LAMXO3LF-1300E-5BG256E

The LAMXO3LF-1300E-5BG256E is a MachXO3 family field-programmable gate array (FPGA) offering 1,300 logic elements, 65,536 bits of embedded RAM and 206 general-purpose I/Os in a 256‑LFBGA (256‑CABGA, 14×14) surface‑mount package. The device combines a flexible architecture, on‑chip clocking and hardened peripheral IP to address system integration and interface requirements.

Designed for demanding temperature and reliability requirements, this part supports a supply voltage range of 1.14 V to 1.26 V, an operating temperature range of −40 °C to 125 °C and carries AEC‑Q100 qualification for automotive applications.

Key Features

• Core Capacity — 1,300 logic elements (cells) for compact programmable logic and control functions.
• Embedded Memory — 65,536 total RAM bits (approximately 64 kbit) of on‑chip block RAM to support FIFOs, small buffers and state storage.
• I/O and Interface Flexibility — 206 I/O pins with support for pre‑engineered source‑synchronous I/O and a high‑performance, flexible I/O buffer architecture as described in the MachXO3 family data sheet.
• Non‑volatile, Reconfigurable Architecture — Multi‑time programmable non‑volatile configuration and TransFR reconfiguration capability for field updates and design iteration.
• Clocking and Timing — Flexible on‑chip clocking including sysCLOCK Phase‑Locked Loops (PLLs) and an on‑chip oscillator to support a range of timing architectures.
• Hardened Peripheral IP — Embedded hardened IP functions referenced in the family data sheet, including I²C, SPI and timer/counter cores, to reduce external component count and integration time.
• System Features — User Flash Memory (UFM), standby and power‑saving modes, hot‑socketing support and IEEE 1149.1‑compliant boundary scan for system test and configuration control.
• Package and Mounting — 256‑LFBGA (256‑CABGA, 14×14) surface‑mount package for compact board implementation.
• Power and Temperature — Recommended supply 1.14 V to 1.26 V and rated operating temperature from −40 °C to 125 °C.
• Automotive Qualification — AEC‑Q100 qualification and automotive grade designation for applications requiring that level of qualification.

Typical Applications

• Automotive electronics — AEC‑Q100 qualification and −40 °C to 125 °C operation make this device suitable for automotive control, monitoring and interface tasks that require programmable logic.
• System I/O and protocol bridging — High I/O count and pre‑engineered source‑synchronous I/O support enable flexible interfacing and protocol translation within compact systems.
• Embedded control and configuration — Non‑volatile, multi‑time programmable configuration, UFM and hardened peripherals (I²C, SPI, timers) simplify embedded control tasks and in‑field updates.

Unique Advantages

• Automotive‑grade, qualified platform: AEC‑Q100 qualification combined with a wide operating temperature range supports designs with automotive reliability requirements.
• Compact, high‑I/O package: 206 I/Os in a 256‑LFBGA package delivers high connectivity in a small board footprint.
• Integrated peripherals reduce BOM: Hardened I²C, SPI and timer/counter IP reduce the need for external controllers and simplify firmware integration.
• Flexible clocking and reconfiguration: On‑chip oscillator, PLLs and TransFR reconfiguration support versatile timing architectures and field updates.
• On‑chip RAM for buffering: 65,536 bits of embedded RAM provide local storage for FIFOs, buffers and small data structures without external memory.
• System test and manageability: IEEE 1149.1 boundary scan, UFM and power‑saving modes enhance testability and deployed system management.

Why Choose LAMXO3LF-1300E-5BG256E?

The LAMXO3LF-1300E-5BG256E delivers a balanced combination of programmable logic capacity, embedded memory and a high I/O count in a compact, automotive‑qualified package. As a member of the MachXO3 family, it provides flexible on‑chip clocking, hardened peripheral IP and non‑volatile multi‑time programmable configuration to accelerate hardware integration and support in‑field updates.

This device is well suited for designs that require a compact FPGA with strong I/O capability, built‑in peripheral functionality and qualification for automotive environments. Its combination of features supports scalable designs with reduced BOM and easier system integration within the MachXO3 family roadmap.

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