LAV-AT-200E-1LBG484I

IC FPGA AVANT 196KLC 484BGA
Part Description

Avant-E Field Programmable Gate Array (FPGA) IC 230 1740800 196000 484-BFBGA, FCBGA

Quantity 392 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BFBGA, FCBGANumber of I/O230Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells196000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-200E-1LBG484I – Avant‑E FPGA, 196,000 logic elements, 484‑FCBGA

The LAV-AT-200E-1LBG484I is an Avant‑E Field Programmable Gate Array (FPGA) IC in a 484‑FBGA / 484‑FCBGA (19×19) package intended for industrial applications. It integrates a large programmable fabric with approximately 1.74 Mbits of embedded memory and up to 230 I/O to address complex logic, memory buffering, and high‑density I/O requirements.

Documentation for the Avant platform specifies on‑chip system resources such as PLLs, internal oscillators, hardened PCIe building blocks, and a wide range of sysI/O electrical standards — enabling designers to implement high‑speed interfaces and system timing functions within the FPGA fabric.

Key Features

  • Programmable Logic — 196,000 logic elements to implement complex digital functions and custom hardware accelerators.
  • Embedded Memory — Approximately 1.74 Mbits of on‑chip RAM for buffering, FIFOs, and state storage.
  • I/O Density — 230 user I/O pins to support multiple parallel interfaces and mixed I/O routing.
  • Package & Mounting — 484‑FBGA / 484‑FCBGA (19×19) ball‑grid array, surface mount package suitable for compact PCB designs.
  • Industrial Temperature Range — Rated for operation from −40°C to 100°C for extended environmental coverage.
  • Voltage Supply — Specified supply voltage of 820 mV as listed in product data.
  • Platform Features (per Avant datasheet) — Includes system PLLs, internal oscillators, on‑chip programmable termination, ESD performance data, and hardened PCIe building blocks with documented characteristics at multiple link rates.
  • sysI/O Standards (per Avant datasheet) — Device documentation covers differential and single‑ended I/O standards including LVDS, SubLVDS, SLVS, Soft MIPI D‑PHY, and other sysI/O electrical characteristics.
  • Regulatory — RoHS compliant.

Typical Applications

  • High‑density I/O Gateways — Use the 230 I/Os and high logic capacity to aggregate and bridge multiple parallel interfaces in industrial communication modules.
  • Embedded Compute and Acceleration — Implement custom logic and data‑path accelerators using the 196,000 logic elements and on‑chip RAM for buffering and stateful processing.
  • High‑speed Interface Integration — Leverage documented hardened PCIe building blocks and sysI/O support to integrate high‑speed serial and differential links.
  • Industrial Control Systems — Deploy in systems requiring industrial temperature operation (−40°C to 100°C) and surface‑mount BGA packaging for compact boards.

Unique Advantages

  • Large Programmable Fabric: 196,000 logic elements provide headroom for complex finite state machines, protocol stacks, and custom datapaths.
  • Significant On‑Chip Memory: Approximately 1.74 Mbits of embedded RAM reduces external memory dependence for many buffering and streaming tasks.
  • Broad I/O Capability: 230 I/Os support dense connectivity and mixed‑signal front‑end integration without extensive external multiplexing.
  • Platform‑level Documentation: The Avant datasheet includes system timing resources (PLLs, oscillators), I/O electrical specifications, and hardened PCIe characteristics to support robust interface implementations.
  • Industrial‑grade Operation: Specified for −40°C to 100°C operation to meet extended temperature requirements common in industrial deployments.
  • Compact BGA Packaging: 484‑ball FCBGA/FBGA (19×19) enables high density on small PCBs while remaining surface‑mount compatible.

Why Choose LAV-AT-200E-1LBG484I?

The LAV-AT-200E-1LBG484I positions the Avant‑E platform’s capabilities into a high‑capacity FPGA suitable for industrial designs that require a combination of substantial logic resources, embedded memory, and broad I/O. Its documented platform features — including PLLs, internal oscillators, sysI/O electrical characterization, and hardened PCIe building blocks — support integration of high‑speed interfaces and system timing solutions directly in the FPGA fabric.

This device is well suited for design teams needing a scalable, industrial‑rated programmable device to consolidate logic, interface bridging, and accelerated data‑path functions while benefiting from Avant platform specifications and documented electrical and timing resources.

Request a quote or submit a request for pricing and availability to evaluate LAV-AT-200E-1LBG484I for your next design.

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