LAMXO3D-9400HE-5BG256E

The LAMXO3D-9400HE-5BG256E is a LA-MachXO field programmable gate array from Lattice Semiconductor Corporation, offering a configurable logic solution with 9,400 logic elements and approximately 0.44 Mbits of embedded RAM (442,368 bits). It provides a high I/O count and compact BGA packaging for designs that require significant on-chip logic and I/O density.

With a supply range of 1.14 V to 1.26 V, AEC-Q100 qualification, and an operating temperature range of -40 °C to 125 °C, this device targets applications that need automotive-grade qualification and broad thermal margin while keeping board area and component count under control.

Key Features

• Logic Capacity  9,400 logic elements to implement configurable digital logic and custom functions.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for state storage, buffering, and small data structures.
• I/O Density  206 general-purpose I/O pins to support multiple peripherals and interfaces directly on-chip.
• Power  Low-voltage operation with a supply range of 1.14 V to 1.26 V to match modern system rails.
• Package & Mounting  256-LFBGA package (supplier device package: 256-CABGA, 14×14) designed for surface-mount assembly in space-constrained layouts.
• Automotive Qualification & Temperature Range  Automotive grade with AEC-Q100 qualification and guaranteed operation from -40 °C to 125 °C for robust thermal performance.
• Environmental Compliance  RoHS‑compliant materials and manufacturing.

Typical Applications

• Automotive control systems  AEC-Q100 qualification and a -40 °C to 125 °C operating range make this device suitable for electronic control modules that require qualified, temperature-tolerant programmable logic.
• Embedded system integration  Use the device’s 9,400 logic elements and approximately 0.44 Mbits of RAM to implement glue logic, custom interfaces, and control functions within embedded designs.
• I/O consolidation  A high I/O count (206) in a compact 256-LFBGA footprint enables consolidation of multiple peripheral connections in constrained form factors.

Unique Advantages

• Highly integrated solution: Combines 9,400 logic elements and on-chip RAM to reduce external components and simplify PCB designs.
• Automotive-ready reliability: AEC-Q100 qualification and a wide operating temperature range support deployment in automotive electronics.
• High I/O capacity in a compact package: 206 I/O pins in a 256-LFBGA (256‑CABGA 14×14) package balance density with board-space efficiency.
• Low-voltage operation: Nominal supply range of 1.14 V to 1.26 V aligns with contemporary low-voltage system rails.
• Regulatory compliance: RoHS‑compliant construction for environmentally conscious designs and global manufacturing requirements.

Why Choose LAMXO3D-9400HE-5BG256E?

The LAMXO3D-9400HE-5BG256E positions itself as a compact, automotive‑qualified FPGA option that delivers a balanced combination of logic capacity, embedded memory, and high I/O density. Its low-voltage operation and broad temperature range make it suitable for designs that require qualified performance across demanding environmental conditions.

Manufactured by Lattice Semiconductor Corporation, this device is appropriate for engineers and procurement teams seeking a programmable logic solution with clear, verifiable specifications for automotive and other temperature‑sensitive applications.

Request a quote today to obtain pricing, availability, and lead-time details for the LAMXO3D-9400HE-5BG256E.