LAE3-17EA-6LFTN256E

The LAE3-17EA-6LFTN256E is a field programmable gate array (FPGA) from the LA‑LatticeECP3 automotive family. It delivers 17,000 logic elements in a surface-mount 256‑BGA (256‑FTBGA 17×17) package and is designed for embedded systems that require reconfigurable logic, on‑chip memory and robust I/O.

As part of the LA‑LatticeECP3 automotive family, the device combines reconfigurable SRAM logic with family-level features such as enhanced DSP slices, embedded SERDES and flexible sysI/O support. It is AEC‑Q100 qualified for automotive applications and is RoHS compliant.

Key Features

• Logic Capacity 17,000 logic elements for implementing RTL, glue logic and moderate-density hardware functions.
• Embedded Memory Approximately 0.72 Mbits of total on-chip RAM (716,800 bits) to support buffers, FIFOs and local data storage.
• Flexible I/O 133 user I/Os with programmable sysI/O buffer support to accommodate a range of parallel and differential interfaces.
• High‑speed Serial Links (family feature) LA‑LatticeECP3 family includes embedded SERDES capable of 150 Mbps to 3.2 Gbps and support for multiple serial protocols and up to four channels per device.
• Enhanced DSP (family feature) Cascadeable sysDSP slices in the family provide multiply‑accumulate resources and high‑precision ALU operations for signal processing tasks.
• Power and Supply Core voltage supply range 1.14 V to 1.26 V for the FPGA core.
• Package & Mounting 256‑BGA (256‑FTBGA 17×17) surface‑mount package suitable for compact board designs.
• Automotive Qualification & Temperature AEC‑Q100 qualification with an operating temperature range of −40 °C to 125 °C for automotive-grade deployment.
• Regulatory RoHS compliant.

Typical Applications

• Automotive Control & Subsystems AEC‑Q100 qualification and extended temperature range make this FPGA suitable for in-vehicle controllers, domain controllers and mixed-signal interfacing where reconfigurable logic and reliability are required.
• High‑speed Serial Communication Family SERDES capabilities support implementation of high‑speed links and protocol bridging in telematics and gateway modules.
• Signal Processing & Sensor Fusion On‑chip DSP resources and embedded RAM enable local filtering, aggregation and preprocessing of sensor data for advanced functions.
• Embedded System Glue Logic Logic elements and flexible I/O make the device well suited for bus bridging, protocol conversion and custom peripheral control.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 tested and an extended −40 °C to 125 °C operating range provide a validated footprint for automotive designs.
• Balanced integration: The combination of 17,000 logic elements, substantial on‑chip RAM and family DSP/serdes features reduces external component count and simplifies system architecture.
• Compact package: 256‑BGA (17×17 FTBGA) offers a small board footprint while providing extensive I/O connectivity.
• Deterministic supply window: A defined core voltage range (1.14 V–1.26 V) simplifies power delivery design for consistent operation.
• RoHS compliance: Meets environmental requirements for lead‑free manufacturing and deployment.

Why Choose LAE3-17EA-6LFTN256E?

The LAE3-17EA-6LFTN256E positions itself as an automotive-qualified, mid‑density FPGA option that balances logic capacity, embedded memory and I/O flexibility in a compact 256‑BGA package. It is suitable for engineers developing automotive subsystems, high‑speed interfaces and embedded signal processing tasks that benefit from reconfigurable logic and on‑chip resources.

As part of the LA‑LatticeECP3 family, it leverages proven family features—such as enhanced DSP slices and SERDES capabilities—while providing the qualification and thermal range required for vehicle-level deployment, making it a pragmatic choice for production designs that need scalability and robustness.

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