LAMXO3LF-4300E-5BG324E

The LAMXO3LF-4300E-5BG324E is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It provides a small, surface-mount programmable logic device with 4,300 logic elements and 268 I/O for flexible digital design and system integration.

Designed as an automotive-grade, AEC‑Q100 qualified device, the part supports a wide operating range and on-chip memory resources, making it suitable for applications that require qualified programmable logic in compact, thermally capable packages.

Key Features

• Logic Resources — 4,300 logic elements to implement configurable digital functions and state machines.
• Embedded Memory — 94,208 bits of total on-chip RAM (approximately 0.094 Mbits) for data buffering, FIFOs, and small tables.
• I/O Capacity — 268 general-purpose I/O pins to connect multiple peripherals, sensors, and buses directly to the FPGA.
• Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification, suitable for designs that require automotive-grade components.
• Voltage and Temperature — Supported supply voltage range of 1.14 V to 1.26 V and operating temperature range of −40 °C to 125 °C.
• Packaging & Mounting — 324‑LFBGA package (supplier device package: 324‑CABGA, 15 × 15 mm) with surface-mount mounting for compact board designs.
• Family-Level Capabilities — MachXO3 family features called out in the datasheet include flexible architecture, pre‑engineered source synchronous I/O, flexible on‑chip clocking and PLLs, an on‑chip oscillator, user flash memory (UFM), and hardened IP blocks such as I²C and SPI cores and timer/counter functions.
• Non-volatile Configuration — MachXO3 family includes non‑volatile, multi‑time programmable configuration and TransFR reconfiguration capabilities as described in the family datasheet.
• Standby and Power Options — Family-level support for standby mode and power saving options is documented in the datasheet.
• RoHS Compliant — Device meets RoHS requirements.

Typical Applications

• Automotive Systems — AEC‑Q100 qualified programmable logic for in-vehicle functions that require temperature robustness and automotive-grade qualification.
• Embedded Control and Glue Logic — Implement custom interfacing, protocol bridging, and control logic using the device’s 4,300 logic elements and ample I/O.
• Sensor and Peripheral Interfaces — Use the 268 I/O and embedded memory to aggregate, buffer, and preprocess sensor data or peripheral streams.

Unique Advantages

• Automotive-Grade Qualification: AEC‑Q100 qualification and a −40 °C to 125 °C operating range provide design confidence for vehicle-level deployment.
• Compact, High‑I/O Package: 324‑LFBGA package with 268 I/O supports high connectivity in a compact 15 × 15 mm footprint.
• Integrated Functionality: Family-level hardened IP (I²C, SPI, timers), on‑chip oscillator, PLLs, and user flash memory reduce external component count and simplify system design.
• Deterministic On‑Chip Memory: 94,208 bits of embedded RAM enable local buffering and small FIFO implementations without external memory.
• Low-Voltage Operation: Narrow supply window (1.14 V–1.26 V) suitable for tightly regulated power domains and consistent timing behavior.

Why Choose LAMXO3LF-4300E-5BG324E?

The LAMXO3LF-4300E-5BG324E combines the MachXO3 family’s programmable architecture with automotive-grade qualification and a compact 324‑LFBGA package. With 4,300 logic elements, 268 I/O, and on‑chip memory, it offers a balanced integration of logic density and connectivity for applications that require qualified programmable logic in space-constrained designs.

This part is well suited for engineers and procurement teams targeting robust, scalable designs where on‑chip peripherals and family-level features (PLLs, hardened I/O/IP, UFM) help reduce BOM complexity and accelerate development while meeting temperature and qualification requirements.

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