LAMXO3LF-2100E-5BG256E

IC FPGA AEC-Q100 206 I/O 256BGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 75776 2100 256-LFBGA

Quantity 484 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs263Number of Logic Elements/Cells2100
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationAEC-Q100Total RAM Bits75776

Overview of LAMXO3LF-2100E-5BG256E – MachXO3 FPGA, 2,100 logic elements, 256-LFBGA

The LAMXO3LF-2100E-5BG256E is a MachXO3 family field programmable gate array (FPGA) in a 256-LFBGA package. It combines a non-volatile, multi-time programmable FPGA fabric with flexible I/O and embedded system functions to support control, interfacing and system integration tasks in designs requiring automotive-grade qualification.

With 2,100 logic elements, 206 user I/Os and approximately 0.076 Mbits of embedded memory, this device targets applications that need compact programmable logic, broad I/O connectivity and robust operating conditions.

Key Features

  • Core Logic — 2,100 logic elements, supporting the implementation of custom glue logic, protocol adaptation and small-to-medium digital functions.
  • Embedded Memory — 75,776 bits of on-chip RAM (approximately 0.076 Mbits) for FIFOs, small data buffers and state storage.
  • I/O and Interfaces — 206 user I/O pins paired with high-performance, flexible I/O buffers and pre‑engineered source-synchronous options as documented in the MachXO3 family datasheet.
  • Clocking and Configuration — Flexible on-chip clocking (including PLLs) and TransFR reconfiguration capability for in-system updates and clock management.
  • Hardened System IP — Embedded hardened IP such as I²C and SPI cores, timers/counters and user flash memory (UFM) to simplify common system functions.
  • Non-volatile, Multi-time Programmable — On-chip non-volatile configuration supports multiple device reprogramming cycles without external configuration memory.
  • Package and Power — 256‑LFBGA (256‑CABGA, 14 × 14) surface-mount package with a recommended supply voltage range of 1.14 V to 1.26 V.
  • Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for use in temperature-demanding environments.
  • Reliability and Compliance — RoHS‑compliant manufacturing and family-level features for system-level testability and power-on-reset management as described in the datasheet.

Typical Applications

  • Automotive Control Modules — Automotive-grade qualification and wide temperature range make this device suitable for body electronics, gateway functions and vehicle control interfaces.
  • Sensor and Actuator Interfaces — High I/O count and embedded memory support aggregation, conditioning and protocol bridging for distributed sensors and actuators.
  • System Glue Logic — Implement protocol translation, timing adaptation and custom sequencing between subsystems to reduce BOM and simplify board-level design.
  • Embedded Configuration and Supervisory Functions — Use on-chip UFM, SPI/I²C hardened IP and reconfiguration features for device management, boot sequencing and field updates.

Unique Advantages

  • Automotive-Qualified FPGA: AEC‑Q100 qualification and −40 °C to 125 °C operating range enable deployment in temperature-demanding automotive environments.
  • Integrated Non‑volatile Configuration: Multi-time programmable, non-volatile configuration removes the need for external configuration flash and simplifies system power-up behavior.
  • High I/O Density: 206 user I/Os provide extensive connectivity for sensors, actuators, interfaces and board-level signal conditioning without extra components.
  • Embedded System IP: Hardened I²C and SPI cores plus UFM and timers reduce software overhead and accelerate system bring-up.
  • Compact, Surface‑Mount Package: 256‑LFBGA (14 × 14) package balances PCB area and pin count for space-constrained designs.
  • Fine-Grained Power and Clock Control: Flexible on-chip clocking (including PLLs) and power-saving modes support tailored performance and power profiles.

Why Choose LAMXO3LF-2100E-5BG256E?

This MachXO3 device combines a compact, automotive‑qualified FPGA fabric with wide I/O, embedded memory and hardened system IP to address a range of control, interfacing and supervisory functions. Its non‑volatile, multi‑time programmable configuration and on-chip system features reduce external component count and accelerate integration for designs where reliability and temperature tolerance matter.

Choose the LAMXO3LF-2100E-5BG256E when you need a verified, automotive‑grade programmable logic device that simplifies system architecture, supports extensive I/O connectivity and offers on-chip resources for configuration and peripheral management.

Request a quote or submit an inquiry to receive pricing and availability for the LAMXO3LF-2100E-5BG256E. Our team will provide the information you need to evaluate this device for your designs.

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