-grade applications.

Designed for system integration where deterministic I/O, DSP acceleration and high‑speed serial links are required, this device combines configurable logic, dedicated DSP resources and flexible I/O to support interfaces such as PCIe, Ethernet and other high‑speed serial protocols described in the family datasheet.

Key Features

• Logic Capacity 33,000 logic elements suitable for mid-density FPGA applications requiring significant programmable logic and glue‑logic integration.
• Embedded Memory Approximately 1.36 Mbits of on‑chip RAM for frame buffering, packet handling and local data storage.
• High I/O Count Up to 295 user I/Os to support broad peripheral connectivity and multiple parallel interfaces.
• Automotive Qualification AEC‑Q100 tested and qualified; operating temperature range −40°C to 125°C for automotive and other harsh environment deployments.
• Voltage and Packaging Core supply range 1.14 V to 1.26 V; supplied in a 484‑BBGA (484‑FPBGA 23×23) surface‑mount package.
• Embedded DSP (sysDSP) Cascadable DSP slice architecture described in the family datasheet for high‑performance multiply/accumulate operations and advanced MAC functionality.
• High‑Speed SERDES Embedded SERDES channels supporting data rates from 150 Mbps to 3.2 Gbps (family‑level capability) and up to four channels per device for protocols such as PCI Express, Ethernet, CPRI and SMPTE as noted in the datasheet.
• Flexible sysI/O and Memory Interfaces Programmable I/O buffer options and dedicated source‑synchronous support with DDR read/write leveling and DQS support for DDR memory interfaces (family features documented in the datasheet).
• System Configuration Flexible boot options including SPI boot flash interface, dual‑boot images and on‑chip oscillator for initialization (features described in the family datasheet).
• Reliability & Test IEEE 1149.1 and IEEE 1532 support and Soft Error Detect embedded macro as provided in the family documentation.

Typical Applications

• Automotive Systems In-vehicle processing and domain controllers where AEC‑Q100 qualification and wide operating temperature are required.
• High‑Speed Serial Connectivity Endpoints and bridges using SERDES‑based protocols such as PCI Express, Ethernet (1GbE/SGMII/XAUI) and CPRI, leveraging the device’s embedded SERDES channels.
• Signal Processing and DSP Real‑time DSP tasks and multiply/accumulate workloads using the sysDSP slice architecture for functions like sensor fusion or audio/video processing.
• Memory Interface and Buffering Local buffering and interface logic for DDR memory subsystems using on‑chip RAM and dedicated source‑synchronous I/O features described in the family datasheet.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 testing and −40°C to 125°C operating range support deployment in automotive environments and other harsh conditions.
• High I/O integration: Up to 295 user I/Os reduce external glue logic and simplify board routing for multi‑interface systems.
• On‑chip memory and DSP: Approximately 1.36 Mbits of embedded memory plus sysDSP resources enable local data processing and reduce external memory dependence.
• Configurable high‑speed links: Embedded SERDES channels with multi‑Gbps capability provide direct support for modern serial protocols, easing interface implementation.
• Robust configuration options: SPI boot, dual‑boot and on‑chip oscillator options give design flexibility for field updates and secure boot strategies described in the datasheet.

Why Choose LAE3-35EA-6FN484E?

The LAE3-35EA-6FN484E positions itself as a mid‑density, automotive‑qualified FPGA that integrates substantial logic capacity, a high I/O count and embedded memory in a compact 484‑BBGA package. Its core voltage and thermal range, combined with family‑documented SERDES and sysDSP capabilities, make it well suited for designers building automotive interfaces, high‑speed communications endpoints and embedded signal processing systems.

For teams needing a robust, qualified FPGA platform with flexible configuration and on‑chip processing resources, this device offers a balance of integration and reliability supported by the LA‑LatticeECP3 family documentation.

If you would like pricing or availability for the LAE3-35EA-6FN484E, request a quote or submit your requirements and our team will respond with the next steps for procurement and technical evaluation.