LAV-AT-200E-2LBG484C
| Part Description |
Avant-E Field Programmable Gate Array (FPGA) IC 230 1740800 196000 484-BFBGA, FCBGA |
|---|---|
| Quantity | 1,064 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA, FCBGA | Number of I/O | 230 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 196000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-200E-2LBG484C – Avant‑E FPGA, 196,000 logic elements, 1.74 Mbits RAM, 230 I/Os
The LAV-AT-200E-2LBG484C is an Avant‑E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, delivered in a 484‑BFBGA / 484‑FCBGA (19×19) surface‑mount package. It provides a high-density programmable fabric with a large I/O footprint and on‑chip memory to implement complex digital functions.
Designed for commercial applications, the device combines 196,000 logic elements with approximately 1.74 Mbits of embedded memory and 230 user I/Os, enabling platform designers to consolidate logic, buffering and I/O functions in a compact package while operating from a core supply of 820 mV and across a 0 °C to 85 °C temperature range.
Key Features
- Core Capacity 196,000 logic elements for implementing large, flexible digital designs and complex control logic.
- Embedded Memory Approximately 1.74 Mbits of on‑chip RAM to support buffering, FIFOs and local data storage within designs.
- High I/O Count 230 user I/Os to support dense external interfacing and multi‑lane connectivity requirements.
- sysI/O and Differential Standards Series documentation specifies sysI/O support and multiple differential I/O standards (including LVDS, SubLVDS, SLVS and Soft MIPI D‑PHY), enabling diverse signaling options at the I/O pins.
- Hardened PCIe Characteristics Datasheet coverage includes hardened PCIe characteristics with references to PCIe operation across a range of data rates, providing guidance for PCIe‑based system integration.
- Clocking and Timing On‑chip PLLs and internal oscillator characteristics are documented in the Avant platform datasheet for system timing and clock management.
- Power and Supply Core voltage supply specified at 820 mV; detailed DC and switching characteristics and supply sequencing guidance are provided in the platform documentation.
- Package and Mounting 484‑BFBGA / 484‑FCBGA (19×19) surface‑mount package for compact board integration.
- Commercial Grade & RoHS Compliant Rated for 0 °C to 85 °C operation and RoHS compliant to meet commercial product environmental requirements.
Typical Applications
- High‑density logic integration Use the 196,000 logic elements to consolidate custom combinational and sequential logic blocks, accelerators and glue logic into a single device.
- Memory‑intensive buffering Embedded RAM (≈1.74 Mbits) supports FIFOs, packet buffering and intermediate data storage close to logic.
- I/O aggregation and protocol bridging With 230 I/Os and documented sysI/O differential standards, the device is suitable for designs requiring many external interfaces and protocol translation.
- PCIe‑enabled subsystems Platform documentation includes hardened PCIe characteristics, enabling use in PCIe endpoint or related subsystems where PCIe integration is required.
Unique Advantages
- High logic density: 196,000 logic elements allow complex designs without partitioning across multiple devices.
- Substantial on‑chip memory: Approximately 1.74 Mbits of embedded RAM reduces external memory dependence for buffering and state storage.
- Extensive I/O flexibility: 230 I/Os and support for multiple differential standards enable broad interface compatibility and high pin‑count designs.
- Compact BGA package: 484‑BFBGA / 484‑FCBGA (19×19) format provides a space‑efficient solution for dense board layouts.
- Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant to address commercial product requirements.
- Documented platform features: Avant platform datasheet provides detailed information on DC/switching characteristics, clocking, programmable termination and PCIe characteristics to support system design and validation.
Why Choose LAV-AT-200E-2LBG484C?
The LAV-AT-200E-2LBG484C positions itself as a high‑density, I/O‑rich FPGA option within the Lattice Avant platform. Its combination of 196,000 logic elements, approximately 1.74 Mbits of embedded RAM and 230 I/Os in a compact 484‑BFBGA/FCBGA package provides designers with a versatile building block for consolidating complex digital functions and multi‑interface subsystems in commercial products.
Backed by Avant platform documentation that covers power sequencing, I/O electrical characteristics, PLLs and hardened PCIe characteristics, this device is suited to engineers who need verified electrical and timing guidance while integrating high logic capacity and flexible I/O into their designs.
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