LAV-AT-200E-2LBG484C

IC FPGA AVANT 196KLC 484BGA
Part Description

Avant-E Field Programmable Gate Array (FPGA) IC 230 1740800 196000 484-BFBGA, FCBGA

Quantity 1,064 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BFBGA, FCBGANumber of I/O230Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells196000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-200E-2LBG484C – Avant‑E FPGA, 196,000 logic elements, 1.74 Mbits RAM, 230 I/Os

The LAV-AT-200E-2LBG484C is an Avant‑E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, delivered in a 484‑BFBGA / 484‑FCBGA (19×19) surface‑mount package. It provides a high-density programmable fabric with a large I/O footprint and on‑chip memory to implement complex digital functions.

Designed for commercial applications, the device combines 196,000 logic elements with approximately 1.74 Mbits of embedded memory and 230 user I/Os, enabling platform designers to consolidate logic, buffering and I/O functions in a compact package while operating from a core supply of 820 mV and across a 0 °C to 85 °C temperature range.

Key Features

  • Core Capacity  196,000 logic elements for implementing large, flexible digital designs and complex control logic.
  • Embedded Memory  Approximately 1.74 Mbits of on‑chip RAM to support buffering, FIFOs and local data storage within designs.
  • High I/O Count  230 user I/Os to support dense external interfacing and multi‑lane connectivity requirements.
  • sysI/O and Differential Standards  Series documentation specifies sysI/O support and multiple differential I/O standards (including LVDS, SubLVDS, SLVS and Soft MIPI D‑PHY), enabling diverse signaling options at the I/O pins.
  • Hardened PCIe Characteristics  Datasheet coverage includes hardened PCIe characteristics with references to PCIe operation across a range of data rates, providing guidance for PCIe‑based system integration.
  • Clocking and Timing  On‑chip PLLs and internal oscillator characteristics are documented in the Avant platform datasheet for system timing and clock management.
  • Power and Supply  Core voltage supply specified at 820 mV; detailed DC and switching characteristics and supply sequencing guidance are provided in the platform documentation.
  • Package and Mounting  484‑BFBGA / 484‑FCBGA (19×19) surface‑mount package for compact board integration.
  • Commercial Grade & RoHS Compliant  Rated for 0 °C to 85 °C operation and RoHS compliant to meet commercial product environmental requirements.

Typical Applications

  • High‑density logic integration  Use the 196,000 logic elements to consolidate custom combinational and sequential logic blocks, accelerators and glue logic into a single device.
  • Memory‑intensive buffering  Embedded RAM (≈1.74 Mbits) supports FIFOs, packet buffering and intermediate data storage close to logic.
  • I/O aggregation and protocol bridging  With 230 I/Os and documented sysI/O differential standards, the device is suitable for designs requiring many external interfaces and protocol translation.
  • PCIe‑enabled subsystems  Platform documentation includes hardened PCIe characteristics, enabling use in PCIe endpoint or related subsystems where PCIe integration is required.

Unique Advantages

  • High logic density: 196,000 logic elements allow complex designs without partitioning across multiple devices.
  • Substantial on‑chip memory: Approximately 1.74 Mbits of embedded RAM reduces external memory dependence for buffering and state storage.
  • Extensive I/O flexibility: 230 I/Os and support for multiple differential standards enable broad interface compatibility and high pin‑count designs.
  • Compact BGA package: 484‑BFBGA / 484‑FCBGA (19×19) format provides a space‑efficient solution for dense board layouts.
  • Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant to address commercial product requirements.
  • Documented platform features: Avant platform datasheet provides detailed information on DC/switching characteristics, clocking, programmable termination and PCIe characteristics to support system design and validation.

Why Choose LAV-AT-200E-2LBG484C?

The LAV-AT-200E-2LBG484C positions itself as a high‑density, I/O‑rich FPGA option within the Lattice Avant platform. Its combination of 196,000 logic elements, approximately 1.74 Mbits of embedded RAM and 230 I/Os in a compact 484‑BFBGA/FCBGA package provides designers with a versatile building block for consolidating complex digital functions and multi‑interface subsystems in commercial products.

Backed by Avant platform documentation that covers power sequencing, I/O electrical characteristics, PLLs and hardened PCIe characteristics, this device is suited to engineers who need verified electrical and timing guidance while integrating high logic capacity and flexible I/O into their designs.

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