LAMXO3LF-4300C-5BG324E

The LAMXO3LF-4300C-5BG324E is a MachXO3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, delivering 4,300 logic elements and 268 general-purpose I/Os in a 324‑LFBGA (15×15) surface‑mount package. The device includes approximately 0.094 Mbits of embedded RAM and on-chip system features described in the MachXO3 family data sheet.

Engineered for demanding environments, this part is Automotive grade with AEC‑Q100 qualification, supports a supply voltage range of 2.375 V to 3.465 V, and operates across −40 °C to 125 °C. It targets designs that require dense I/O, reconfigurable logic, and system-level integration within constrained board space.

Key Features

• Core Density — 4,300 logic elements providing the programmable logic capacity required for glue logic, control state machines, and moderate FPGA functions.
• Embedded Memory — Approximately 0.094 Mbits of on‑chip RAM and dedicated sysMEM block resources for FIFO and dual-port memory configurations, as described in the MachXO3 family documentation.
• Extensive I/O — 268 I/O pins supported by programmable I/O cells, with pre‑engineered source‑synchronous I/O and flexible I/O buffer options for diverse interface requirements.
• Clocking and Timing — Flexible on‑chip clocking architecture including sysCLOCK Phase Locked Loops (PLLs) for system clock management and timing control.
• Embedded Hardened IP — Family documentation lists hardened peripheral IP such as I²C and SPI cores plus timer/counter resources to offload common control functions.
• Non‑volatile Configuration — MachXO3 family features non‑volatile, multi‑time programmable configuration and TransFR reconfiguration capability for field updates and system flexibility.
• Package & Mounting — 324‑LFBGA (supplier device package: 324‑CABGA, 15×15) in a surface‑mount form factor to support compact PCB designs.
• Automotive Qualification & Environmental — Automotive grade with AEC‑Q100 qualification, RoHS compliant, and specified operating range of −40 °C to 125 °C for automotive and harsh‑environment applications.
• Power — Supported supply voltage range: 2.375 V to 3.465 V; family documentation also details standby and power‑saving options for system power management.
• Board Testability & Reliability — MachXO3 family supports IEEE 1149.1 boundary scan testability and includes features for configuration, testing, and hot‑socketing behavior as described in the data sheet.

Typical Applications

• Automotive electronic modules — AEC‑Q100 qualification and −40 °C to 125 °C rating make the device suitable for automotive control and interface functions where reconfigurability and reliability are required.
• I/O‑dense interface bridging — With 268 I/Os and flexible I/O buffering, the part is well suited for board‑level protocol bridging, signal aggregation, and interface adaptation tasks.
• Embedded control and system glue logic — 4,300 logic elements coupled with embedded IP (I²C, SPI, timers) enable implementation of control state machines, peripheral management, and board glue logic.
• Configuration and in‑system updates — Non‑volatile, multi‑time programmable configuration and TransFR reconfiguration support field updates and evolving system requirements.

Unique Advantages

• Highly integrated I/O and logic — 268 I/Os and 4,300 logic elements reduce the need for external components, simplifying PCB design and lowering BOM complexity.
• Automotive‑grade reliability — AEC‑Q100 qualification and extended temperature specification support deployment in automotive and other harsh‑environment applications.
• Flexible system timing — On‑chip PLLs and the MachXO3 clock architecture provide the timing resources needed for source‑synchronous interfaces and complex timing domains.
• On‑chip peripheral IP — Hardened I²C and SPI cores plus timer/counter functions offload common tasks from the fabric and speed development.
• Non‑volatile reconfiguration — Multi‑time programmable, non‑volatile configuration enables reliable startup behavior and field reprogramming without external configuration memory.
• Compact, manufacturable package — 324‑LFBGA (15×15) surface‑mount package supports space‑constrained designs and standard assembly workflows.

Why Choose LAMXO3LF-4300C-5BG324E?

This MachXO3 device balances moderate programmable logic capacity with extensive I/O and on‑chip peripherals, packaged for compact board layouts. Its AEC‑Q100 qualification, wide operating temperature range, and controlled supply voltage window make it a pragmatic choice for designs that require reconfigurable logic in automotive or other demanding environments.

Designers looking for a reprogrammable, non‑volatile FPGA with built‑in peripheral IP, flexible clocking, and broad I/O resources will find the LAMXO3LF‑4300C‑5BG324E well suited to system control, interface bridging, and embedded control applications where reliability and board space are key considerations.

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