LAMXO3LF-2100C-5BG256E

The LAMXO3LF-2100C-5BG256E is a MachXO3 family FPGA offering non-volatile, multi-time programmable logic in a compact 256-LFBGA package. It provides 2,100 logic elements, approximately 0.076 Mbits of embedded memory, and up to 206 I/O pins—designed for designs that require flexible on-chip logic, configurable I/O, and system-level integration.

Qualified to AEC-Q100 and specified as Automotive grade, this device supports operation across a wide voltage and temperature range (2.375 V to 3.465 V, –40 °C to 125 °C), enabling deployment where extended environmental and qualification margins are required.

Key Features

• Logic Capacity  Provides 2,100 logic elements for implementing glue logic, control state machines, and small to medium FPGA functions.
• Embedded Memory  Approximately 0.076 Mbits of on-chip RAM useful for FIFOs, small buffers, and local data storage; supports single, dual and FIFO memory modes as described in the MachXO3 family architecture.
• Flexible I/O  Up to 206 I/O pins with pre-engineered source-synchronous I/O and a high-performance, flexible I/O buffer architecture for varied interface requirements.
• Clocking and Timing  On-chip clock resources including PLLs and flexible clock distribution to support system timing and source-synchronous interfaces.
• Hardened IP and System Functions  Includes embedded hardened IP such as I²C and SPI cores, timer/counter functionality, user flash memory (UFM), and other system-level support blocks noted in the MachXO3 family data sheet.
• Non-volatile Configuration & Reconfiguration  Multi-time programmable non-volatile configuration with TransFR reconfiguration features for system update flexibility.
• Power and Modes  Standby and power-saving options are provided to help manage system-level power in deployed applications.
• Package & Mounting  256-LFBGA (supplier package 256-CABGA, 14×14) in a surface-mount form factor suitable for compact board layouts.
• Automotive Qualification  Grade: Automotive with AEC-Q100 qualification and an operating temperature range of –40 °C to 125 °C, supporting automotive electronics deployment requirements.
• Compliance  RoHS-compliant manufacturing.

Typical Applications

• Automotive Systems  AEC-Q100 qualification and extended temperature operation make this device suitable for control and interface functions in automotive electronics.
• Interface Bridging and Glue Logic  Up to 206 I/O pins and flexible I/O architecture enable implementation of protocol translation, bus interfacing, and custom glue logic between subsystems.
• Embedded Control and Sequencing  Non-volatile programmable fabric combined with on-chip timers and hardened IP allows compact implementation of embedded control, state machines, and sequencing tasks.
• Memory Buffering and FIFO Operations  Built-in RAM with FIFO support and flexible memory modes provides local buffering for data flow management and small storage tasks.

Unique Advantages

• Qualified for Automotive Use:  AEC-Q100 qualification and Automotive grade designation deliver the traceable qualification required for automotive-tier designs.
• Compact, Surface-Mount Package:  256-LFBGA (256-CABGA, 14×14) enables high-density board designs without sacrificing I/O count or functionality.
• Integrated System Functions:  Hardened I²C, SPI, timer/counter cores and user flash memory reduce external component count and simplify integration.
• Flexible On-Chip Resources:  PLLs, flexible clock distribution, and configurable memory/FIFO modes support a wide range of timing and buffering needs within one device.
• Non-volatile, Reprogrammable Fabric:  Multi-time programmable configuration and reconfiguration features allow field updates and iterative development without external configuration memory.
• Wide Voltage and Temperature Range:  2.375 V to 3.465 V operating range and –40 °C to 125 °C temperature range accommodate varied power domains and harsh environments.

Why Choose LAMXO3LF-2100C-5BG256E?

The LAMXO3LF-2100C-5BG256E combines the MachXO3 family’s system-level features with Automotive-grade qualification to deliver a compact, reprogrammable solution for control, interface, and buffering tasks. Its balance of 2,100 logic elements, embedded memory, and up to 206 I/Os makes it well suited to engineers needing flexible on-chip logic with integrated system IP and robust environmental margins.

Choose this device when you require a reprogrammable, non-volatile FPGA with automotive qualification, comprehensive on-chip peripherals, and a surface-mount 256-LFBGA package for space-constrained applications.

Request a quote or submit an inquiry to obtain pricing and availability for the LAMXO3LF-2100C-5BG256E. Our team can provide lead-time and order details to support your design and procurement planning.