LAMXO3LF-1300C-5BG256E

The LAMXO3LF-1300C-5BG256E is a MachXO3 family Field Programmable Gate Array (FPGA) optimized for embedded and automotive applications. Built on the MachXO3 architecture, it provides 1,300 logic elements, approximately 65,536 bits of embedded RAM, and 206 programmable I/O in a compact 256-LFBGA (256-CABGA, 14×14) package.

This device combines non-volatile, multi-time programmable logic with family-level features such as flexible on-chip clocking, pre‑engineered source-synchronous I/O and hardened peripheral IP to support system-level integration and control functions across automotive and other embedded systems.

Key Features

• Core Logic 1,300 logic elements and 163 logic blocks provide the programmable fabric for glue logic, protocol bridging and control functions.
• Embedded Memory Approximately 65,536 bits of on-chip RAM (sysMEM) supporting single, dual, pseudo-dual port and FIFO modes for buffering and small data storage needs.
• Rich I/O 206 programmable I/O pins with family support for pre‑engineered source-synchronous I/O and a flexible I/O buffer architecture for a range of interface needs.
• Non-volatile, Multi-time Programmable MachXO3 family non-volatile configuration allows in-system reconfiguration and persistent logic without external configuration memory.
• Hardened System IP Family-level hardened IP includes I²C and SPI cores, timers/counters, on-chip oscillator and configuration/test features to accelerate system design.
• Clocking and Timing Flexible on-chip clock distribution with sysCLOCK PLLs provides local clock management and timing flexibility described at the family level.
• Automotive Qualification & Temperature Range Automotive grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for harsh-environment deployment.
• Power and Supply Operates from a 2.375 V to 3.465 V supply range to meet common embedded system rail levels.
• Package & Mounting 256-LFBGA (supplier package: 256-CABGA, 14×14) surface-mount package suitable for space-constrained board designs.
• Design for Test and Configuration Family documentation describes IEEE 1149.1-compliant boundary scan, TraceID and multiple configuration/reconfiguration options for production and field updates.

Typical Applications

• Automotive body and control modules — AEC‑Q100 qualification and wide temperature range make the device suitable for in-vehicle control, sensor interfacing and other body electronics functions.
• In-vehicle networking and bridging — 206 I/O and configurable logic enable protocol bridging, signal conditioning and custom interface implementations.
• Embedded system glue logic — Non-volatile, multi-time programmable logic and on-chip memory support sequencers, power sequencing and peripheral aggregation in compact systems.
• Human-machine interface (HMI) and display control — Flexible I/O and embedded memory can be used for input conditioning, simple graphics control and interfacing front‑panel devices.

Unique Advantages

• Automotive-qualified reliability: AEC‑Q100 qualification plus −40 °C to 125 °C operating range supports deployment in harsh temperature environments.
• Compact, high‑I/O package: 206 I/O in a 256-LFBGA (14×14) footprint reduces board area while enabling extensive peripheral connectivity.
• Non-volatile configuration: Multi-time programmable MachXO3 family architecture eliminates the need for external configuration flash for persistent designs.
• Embedded memory and system IP: Approximately 65,536 bits of RAM plus hardened I²C/SPI and timers speed development of control and interface logic.
• Flexible clocking and I/O: On-chip PLLs and a flexible I/O buffer scheme provide designers with clock management and source-synchronous interface options described in the MachXO3 family documentation.
• Voltage flexibility: 2.375 V to 3.465 V supply support allows integration with common system power rails.

Why Choose LAMXO3LF-1300C-5BG256E?

The LAMXO3LF-1300C-5BG256E combines MachXO3 family system-level capabilities with automotive-grade qualification to deliver a compact, reprogrammable building block for embedded and in-vehicle applications. Its blend of 1,300 logic elements, embedded memory, hardened peripheral IP and a high I/O count supports common control, interfacing and sequencing tasks while simplifying board-level integration.

This device is well suited for engineers seeking a persistent, reprogrammable logic element with automotive qualification, a wide operating temperature range and flexible I/O in a 256-LFBGA package. Family-level documentation and features such as configurable clocking, configuration/testability and hardened IP help accelerate development and field updates.

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