LAMXO3D-9400HE-5BG484E

The LAMXO3D-9400HE-5BG484E is a MachXO3D family field programmable gate array (FPGA) offered in a 484‑LFBGA package. It provides 9,400 logic elements and approximately 0.42 Mbits of embedded RAM, with a large I/O count for high‑density interfacing.

Designed and qualified for automotive applications with AEC‑Q100 qualification, the device targets compact, reconfigurable system functions that require non‑volatile FPGA capability, extensive I/O, and operation across a wide temperature range.

Key Features

• FPGA Core 9,400 logic elements supporting MachXO3D family architecture and flexible on‑chip resources.
• Configurable Logic Blocks (CLBs) Vendor data lists 1,175 CLBs enabling structured logic partitioning and implementation.
• Embedded Memory Approximately 0.42 Mbits of on‑chip RAM (442,368 total bits) for data buffering, state storage, and small memory structures.
• High I/O Count 383 dedicated I/O pins to support dense peripheral interfacing and multi‑bus designs.
• Embedded Security and Hardened IP MachXO3D family documentation includes a dedicated Embedded Security Block and hardened IP (example: I²C, SPI) for protected storage and standard serial interfaces.
• On‑chip Peripherals Family features referenced in documentation include an on‑chip oscillator, timers/counters, and pre‑engineered source‑synchronous I/O for common system tasks.
• Package & Mounting Surface‑mount 484‑LFBGA (supplier package: 484‑CABGA, 19×19 mm) for compact board integration.
• Power Core supply range from 1.14 V to 1.26 V to match low‑voltage system rails.
• Automotive Qualification & Temperature AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for automotive environments.
• Environmental Compliance RoHS compliant for restricted substance requirements.

Typical Applications

• Automotive Control Modules Automotive‑grade qualification and wide operating temperature make the device suitable for reconfigurable control functions in vehicle systems.
• High‑density I/O Bridging Large I/O count enables protocol bridging, bus interfacing, and board‑level glue logic where many signals must be routed or translated.
• Security and Authentication The documented Embedded Security Block and hardened serial IP make the device appropriate for secure feature implementations and protected key storage.
• Embedded Memory‑centric Logic On‑chip RAM supports buffering, FIFOs, and small memory structures for data path and control applications.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 qualification and a −40 °C to 125 °C operating range provide verified performance for automotive deployments.
• High integration in a compact package: 9,400 logic elements, ~0.42 Mbits RAM, and 383 I/O in a 484‑LFBGA reduce board area and component count.
• Dedicated security and hardened IP: Built‑in security block and hardened serial IP reduce development effort for secure and standard peripheral interfaces.
• Low‑voltage core support: Operates with a core supply between 1.14 V and 1.26 V to align with modern low‑voltage systems.
• RoHS compliant: Meets environmental restriction requirements for easier regulatory compliance.

Why Choose LAMXO3D-9400HE-5BG484E?

The LAMXO3D-9400HE-5BG484E combines a midsize logic fabric with substantial on‑chip memory and one of the industry’s larger I/O complements in a compact 484‑LFBGA package. Its MachXO3D family features—documented embedded security, hardened serial IP, and on‑chip oscillator—deliver reconfigurable system capability with reduced external components.

With AEC‑Q100 qualification, a wide operating temperature range, and RoHS compliance, this device is positioned for engineering teams developing automotive and harsh‑environment embedded systems that require secure, non‑volatile FPGA functionality and high‑density interfacing.

Request a quote or submit a purchase inquiry to get pricing and availability for the LAMXO3D-9400HE-5BG484E. Our team will respond with tailored ordering information and lead‑time details.