LAMXO3D-4300ZC-2BG256E

The LAMXO3D-4300ZC-2BG256E is a MachXO3D-family non-volatile FPGA offering a compact, reconfigurable logic fabric for system control, signal glue, and interface tasks. As a member of the MachXO3D device family, it includes family-level capabilities such as a dedicated embedded security block, flexible architecture, source-synchronous I/O support, and on-chip clocking features described in the MachXO3D data sheet.

This device targets applications that require reconfigurable logic with on-chip memory and a broad I/O count while meeting automotive-grade qualification. Key hardware parameters include 4,300 logic elements, approximately 0.09 Mbits of embedded RAM, 206 I/O, AEC‑Q100 qualification, and operation from -40 °C to 125 °C.

Key Features

• Core Logic 4,300 logic elements provide the programmable resources needed for glue logic, protocol bridging, and control functions.
• Embedded Memory Approximately 0.09 Mbits of on-chip RAM (94,208 total RAM bits) for FIFOs, small buffers, and local state storage.
• I/O Capacity 206 user I/O pins support diverse interfacing requirements and high pin-count system designs.
• Non‑volatile Reconfiguration Part of the MachXO3D family’s non-volatile, reconfigurable architecture with TransFR reconfiguration options described in the family data sheet.
• Embedded Security & Hardened IP Family-level documentation lists a dedicated embedded security block and hardened IP functions (for example, SPI, I²C and timers) to accelerate system integration.
• Clocking and On-chip Resources Flexible on-chip clocking including PLLs and an on-chip oscillator are included in the MachXO3D family architecture.
• Package and Mounting 256-LFBGA package (supplier device package: 256-CABGA, 14×14) in a surface-mount form factor for compact board layouts.
• Automotive Qualification & Temperature Range AEC‑Q100 qualified and rated for operation from -40 °C to 125 °C for automotive-grade environments.
• Supply Voltage Operates from 2.375 V to 3.465 V to accommodate a range of system power rails.
• RoHS Compliant Meets RoHS environmental compliance requirements.

Typical Applications

• Automotive Control Modules AEC‑Q100 qualification and a -40 °C to 125 °C operating range make this device suitable for automotive electronic control and interface tasks that require reconfigurable logic and multiple I/O.
• System Glue and Protocol Bridging 206 I/O and on-chip memory enable glue logic, protocol translation, and signal adaptation between subsystems.
• Sensor Aggregation and Preprocessing Embedded RAM and programmable logic are useful for collecting, buffering, and conditioning sensor data prior to communication or higher-level processing.
• Embedded Security and Configuration The MachXO3D family’s embedded security block supports device-level security and protected configuration use cases.

Unique Advantages

• Highly integrated reconfigurable logic: 4,300 logic elements and on-chip RAM reduce external components and simplify board design for control and glue functions.
• Automotive-grade reliability: AEC‑Q100 qualification and an extended -40 °C to 125 °C operating range support demanding vehicle environments.
• Large I/O count: 206 I/O pins provide flexibility for complex interconnect and multi-peripheral systems without additional I/O expanders.
• Non-volatile configuration: MachXO3D family non-volatile architecture preserves configuration across power cycles and enables rapid system bring-up.
• Compact, surface-mount package: 256-LFBGA (14×14 CABGA) offers a compact footprint for space-constrained designs while maintaining a high pin count.
• On-chip system resources: Family-level PLLs, oscillator, and hardened peripheral IP reduce need for external components and accelerate development.

Why Choose LAMXO3D-4300ZC-2BG256E?

The LAMXO3D-4300ZC-2BG256E combines a MachXO3D-family feature set with 4,300 logic elements, approximately 0.09 Mbits of embedded RAM, and 206 I/O in a compact 256-LFBGA package. Its AEC‑Q100 qualification and wide operating temperature range make it a practical choice for designs that require reconfigurable logic in automotive and harsh-environment applications.

This device is well suited to engineers needing a reliable, non-volatile FPGA for system glue, configuration, sensor interfacing, and embedded control functions, offering scalability through family-level resources and hardened IP described in the MachXO3D data sheet.

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