LAMXO3LF-4300C-5BG256E

The LAMXO3LF-4300C-5BG256E is a MachXO3 family FPGA from Lattice Semiconductor offering a compact, surface-mount, non-volatile logic solution. Built around approximately 4,300 logic elements and roughly 0.094 Mbits of embedded memory, it provides high I/O density and flexible on-chip resources for board-level control, protocol adaptation, and system glue logic.

With 206 user I/Os, on-chip clocking and hardened peripheral IP, and AEC-Q100 qualification for automotive use, this device is aimed at designs that require robust operation across a wide temperature range and reliable, reprogrammable logic at the board level.

Key Features

• Logic Capacity  Approximately 4,300 logic elements suitable for glue logic, state machines, and small to mid-scale programmable functions.
• Embedded Memory  Approximately 0.094 Mbits of on-chip RAM for buffering, small FIFOs, and local storage.
• High I/O Count  206 user I/Os provide dense peripheral connectivity for interfacing sensors, buses, and external devices.
• Configurable I/O and Source-Synchronous Support  Flexible I/O buffer architecture and pre-engineered source-synchronous I/O options (as described in MachXO3 family documentation) for interface timing control.
• On-Chip Clocking and PLLs  Flexible on-chip clocking resources, including phase-locked loops and an on-chip oscillator, to support a range of timing and performance needs.
• Non-Volatile, Multi-Time Programmable Configuration  Built-in non-volatile configuration memory and support for multi-time reprogramming and TransFR reconfiguration modes.
• Embedded Hardened IP  Family-level hardened IP blocks such as I²C, SPI, and timer/counter cores provide ready-made peripheral functions to simplify designs.
• Automotive Qualification & Temperature Range  AEC-Q100 qualified and specified for operation from −40 °C to 125 °C, suitable for automotive-grade deployments.
• Power and Package  Operates from 2.375 V to 3.465 V, supplied in a compact 256-LFBGA package (supplier part 256-CABGA, 14×14), and designed for surface-mount assembly. RoHS compliant.

Typical Applications

• Automotive Electronic Modules  Board-level logic, I/O aggregation, and protocol adaptation in automotive subsystems, leveraging AEC-Q100 qualification and wide temperature operation.
• Interface Bridging and Protocol Conversion  High I/O count and configurable I/O buffers make this device suited for bridging between disparate buses and adapting peripheral interfaces.
• Industrial Control and Sensor Aggregation  On-chip memory, timers, and hardened peripheral IP simplify sensor interfacing, data buffering, and control functions in harsh environments.
• Board-Level Glue Logic  Non-volatile configuration and multi-time programmability let designers implement customizable glue logic and in-field updates without external configuration memory.

Unique Advantages

• High I/O Density:  206 user I/Os enable direct connection to many peripherals and sensors, reducing the need for external I/O expanders.
• Non-Volatile Configuration:  Built-in, multi-time programmable configuration memory supports in-system updates and can remove the requirement for external configuration devices.
• Automotive-Grade Reliability:  AEC-Q100 qualification and −40 °C to 125 °C operating range support demanding automotive use cases.
• Compact, Surface-Mount Package:  256-LFBGA (14×14) package delivers a high-density solution for space-constrained PCBs while supporting standard surface-mount assembly.
• Flexible Power Range:  Supports supply voltages from 2.375 V to 3.465 V for compatibility with common system rails.

Why Choose LAMXO3LF-4300C-5BG256E?

The LAMXO3LF-4300C-5BG256E combines a balanced logic footprint with substantial I/O capacity and embedded system features from the MachXO3 family. Its non-volatile configuration, on-chip clocking and hardened peripheral IP reduce external components and simplify board-level integration for automotive and industrial designs.

Designed and qualified to meet automotive requirements, this device is appropriate for engineers who need reliable, reprogrammable logic in temperature-challenging environments. Its compact 256-LFBGA package, wide voltage range, and RoHS compliance make it a pragmatic choice for space- and power-sensitive designs.

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