LAMXO3LF-2100E-5BG324E

The LAMXO3LF-2100E-5BG324E is a member of the MachXO3 FPGA family from Lattice Semiconductor Corporation. This surface-mount, non-volatile FPGA integrates approximately 2,100 logic elements, about 75,776 bits (≈0.076 Mbits) of embedded RAM, and up to 268 general-purpose I/O to implement glue logic, interface bridging, and embedded control functions.

Designed and qualified for automotive use (AEC‑Q100), the device supports an extended operating range (−40 °C to 125 °C), operates from a 1.14 V to 1.26 V supply, and ships in a 324-LFBGA package (324-CABGA, 15×15). The MachXO3 family datasheet lists on-chip features such as flexible on-chip clocking (PLLs), pre‑engineered source-synchronous I/O, hardened peripheral IP, an on-chip oscillator, and multi-time programmable non-volatile configuration.

Key Features

• Core — Logic Elements Approximately 2,100 logic elements for implementing custom combinational and sequential logic functions.
• Embedded Memory Approximately 0.076 Mbits of on-chip RAM (75,776 bits) supporting single, dual, pseudo-dual port and FIFO modes as described in the MachXO3 family documentation.
• I/O and High‑Speed Interfaces Up to 268 I/O pins with pre‑engineered source-synchronous I/O and flexible sysI/O buffer banks to support a wide range of board-level interfacing needs.
• Clocking and Timing Flexible on-chip clocking architecture including sysCLOCK PLLs and an on-chip oscillator for system timing and clock management.
• Non‑volatile Configuration & Reconfiguration Multi-time programmable non-volatile configuration and TransFR reconfiguration capability for in-system updates and persistent device configuration.
• Embedded Hardened IP Hardened I2C and SPI IP cores plus timer/counter resources referenced in the MachXO3 family documentation to simplify peripheral integration.
• Package & Power 324-LFBGA (supplier package: 324-CABGA, 15×15) surface-mount package; nominal supply range 1.14 V to 1.26 V.
• Automotive Qualification & Temperature Automotive grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Automotive body and system controllers AEC‑Q100 qualification and extended temperature rating allow use in automotive control and interface tasks where persistent configuration and high I/O density are required.
• Interface bridging and board-level glue logic High I/O count and flexible I/O buffering support protocol bridging and signal adaptation between subsystems.
• Configuration and system management Non-volatile, multi-time programmable configuration combined with UFM and TransFR reconfiguration enable in-field updates and system-level configuration storage.
• Embedded timing and control On-chip PLLs, oscillator, and hardened timer/counter IP support precise timing and scheduling within embedded control designs.

Unique Advantages

• Highly integrated solution: Combines approximately 2,100 logic elements, embedded RAM, and 268 I/O in a single FPGA to reduce BOM and PCB complexity.
• Automotive‑ready reliability: AEC‑Q100 qualification and −40 °C to 125 °C operating range address automotive environmental requirements.
• Compact, high‑pin package: 324-LFBGA (324-CABGA, 15×15) delivers a high I/O density in a compact surface-mount footprint.
• Flexible power domain design: Narrow supply range (1.14 V–1.26 V) supports designs with specific low-voltage power rails.
• Built-in peripheral IP: Hardened I2C, SPI and timer/counter cores reduce external component count and speed development.
• Non-volatile, reconfigurable: Multi-time programmable configuration and TransFR reconfiguration enable persistent settings and field updates without external configuration memory.

Why Choose LAMXO3LF-2100E-5BG324E?

The LAMXO3LF-2100E-5BG324E delivers a balanced combination of programmable logic capacity, embedded memory, and a high-density I/O set in an automotive-qualified, surface-mount package. Its MachXO3 family architecture provides flexible clocking, hardened peripheral IP, and non-volatile configuration that together simplify system integration and reduce external component requirements.

This part is well suited to designers and integrators who need a compact, automotive‑qualified FPGA for interface bridging, embedded control, configuration management, or other applications that require persistent configuration, wide temperature operation, and a high number of I/Os.

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