LAV-AT-200E-3LBG484I
| Part Description |
Avant-E Field Programmable Gate Array (FPGA) IC 230 1740800 196000 484-BFBGA, FCBGA |
|---|---|
| Quantity | 113 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA, FCBGA | Number of I/O | 230 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 196000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-200E-3LBG484I – Avant-E Field Programmable Gate Array (FPGA)
The LAV-AT-200E-3LBG484I is an Avant-E platform Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. This device delivers a programmable logic fabric with 196,000 logic elements and embedded on-chip memory to implement custom digital functions.
Designed for board-level integration, the device is offered in a 484-ball FCBGA package (484-FCBGA, 19×19) with surface-mount mounting and an industrial operating range of -40 °C to 100 °C, making it suitable for demanding deployed systems that require significant logic capacity and substantial I/O resources.
Key Features
- FPGA Core Field Programmable Gate Array architecture with 196,000 logic elements for implementing complex digital logic and custom accelerators.
- Embedded Memory Approximately 1.74 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
- I/O Density 230 available I/O pins to interface with external peripherals, sensors, and high-pin-count systems.
- Package & Mounting 484-BFBGA / 484-FCBGA package; supplier device package specified as 484-FCBGA (19×19). Surface-mount mounting type for standard PCB assembly.
- Power Voltage supply specified as 820 mV.
- Industrial Grade & Temperature Grade: Industrial. Operating temperature range: -40 °C to 100 °C for deployment in temperature-demanding environments.
- Regulatory RoHS compliant.
Typical Applications
- Custom digital logic implementations Use the FPGA fabric and 196,000 logic elements to implement application-specific processing and control logic on-board.
- High I/O bridging and protocol conversion 230 I/O pins provide capacity for interfacing between multiple peripherals, sensors, or subsystems.
- Embedded memory buffering Approximately 1.74 Mbits of on-chip RAM supports packet buffering, FIFOs, and state storage for real-time processing tasks.
Unique Advantages
- Large logic capacity: 196,000 logic elements provide substantial room for integrating complex functions and consolidating discrete logic into a single device.
- Significant on-chip RAM: Approximately 1.74 Mbits of embedded memory reduces reliance on external memory for many buffering and state-storage needs.
- Generous I/O count: 230 I/O pins simplify connectivity to multiple peripherals and external interfaces without multiplexing compromises.
- Compact BGA footprint: 484-FCBGA (19×19) package supports dense board-level integration while maintaining a standard surface-mount assembly flow.
- Industrial temperature tolerance: Rated for operation from -40 °C to 100 °C to meet environmental demands in deployed systems.
- RoHS compliant: Meets regulatory requirements for lead-free assemblies.
Why Choose LAV-AT-200E-3LBG484I?
The LAV-AT-200E-3LBG484I positions itself as a high-capacity, board-level FPGA solution for designs that require substantial programmable logic, on-chip memory, and a high number of I/Os within an industrial temperature envelope. Its 484-ball FCBGA package and surface-mount mounting support compact, manufacturable board designs.
Manufactured by Lattice Semiconductor Corporation and documented on the Avant platform datasheet, this device is aimed at engineers and procurement teams developing systems that need scalable programmable logic, embedded RAM resources, and robust I/O connectivity while meeting RoHS requirements.
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