LAV-AT-200E-1ASG324I

The LAV-AT-200E-1ASG324I is an Avant‑E Field Programmable Gate Array (FPGA) IC supplied in a 324‑WLCSP package (11×9) for surface‑mount assembly. It provides a high logic capacity and embedded memory suited to complex programmable designs in industrial environments.

As part of the Avant platform, platform‑level documentation highlights advanced I/O capabilities, programmable clocking and serial interfaces; this device offers a combination of logic density, on‑chip RAM and I/O count for demanding embedded and interface applications.

Key Features

• Logic Capacity — 196,000 logic elements to implement sizeable programmable logic functions and custom datapaths.
• Embedded Memory — Approximately 1.74 Mbits of on‑chip RAM for buffers, FIFOs and local data storage.
• I/O Resources — 208 I/O pins to support multiple external interfaces and board-level connectivity.
• Package & Mounting — 324‑WLCSP (11×9) package in a surface‑mount form factor for compact board designs.
• Industrial Grade — Specified operating temperature range from −40 °C to 100 °C for industrial applications.
• Supply Voltage — Single supply voltage listed at 820 mV.
• Regulatory — RoHS compliant.
• Avant Platform Capabilities (platform documentation) — The Avant platform datasheet documents advanced system features such as programmable PLLs, internal oscillators and hardened PCIe characteristics at multiple data rates, as well as a broad set of sysI/O standards and differential signaling options.

Typical Applications

• Industrial Control — Implement custom control logic, interface aggregation and deterministic signal processing within industrial equipment operating across −40 °C to 100 °C.
• High‑Speed Interface Bridging — Use the device’s I/O count and platform‑documented serial/PCIe capabilities for protocol bridging and interface conversion tasks.
• Embedded Data Processing — Leverage 196,000 logic elements and ~1.74 Mbits of embedded memory for local data buffering, packet processing or protocol offload.

Unique Advantages

• High Logic Density: 196,000 logic elements enable implementation of complex custom logic and parallel datapaths.
• Integrated Memory: Approximately 1.74 Mbits of on‑chip RAM reduces external memory dependence for many buffering and state‑storage tasks.
• Generous I/O Count: 208 I/Os provide flexibility to connect multiple peripherals and high‑pin‑count interfaces without excessive external multiplexing.
• Compact, Surface‑Mount WLCSP: 324‑WLCSP (11×9) package supports space‑constrained board designs while keeping connections close to the die.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in a broad range of industrial environments.
• Platform‑Level System Features: Avant platform documentation details configurable clocking, internal oscillators and hardened serial/PCIe support, helping designers scale from prototype to production.

Why Choose LAV-AT-200E-1ASG324I?

The LAV-AT-200E-1ASG324I positions itself for engineers who need substantial programmable logic, embedded memory and a high I/O count in a compact, industrial‑rated package. Its WLCSP footprint and surface‑mount mounting support dense board integration while the Avant platform documentation provides system‑level features needed for high‑speed interfaces and reliable clocking.

This device is suited for designs that demand on‑device logic capacity and local memory, and for teams leveraging the Avant platform’s documented capabilities to accelerate development of interface‑heavy and compute‑centric applications.

Request a quote or submit an inquiry for the LAV-AT-200E-1ASG324I to get pricing and availability information tailored to your project requirements.