LAV-AT-200E-1LFG676C

IC FPGA AVANT 196KLC 676BGA
Part Description

Avant-E Field Programmable Gate Array (FPGA) IC 312 1740800 196000 676-BBGA, FCBGA

Quantity 1,046 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O312Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells196000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-200E-1LFG676C – Avant-E Field Programmable Gate Array (FPGA), 196k Logic Elements

The LAV-AT-200E-1LFG676C is an Avant-E field programmable gate array (FPGA) from Lattice Semiconductor Corporation supplied in a 676-ball FCBGA (27 × 27 mm) package for surface-mount assembly. This commercial-grade device provides extensive programmable fabric with 196,000 logic elements and approximately 1.74 Mbits of embedded RAM, making it suitable for mid-to-high density FPGA applications requiring a balance of logic capacity, on-chip memory and flexible I/O.

Architected for system integration, the Avant platform datasheet documents on-chip features including advanced sysI/O capabilities, clocking (PLLs and internal oscillators), programmable termination and hardened PCIe characteristics, supporting a range of interface and timing requirements for communication, control and processing tasks.

Key Features

  • Core Capacity — 196,000 logic elements for implementing complex programmable logic, state machines and custom accelerators.
  • Embedded Memory — Approximately 1.74 Mbits of on-chip RAM to support buffering, FIFOs and local data storage.
  • I/O — 312 user I/O pins to interface with peripherals, sensors and high-speed I/O subsystems.
  • Package & Mounting — 676-BBGA (FCBGA) supplier device package, 27 × 27 mm, surface-mount for compact board-level integration.
  • Power — Specified supply voltage of 820 mV (as listed in product data).
  • Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Platform-Level Characteristics (per datasheet) — Includes DC and switching characterization, on-chip programmable termination, ESD performance data, sysI/O timing and differential interface support, internal oscillators and PLL characteristics.
  • Hardened Interface Support (per datasheet) — Datasheet documents hardened PCIe characteristics covering 2.5, 5, 8 and 16 Gbps operation for designs that require PCIe implementation.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Edge Compute and Acceleration — Implement custom data-paths, packet processing or hardware acceleration using the device’s 196k logic elements and embedded memory.
  • High-Speed I/O Subsystems — Use the 312 I/Os and platform sysI/O capabilities to interface with high-speed peripherals and communication links.
  • Communication and Networking — Leverage documented PCIe characteristics and programmable I/O for network adapters, protocol bridging or interface aggregation.
  • Embedded Control and Signal Processing — Use on-chip RAM and logic resources for deterministic control loops, signal conditioning and protocol handling in commercial electronics.

Unique Advantages

  • Substantial Logic Density: 196,000 logic elements provide room for complex designs and multi-function integration on a single device.
  • Integrated Memory Resources: Approximately 1.74 Mbits of embedded RAM reduce dependence on external memory for buffering and on-chip data storage.
  • Flexible I/O Count: 312 I/Os enable broad peripheral connectivity and multi-channel interfaces without external multiplexing.
  • Platform Documentation: Comprehensive datasheet coverage of DC/switching characteristics, programmable termination, PLLs, oscillators and sysI/O helps speed design validation and integration.
  • PCIe-Ready (Per Datasheet): Datasheet-level hardened PCIe characteristics covering several link rates support integration into PCIe-based systems when required by the design.
  • Surface-Mount, Compact Package: 676-FCBGA (27 × 27 mm) enables high-density board layouts while supporting surface-mount manufacturing processes.

Why Choose LAV-AT-200E-1LFG676C?

The LAV-AT-200E-1LFG676C positions itself as a versatile commercial-grade FPGA offering a balance of logic capacity, embedded RAM and flexible I/O in a compact FCBGA package. It is appropriate for designers who need significant programmable resources and documented platform-level characteristics (clocking, sysI/O, termination and PCIe support) to accelerate time-to-market and simplify system integration.

For teams building mid-to-high density programmable systems—ranging from communication interfaces to embedded accelerators—this Avant-E device delivers the combination of on-chip memory, I/O count and platform documentation that supports scalable, robust designs while remaining RoHS compliant for environmental requirements.

Request a quote or submit an inquiry to receive pricing and availability for the LAV-AT-200E-1LFG676C. Our team can provide ordering information, lead times and technical resources to support your evaluation and integration activities.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up