LAMXO3D-9400ZC-2BG484E

IC FPGA AEC-Q100 384 I/O 484BGA
Part Description

LA-MachXO Field Programmable Gate Array (FPGA) IC 383 442368 9400 484-LFBGA

Quantity 83 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-CABGA (19x19)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-LFBGANumber of I/O383Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationAEC-Q100Total RAM Bits442368

Overview of LAMXO3D-9400ZC-2BG484E – LA‑MachXO Field Programmable Gate Array (9400 logic elements, 383 I/O)

The LAMXO3D-9400ZC-2BG484E is a MachXO3D-family field programmable gate array (FPGA) optimized for embedded system control and interface applications. It provides 9,400 logic elements with approximately 0.44 Mbits of embedded RAM and up to 383 I/O in a compact 484‑LFBGA package.

Designed for automotive environments with AEC‑Q100 qualification, this device combines non-volatile reconfigurability and family-level features such as embedded security, hardened peripheral IP, on‑chip clocking, and pre‑engineered source‑synchronous I/O to address robust in-vehicle and embedded system requirements.

Key Features

  • Core Logic 9,400 logic elements supporting flexible programmable logic for glue, control, and interface functions.
  • Embedded Memory Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for local buffering and small data storage.
  • I/O Capacity Up to 383 I/O pins to support a broad range of peripherals, sensors, and bus interfaces.
  • Automotive Qualification Grade: Automotive with AEC‑Q100 qualification, and an operating temperature range of -40 °C to 125 °C for automotive-grade environments.
  • Power and Voltage Flexible supply voltage range from 2.375 V to 3.465 V to accommodate common automotive and embedded power rails.
  • Security and Hardened IP (Family Features) MachXO3D family includes an Embedded Security Block and hardened peripheral IP such as I²C and SPI cores, enabling secure boot/configuration and common serial interfaces.
  • Clocking and Timing (Family Features) Flexible on-chip clocking, including PLLs and on‑chip oscillator, plus pre‑engineered source‑synchronous I/O for robust timing in interface designs.
  • Non‑volatile, Reconfigurable Architecture (Family Features) MachXO3D devices support non‑volatile configuration and transFR reconfiguration modes for field updates without external volatile memory.
  • Package and Mounting 484‑LFBGA (supplier package 484‑CABGA, 19 × 19) in a surface‑mount form factor suitable for modern PCB assembly.
  • Regulatory RoHS compliant.

Typical Applications

  • Automotive Body Electronics Useful for body‑control subsystems and vehicle network bridging where AEC‑Q100 qualification and wide temperature range are required.
  • Sensor and Actuator Interfaces Provides abundant I/O and embedded logic for aggregating, conditioning, and routing sensor data in embedded control systems.
  • Human‑Machine Interfaces (HMI) Drives custom interface logic, button scanning, and peripheral management for infotainment and instrument panel subsystems.
  • System Glue and Protocol Bridging Implements protocol translation, bus interfacing, and small-scale control functions to reduce BOM and simplify board design.

Unique Advantages

  • Automotive‑grade reliability: AEC‑Q100 qualification and -40 °C to 125 °C operation support deployment in demanding vehicle environments.
  • Integrated, non‑volatile configuration: MachXO3D family non‑volatile architecture enables field reconfiguration without external configuration memory.
  • High I/O density in a compact package: 383 I/Os in a 484‑LFBGA provide flexible interfacing while keeping PCB area minimized.
  • Security and hardened peripherals: Embedded Security Block and hardened I²C/SPI IP reduce design effort for secure and common serial functions.
  • Flexible clocking and timing: On‑chip oscillators and PLLs with source‑synchronous I/O options simplify timing design for high‑integrity interfaces.

Why Choose LAMXO3D-9400ZC-2BG484E?

This MachXO3D part balances moderate logic density with substantial I/O capability and embedded RAM, packaged for automotive use with AEC‑Q100 qualification and a wide operating temperature range. It is suited to designers who need a reconfigurable, non‑volatile FPGA platform for vehicle subsystems, interface bridging, and embedded control without adding external configuration memory.

Choosing this device provides a compact, automotive‑qualified programmable building block that aligns logic capacity, memory, I/O, and family-level security and IP features to reduce system complexity and support long-term in‑vehicle deployments.

Request a quote or submit a sales inquiry to obtain pricing, availability, and ordering information for the LAMXO3D-9400ZC-2BG484E.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up