LAMXO3D-9400ZC-2BG484E
| Part Description |
LA-MachXO Field Programmable Gate Array (FPGA) IC 383 442368 9400 484-LFBGA |
|---|---|
| Quantity | 83 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CABGA (19x19) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-LFBGA | Number of I/O | 383 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | AEC-Q100 | Total RAM Bits | 442368 |
Overview of LAMXO3D-9400ZC-2BG484E – LA‑MachXO Field Programmable Gate Array (9400 logic elements, 383 I/O)
The LAMXO3D-9400ZC-2BG484E is a MachXO3D-family field programmable gate array (FPGA) optimized for embedded system control and interface applications. It provides 9,400 logic elements with approximately 0.44 Mbits of embedded RAM and up to 383 I/O in a compact 484‑LFBGA package.
Designed for automotive environments with AEC‑Q100 qualification, this device combines non-volatile reconfigurability and family-level features such as embedded security, hardened peripheral IP, on‑chip clocking, and pre‑engineered source‑synchronous I/O to address robust in-vehicle and embedded system requirements.
Key Features
- Core Logic 9,400 logic elements supporting flexible programmable logic for glue, control, and interface functions.
- Embedded Memory Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for local buffering and small data storage.
- I/O Capacity Up to 383 I/O pins to support a broad range of peripherals, sensors, and bus interfaces.
- Automotive Qualification Grade: Automotive with AEC‑Q100 qualification, and an operating temperature range of -40 °C to 125 °C for automotive-grade environments.
- Power and Voltage Flexible supply voltage range from 2.375 V to 3.465 V to accommodate common automotive and embedded power rails.
- Security and Hardened IP (Family Features) MachXO3D family includes an Embedded Security Block and hardened peripheral IP such as I²C and SPI cores, enabling secure boot/configuration and common serial interfaces.
- Clocking and Timing (Family Features) Flexible on-chip clocking, including PLLs and on‑chip oscillator, plus pre‑engineered source‑synchronous I/O for robust timing in interface designs.
- Non‑volatile, Reconfigurable Architecture (Family Features) MachXO3D devices support non‑volatile configuration and transFR reconfiguration modes for field updates without external volatile memory.
- Package and Mounting 484‑LFBGA (supplier package 484‑CABGA, 19 × 19) in a surface‑mount form factor suitable for modern PCB assembly.
- Regulatory RoHS compliant.
Typical Applications
- Automotive Body Electronics Useful for body‑control subsystems and vehicle network bridging where AEC‑Q100 qualification and wide temperature range are required.
- Sensor and Actuator Interfaces Provides abundant I/O and embedded logic for aggregating, conditioning, and routing sensor data in embedded control systems.
- Human‑Machine Interfaces (HMI) Drives custom interface logic, button scanning, and peripheral management for infotainment and instrument panel subsystems.
- System Glue and Protocol Bridging Implements protocol translation, bus interfacing, and small-scale control functions to reduce BOM and simplify board design.
Unique Advantages
- Automotive‑grade reliability: AEC‑Q100 qualification and -40 °C to 125 °C operation support deployment in demanding vehicle environments.
- Integrated, non‑volatile configuration: MachXO3D family non‑volatile architecture enables field reconfiguration without external configuration memory.
- High I/O density in a compact package: 383 I/Os in a 484‑LFBGA provide flexible interfacing while keeping PCB area minimized.
- Security and hardened peripherals: Embedded Security Block and hardened I²C/SPI IP reduce design effort for secure and common serial functions.
- Flexible clocking and timing: On‑chip oscillators and PLLs with source‑synchronous I/O options simplify timing design for high‑integrity interfaces.
Why Choose LAMXO3D-9400ZC-2BG484E?
This MachXO3D part balances moderate logic density with substantial I/O capability and embedded RAM, packaged for automotive use with AEC‑Q100 qualification and a wide operating temperature range. It is suited to designers who need a reconfigurable, non‑volatile FPGA platform for vehicle subsystems, interface bridging, and embedded control without adding external configuration memory.
Choosing this device provides a compact, automotive‑qualified programmable building block that aligns logic capacity, memory, I/O, and family-level security and IP features to reduce system complexity and support long-term in‑vehicle deployments.
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