LAV-AT-200E-3LFG676C

The LAV-AT-200E-3LFG676C is an Avant‑E series FPGA from Lattice Semiconductor Corporation. It provides a high‑density programmable fabric with a large number of I/O and embedded memory, packaged in a 676‑ball FCBGA (27×27) surface‑mount package for compact system integration. This commercial‑grade device is suited to designs requiring substantial logic capacity, on‑chip memory, and versatile I/O in a compact footprint.

Key Features

• Logic Capacity — 196,000 logic elements enabling complex custom logic implementations and high‑density designs.
• Embedded Memory — Approximately 1.74 Mbits of on‑chip RAM for buffering, FIFOs, and embedded data storage.
• I/O Resources — 312 I/O pins to support broad peripheral and interface connectivity requirements.
• Package & Mounting — 676‑BBGA / 676‑FCBGA package; supplier device package specified as 676‑FCBGA (27×27). Surface‑mount mounting type for PCB assembly.
• Power — Specified supply voltage at 820 mV as listed in product data.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Platform Documentation — The Avant platform datasheet provides detailed platform‑level electrical, timing and interface specifications including sysI/O, PLLs, on‑chip programmable termination and hardened PCIe characteristics.
• Compliance — RoHS compliant for environmental conformity in lead‑free assemblies.

Typical Applications

• Custom Logic Acceleration — Implement application‑specific datapaths, signal processing blocks, or control logic where high logic element count and on‑chip RAM are required.
• High‑Density I/O Bridging — Use the 312 I/Os to bridge multiple peripherals and local buses in compact system designs.
• PCIe‑Enabled Systems — Leverage Avant platform documentation for designs requiring PCIe connectivity and related timing/electrical guidance.
• Embedded System Integration — Integrate programmable logic and memory in applications that need flexible hardware configurations within a surface‑mount FCBGA footprint.

Unique Advantages

• High Logic Density: 196,000 logic elements provide the capacity to implement complex state machines, datapaths, and hardware accelerators within a single device.
• Integrated On‑Chip Memory: Approximately 1.74 Mbits of embedded RAM reduces external memory dependency for many buffering and storage tasks.
• Generous I/O Count: 312 I/Os simplify board‑level routing by accommodating multiple interfaces and peripherals without external multiplexing.
• Compact FCBGA Package: 676‑ball FCBGA (27×27) enables high‑density PCB layouts while maintaining a surface‑mount form factor.
• Platform‑Level Documentation: Avant platform specifications include detailed electrical and timing parameters (sysI/O, PLLs, on‑chip termination, PCIe characteristics) to support system‑level design and verification.
• RoHS Compliant: Supports lead‑free assembly processes and regulatory requirements for environmental compliance.

Why Choose LAV-AT-200E-3LFG676C?

The LAV-AT-200E-3LFG676C positions itself as a high‑capacity, platform‑backed FPGA option for designers needing substantial programmable logic, embedded memory, and a broad set of I/Os in a compact FCBGA package. Its commercial operating range and RoHS compliance make it suitable for a wide range of consumer and embedded applications where platform documentation and integration guidance (sysI/O, PLLs, PCIe characteristics) are important to accelerate development and reduce integration risk.

Engineers and procurement teams looking for a scalable FPGA solution with clear platform specifications and strong on‑chip resources will find the LAV-AT-200E‑3LFG676C appropriate for applications requiring dense logic, embedded memory, and flexible I/O in a surface‑mount package.

Request a quote or submit an inquiry for pricing and availability to begin integrating the LAV-AT-200E-3LFG676C into your next design.