LAMXO3D-9400ZC-2BG256E

The LAMXO3D-9400ZC-2BG256E is a LA‑MachXO field programmable gate array (FPGA) offered in a compact 256‑LFBGA package. It provides 9,400 logic elements and approximately 0.44 Mbits of on‑chip RAM to support configurable digital logic, interface bridging and embedded control functions.

Designed for automotive applications, it combines a broad I/O count and an extended operating temperature range with AEC‑Q100 qualification and RoHS compliance to address automotive system requirements for configurable logic and system integration.

Key Features

• Core Logic  9,400 logic elements for implementing glue logic, custom peripherals and interface functions.
• Embedded Memory  Approximately 0.44 Mbits of on‑chip RAM for data buffering, state storage and small FIFO requirements.
• I/O and Packaging  206 I/O pins in a 256‑pin LFBGA package (supplier device package: 256‑CABGA, 14×14) with surface‑mount mounting for compact board designs.
• Power  Wide supply range from 2.375 V to 3.465 V to support common automotive supply domains and flexible power architectures.
• Automotive Qualification  AEC‑Q100 qualification and Automotive grade designation for use in vehicle systems requiring qualified components.
• Temperature Range  Extended operating temperature from −40 °C to 125 °C to meet automotive thermal requirements.
• Regulatory  RoHS compliant to support lead‑free assembly and environmental regulations.

Typical Applications

• Automotive Systems  Configurable logic for control, interfacing and feature integration in automotive electronic modules where AEC‑Q100 qualification is required.
• Embedded Control  Implement custom state machines, protocol translators and peripheral controllers using the device's logic elements and on‑chip memory.
• Interface Bridging  Bridge between disparate digital interfaces and adapt signal mappings with flexible I/O and programmable logic.
• Compact Board Designs  Use the 256‑LFBGA package to integrate programmable logic into space‑constrained applications while retaining a high I/O count.

Unique Advantages

• Automotive‑qualified  AEC‑Q100 qualification and Automotive grade labeling provide traceable qualification for vehicle electronics.
• High logic density  9,400 logic elements enable substantial on‑device customization without external glue logic, reducing BOM complexity.
• Ample I/O  206 I/Os allow extensive peripheral connectivity and interface integration in a single device.
• Extended environmental range  −40 °C to 125 °C operating range supports demanding temperature conditions found in automotive electronics.
• Flexible power support  Operates across a broad supply window (2.375 V–3.465 V) to accommodate multiple system power domains.
• RoHS compliant package  Enables lead‑free manufacturing and compliance with common environmental requirements.

Why Choose LAMXO3D-9400ZC-2BG256E?

The LAMXO3D-9400ZC-2BG256E combines a sizable logic fabric with embedded RAM, a high I/O count and automotive qualification to deliver a dependable, configurable solution for automotive and embedded system designers. Its extended temperature rating and wide supply range make it suitable for robust in‑vehicle applications where qualified components and flexible interface support are required.

This device is well suited for customers seeking a compact, automotive‑grade FPGA to consolidate logic, reduce component count and simplify system integration while retaining predictable electrical and environmental characteristics.

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