LAV-AT-200E-3ASG324C

The LAV-AT-200E-3ASG324C is an Avant-E series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. This commercial-grade, surface-mount device combines a high logic capacity with embedded RAM and a compact 324-WLCSP package to support dense digital designs where board area and integration matter.

Built on the Lattice Avant platform specification set, the device is targeted for applications that require flexible programmable logic, substantial on-chip memory, and a large number of I/O in a compact footprint while operating at a 0 °C to 85 °C commercial temperature range.

Key Features

• Core logic capacity — 196000 logic elements to implement complex custom digital functions and parallel processing structures.
• Embedded memory — approximately 1.74 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic tasks.
• I/O density — 208 user I/Os to support multiple peripheral interfaces, bus bridging, and signal routing within compact designs.
• Compact package & mounting — supplied in a 324-BGA/WLCSP form factor (324-WLCSP, 11×9) for space-constrained applications; surface mount package type.
• Power — single-supply operation at 820 mV (820 mV to 820 mV specified), enabling designs that target low core-voltage domains.
• Operating range & grade — commercial-grade device rated for 0 °C to 85 °C operation to meet standard electronics applications.
• Regulatory compliance — RoHS-compliant for environmental and manufacturing compatibility.
• Lattice Avant platform — part of the Avant platform family; consult the Avant platform data sheet for platform-level electrical, I/O, and timing specifications.

Typical Applications

• Custom digital logic and prototyping — Implement user-defined digital functions using the device’s 196000 logic elements and approximately 1.74 Mbits of embedded memory.
• High-density I/O interfacing — Leverage 208 I/Os to bridge multiple peripherals, implement protocol translation, or consolidate I/O in compact systems.
• Space-constrained embedded systems — The 324-WLCSP (11×9) package and surface-mount form factor suit compact PCBs where board area and integration are priorities.

Unique Advantages

• High programmable capacity: 196000 logic elements provide the resources needed for complex custom logic without external glue logic.
• Significant on-chip RAM: Approximately 1.74 Mbits of embedded memory reduces the need for external memory in many buffering and storage tasks.
• Large I/O count in a small package: 208 I/Os in a 324-WLCSP footprint enable high connectivity while maintaining a compact board footprint.
• Low-voltage core operation: Operates at an 820 mV supply level, aligning with low-voltage digital domains and modern power budgets.
• Commercial readiness: 0 °C to 85 °C operating range and RoHS compliance support mainstream electronics manufacturing and deployment.
• Platform-level documentation: Backed by the Lattice Avant platform data sheet for detailed electrical and timing guidance at the series level.

Why Choose LAV-AT-200E-3ASG324C?

The LAV-AT-200E-3ASG324C delivers a balance of high logic density, on-chip memory, and extensive I/O in a compact WLCSP package optimized for commercial embedded applications. Its placement on the Lattice Avant platform provides access to platform-level specifications and design guidance for integration and system-level planning.

This FPGA is well suited for engineers and designers who need substantial programmable resources and memory within a constrained board area, and who require a commercial-temperature, RoHS-compliant device for mainstream electronics projects.

Request a quote or submit an inquiry to receive pricing and availability information for the LAV-AT-200E-3ASG324C. Our team can provide datasheet guidance and supply details to support your design and procurement process.