LAMXO3LF-2100E-5BG256E
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 75776 2100 256-LFBGA |
|---|---|
| Quantity | 484 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 263 | Number of Logic Elements/Cells | 2100 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | AEC-Q100 | Total RAM Bits | 75776 |
Overview of LAMXO3LF-2100E-5BG256E – MachXO3 FPGA, 2,100 logic elements, 256-LFBGA
The LAMXO3LF-2100E-5BG256E is a MachXO3 family field programmable gate array (FPGA) in a 256-LFBGA package. It combines a non-volatile, multi-time programmable FPGA fabric with flexible I/O and embedded system functions to support control, interfacing and system integration tasks in designs requiring automotive-grade qualification.
With 2,100 logic elements, 206 user I/Os and approximately 0.076 Mbits of embedded memory, this device targets applications that need compact programmable logic, broad I/O connectivity and robust operating conditions.
Key Features
- Core Logic — 2,100 logic elements, supporting the implementation of custom glue logic, protocol adaptation and small-to-medium digital functions.
- Embedded Memory — 75,776 bits of on-chip RAM (approximately 0.076 Mbits) for FIFOs, small data buffers and state storage.
- I/O and Interfaces — 206 user I/O pins paired with high-performance, flexible I/O buffers and pre‑engineered source-synchronous options as documented in the MachXO3 family datasheet.
- Clocking and Configuration — Flexible on-chip clocking (including PLLs) and TransFR reconfiguration capability for in-system updates and clock management.
- Hardened System IP — Embedded hardened IP such as I²C and SPI cores, timers/counters and user flash memory (UFM) to simplify common system functions.
- Non-volatile, Multi-time Programmable — On-chip non-volatile configuration supports multiple device reprogramming cycles without external configuration memory.
- Package and Power — 256‑LFBGA (256‑CABGA, 14 × 14) surface-mount package with a recommended supply voltage range of 1.14 V to 1.26 V.
- Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for use in temperature-demanding environments.
- Reliability and Compliance — RoHS‑compliant manufacturing and family-level features for system-level testability and power-on-reset management as described in the datasheet.
Typical Applications
- Automotive Control Modules — Automotive-grade qualification and wide temperature range make this device suitable for body electronics, gateway functions and vehicle control interfaces.
- Sensor and Actuator Interfaces — High I/O count and embedded memory support aggregation, conditioning and protocol bridging for distributed sensors and actuators.
- System Glue Logic — Implement protocol translation, timing adaptation and custom sequencing between subsystems to reduce BOM and simplify board-level design.
- Embedded Configuration and Supervisory Functions — Use on-chip UFM, SPI/I²C hardened IP and reconfiguration features for device management, boot sequencing and field updates.
Unique Advantages
- Automotive-Qualified FPGA: AEC‑Q100 qualification and −40 °C to 125 °C operating range enable deployment in temperature-demanding automotive environments.
- Integrated Non‑volatile Configuration: Multi-time programmable, non-volatile configuration removes the need for external configuration flash and simplifies system power-up behavior.
- High I/O Density: 206 user I/Os provide extensive connectivity for sensors, actuators, interfaces and board-level signal conditioning without extra components.
- Embedded System IP: Hardened I²C and SPI cores plus UFM and timers reduce software overhead and accelerate system bring-up.
- Compact, Surface‑Mount Package: 256‑LFBGA (14 × 14) package balances PCB area and pin count for space-constrained designs.
- Fine-Grained Power and Clock Control: Flexible on-chip clocking (including PLLs) and power-saving modes support tailored performance and power profiles.
Why Choose LAMXO3LF-2100E-5BG256E?
This MachXO3 device combines a compact, automotive‑qualified FPGA fabric with wide I/O, embedded memory and hardened system IP to address a range of control, interfacing and supervisory functions. Its non‑volatile, multi‑time programmable configuration and on-chip system features reduce external component count and accelerate integration for designs where reliability and temperature tolerance matter.
Choose the LAMXO3LF-2100E-5BG256E when you need a verified, automotive‑grade programmable logic device that simplifies system architecture, supports extensive I/O connectivity and offers on-chip resources for configuration and peripheral management.
Request a quote or submit an inquiry to receive pricing and availability for the LAMXO3LF-2100E-5BG256E. Our team will provide the information you need to evaluate this device for your designs.