LAV-AT-200E-1LFG676C
| Part Description |
Avant-E Field Programmable Gate Array (FPGA) IC 312 1740800 196000 676-BBGA, FCBGA |
|---|---|
| Quantity | 1,046 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 312 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 196000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-200E-1LFG676C – Avant-E Field Programmable Gate Array (FPGA), 196k Logic Elements
The LAV-AT-200E-1LFG676C is an Avant-E field programmable gate array (FPGA) from Lattice Semiconductor Corporation supplied in a 676-ball FCBGA (27 × 27 mm) package for surface-mount assembly. This commercial-grade device provides extensive programmable fabric with 196,000 logic elements and approximately 1.74 Mbits of embedded RAM, making it suitable for mid-to-high density FPGA applications requiring a balance of logic capacity, on-chip memory and flexible I/O.
Architected for system integration, the Avant platform datasheet documents on-chip features including advanced sysI/O capabilities, clocking (PLLs and internal oscillators), programmable termination and hardened PCIe characteristics, supporting a range of interface and timing requirements for communication, control and processing tasks.
Key Features
- Core Capacity — 196,000 logic elements for implementing complex programmable logic, state machines and custom accelerators.
- Embedded Memory — Approximately 1.74 Mbits of on-chip RAM to support buffering, FIFOs and local data storage.
- I/O — 312 user I/O pins to interface with peripherals, sensors and high-speed I/O subsystems.
- Package & Mounting — 676-BBGA (FCBGA) supplier device package, 27 × 27 mm, surface-mount for compact board-level integration.
- Power — Specified supply voltage of 820 mV (as listed in product data).
- Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Platform-Level Characteristics (per datasheet) — Includes DC and switching characterization, on-chip programmable termination, ESD performance data, sysI/O timing and differential interface support, internal oscillators and PLL characteristics.
- Hardened Interface Support (per datasheet) — Datasheet documents hardened PCIe characteristics covering 2.5, 5, 8 and 16 Gbps operation for designs that require PCIe implementation.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Edge Compute and Acceleration — Implement custom data-paths, packet processing or hardware acceleration using the device’s 196k logic elements and embedded memory.
- High-Speed I/O Subsystems — Use the 312 I/Os and platform sysI/O capabilities to interface with high-speed peripherals and communication links.
- Communication and Networking — Leverage documented PCIe characteristics and programmable I/O for network adapters, protocol bridging or interface aggregation.
- Embedded Control and Signal Processing — Use on-chip RAM and logic resources for deterministic control loops, signal conditioning and protocol handling in commercial electronics.
Unique Advantages
- Substantial Logic Density: 196,000 logic elements provide room for complex designs and multi-function integration on a single device.
- Integrated Memory Resources: Approximately 1.74 Mbits of embedded RAM reduce dependence on external memory for buffering and on-chip data storage.
- Flexible I/O Count: 312 I/Os enable broad peripheral connectivity and multi-channel interfaces without external multiplexing.
- Platform Documentation: Comprehensive datasheet coverage of DC/switching characteristics, programmable termination, PLLs, oscillators and sysI/O helps speed design validation and integration.
- PCIe-Ready (Per Datasheet): Datasheet-level hardened PCIe characteristics covering several link rates support integration into PCIe-based systems when required by the design.
- Surface-Mount, Compact Package: 676-FCBGA (27 × 27 mm) enables high-density board layouts while supporting surface-mount manufacturing processes.
Why Choose LAV-AT-200E-1LFG676C?
The LAV-AT-200E-1LFG676C positions itself as a versatile commercial-grade FPGA offering a balance of logic capacity, embedded RAM and flexible I/O in a compact FCBGA package. It is appropriate for designers who need significant programmable resources and documented platform-level characteristics (clocking, sysI/O, termination and PCIe support) to accelerate time-to-market and simplify system integration.
For teams building mid-to-high density programmable systems—ranging from communication interfaces to embedded accelerators—this Avant-E device delivers the combination of on-chip memory, I/O count and platform documentation that supports scalable, robust designs while remaining RoHS compliant for environmental requirements.
Request a quote or submit an inquiry to receive pricing and availability for the LAV-AT-200E-1LFG676C. Our team can provide ordering information, lead times and technical resources to support your evaluation and integration activities.

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