LAV-AT-200E-1LFG676I

The LAV-AT-200E-1LFG676I is an Avant‑E FPGA from Lattice Semiconductor Corporation packaged in a 676‑FCBGA (27×27) ball grid array. This surface‑mount, industrial‑grade device integrates 196,000 logic elements and approximately 1.74 Mbits of embedded memory with 312 general‑purpose I/O pins for dense, configurable logic implementations.

Engineered for applications that require substantial logic capacity, on‑chip RAM, and a high I/O count in a compact FCBGA footprint, the device operates across an industrial temperature range of −40°C to 100°C and is RoHS compliant.

Key Features

• Logic Capacity — 196,000 logic elements provide large-scale programmable logic resources for complex custom functions and data processing.
• Embedded Memory — Approximately 1.74 Mbits of total on‑chip RAM suitable for buffering, state storage, and small working data sets.
• I/O Density — 312 I/O pins enable broad peripheral interfacing and high‑channel count signal routing in a single device.
• Package & Mounting — 676‑FCBGA (27×27) package in a surface‑mount form factor for high‑density board integration.
• Operating Range — Industrial temperature rating from −40°C to 100°C for deployment in temperature‑variable environments.
• Power — Voltage supply specified at 820 mV per device data.
• Compliance — RoHS‑compliant device to meet common environmental requirements.

Typical Applications

• Industrial Control — Implement custom control logic, signal conditioning, and deterministic I/O handling leveraging the device’s logic capacity and industrial temperature rating.
• Data I/O Aggregation — High I/O count supports multi‑channel interface aggregation, protocol bridging, and front‑end signal routing on compact boards.
• Embedded System Acceleration — On‑chip RAM and extensive logic resources allow offloading of compute‑intensive functions into programmable fabric.
• Prototyping and Custom IP — Large logic element count makes the device suitable for development of custom IP blocks and system prototypes that require significant programmable resources.

Unique Advantages

• High Logic Density: 196,000 logic elements deliver expansive programmable capacity for complex designs without splitting functionality across multiple devices.
• Integrated RAM: Approximately 1.74 Mbits of embedded memory reduces external memory needs for many buffering and stateful functions, simplifying board design.
• Extensive I/O: 312 I/O pins provide flexible connectivity for sensors, interfaces, and parallel data paths, minimizing the need for external multiplexers.
• Industrial Reliability: Rated for −40°C to 100°C operation to support deployment in industrial environments with wide temperature swings.
• Compact BGA Package: 676‑FCBGA (27×27) enables a high‑density implementation that saves PCB area while supporting substantial I/O and routing.
• Regulatory Compliance: RoHS compliance helps meet common environmental and manufacturing requirements.

Why Choose LAV-AT-200E-1LFG676I?

The LAV-AT-200E-1LFG676I positions itself as a high‑capacity, industrial‑grade FPGA option for designs that require a balance of large programmable fabric, embedded memory, and a high I/O count within a compact FCBGA package. Its combination of 196,000 logic elements, approximately 1.74 Mbits of on‑chip RAM, and 312 I/Os makes it suitable for engineers building complex control, processing, or interface aggregation solutions.

For teams seeking scalability and integration in industrial applications, this Avant‑E device delivers quantifiable resources and environmental range to support robust, long‑lifecycle deployments while enabling consolidation of functions onto a single programmable device.

Request a quote or submit a parts inquiry to receive pricing and availability for the LAV-AT-200E-1LFG676I. Our team can provide lead‑time and purchasing details to help move your design forward.