LAMXO3LF-2100C-5BG324E

The LAMXO3LF-2100C-5BG324E is a MachXO3 family FPGA offering a compact, non-volatile programmable fabric with flexible on-chip resources. It combines 2,100 logic elements, substantial embedded memory, and an I/O-rich package to address embedded control, interface bridging, and system integration tasks.

Designed for applications requiring extended temperature capability and automotive qualification, this device supports a wide supply range and is available in a 324‑LFBGA (15×15) surface-mount package for space-constrained boards.

Key Features

• Core Logic — 2,100 logic elements provide the programmable combinational and sequential resources needed for glue logic, control functions, and moderate-density custom logic implementation.
• Embedded Memory — Approximately 0.076 Mbits of embedded RAM (75,776 bits) for FIFOs, small buffers, and local data storage.
• I/O Density — 268 user I/O pins support extensive peripheral interfacing and bus bridging without external expansion.
• Configuration and Reconfiguration — Non-volatile, multi-time programmable configuration with TransFR reconfiguration and on-chip user flash memory (UFM) for persistent data and field updates.
• Clocking and Timing — Flexible on-chip clocking including PLLs and an integrated oscillator to support a variety of timing architectures.
• Embedded Hardened IP — Includes hardened peripherals such as I²C, SPI and timer/counter primitives for common serial interfaces and timing functions.
• Power and Supply — Supports a supply voltage range of 2.375 V to 3.465 V to accommodate multiple system power rails.
• Package and Mounting — 324‑LFBGA (15×15) supplier package in a surface-mount form factor for compact board designs.
• Automotive Qualification and Temperature — Automotive-grade device qualified to AEC‑Q100 with an operating range of −40 °C to 125 °C for use in temperature-challenging environments.
• System Features — Includes features described in the MachXO3 family datasheet such as programmable I/O cells, sysI/O buffer, hot-socketing support, standby and power-saving modes.

Typical Applications

• Automotive Control Modules — AEC‑Q100 qualification and −40 °C to 125 °C operation make the device suitable for in-vehicle control logic, interface bridging, and custom signal processing functions.
• Embedded System Glue Logic — High I/O count and 2,100 logic elements enable consolidation of interface translators, bus bridges, and peripheral control functions to reduce BOM and PCB complexity.
• Sensor and Timing Interfaces — On-chip timers, PLLs, and hardened serial interfaces (I²C, SPI) support sensor aggregation, timing management, and peripheral supervision in constrained systems.
• HMI and Peripheral Control — Sufficient logic and I/O density for managing displays, buttons, LEDs, and other human-machine interface elements while providing persistent configuration storage.

Unique Advantages

• Automotive-ready Qualification: AEC‑Q100 qualification and wide operating temperature enable deployment in vehicle electronics where temperature resilience and qualification matter.
• High I/O Integration: 268 I/Os reduce the need for external I/O expanders and simplify board-level interconnection for complex peripheral sets.
• Non-volatile, Field-upgradeable Configuration: Multi-time programmable non-volatile configuration and UFM allow in-field updates and persistent system parameters without external configuration memory.
• Compact, Surface-mount Package: 324‑LFBGA (15×15) package provides a high-density solution for space-constrained designs while supporting robust solder mounting.
• Flexible Power Interface: Broad supply range (2.375 V–3.465 V) allows integration into varied power architectures and simplifies power supply design choices.
• Built-in Peripheral Support: Hardened I²C, SPI, timers, and clocking primitives accelerate development by reducing the need to implement common functions in logic.

Why Choose LAMXO3LF-2100C-5BG324E?

The LAMXO3LF-2100C-5BG324E delivers a balanced combination of logic capacity, on-chip memory, and I/O density in a compact 324‑LFBGA package. Its MachXO3 family features—non‑volatile configuration, flexible clocking, and embedded hardened peripherals—help engineers consolidate system logic and streamline board design.

With AEC‑Q100 qualification and an operating range of −40 °C to 125 °C, this device is positioned for designs that require automotive-grade robustness alongside moderate programmable logic capability. It is well suited for engineers seeking a compact, reconfigurable platform with persistent configuration and ample I/O for embedded and vehicle applications.

Request a quote or submit an inquiry to purchase the LAMXO3LF-2100C-5BG324E and specify required quantities or lead-time requirements. Our team will respond with pricing and availability details.