LAV-AT-200E-3LBG484C

The LAV-AT-200E-3LBG484C is an Avant‑E FPGA from Lattice Semiconductor Corporation designed for commercial embedded applications requiring dense programmable logic, substantial on‑chip memory, and a broad I/O complement. The device integrates 196,000 logic elements, approximately 1.74 Mbits of embedded RAM, and 230 I/Os in a 484‑ball FCBGA (19×19) surface‑mount package.

Documented platform features in the Avant datasheet include extensive sysI/O electrical specifications, sysCLOCK PLL timing and internal oscillator options, on‑chip programmable termination, and hardened PCIe characteristics — enabling protocol offload and high‑speed serial connectivity where required by the design.

Key Features

• Logic Capacity — 196,000 logic elements supporting complex custom logic and hardware acceleration.
• Embedded Memory — Approximately 1.74 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Density — 230 I/O pins documented with sysI/O electrical characteristics for single‑ended and multiple differential standards.
• High‑Speed I/O and Protocols — Datasheet includes sysI/O differential standards (LVDS, SubLVDS, SLVS), Soft MIPI D‑PHY support, and hardened PCIe characteristics with documented operation at 2.5, 5, 8 and 16 Gbps.
• Clocking and Timing — sysCLOCK PLL timing and internal oscillator options are specified in the platform documentation for flexible clocking architectures.
• Power and Configuration — On‑chip programmable termination, power supply ramp and sequencing guidelines, and documented DC and switching characteristics in the datasheet.
• Package and Mounting — 484‑BFBGA / 484‑FCBGA (19×19) surface‑mount package suitable for compact board designs.
• Commercial Grade & Environmental — Commercial temperature range of 0°C to 85°C and RoHS‑compliant construction.

Typical Applications

• High‑speed data interface and protocol bridging — Use hardened PCIe characteristics and sysI/O differential support to implement protocol offload, bridging, and packet handling functions.
• Embedded compute and custom logic — Leverage 196,000 logic elements and embedded RAM for hardware acceleration, control logic, and application‑specific datapaths.
• Multi‑lane sensor and camera interfaces — Soft MIPI D‑PHY and documented sysI/O standards support sensor and imaging interface implementations that require differential signaling.
• Commercial embedded systems — Designed for commercial temperature operation (0°C to 85°C), suitable for a wide range of non‑industrial embedded devices.

Unique Advantages

• High logic density: 196,000 logic elements enable consolidation of multiple functions into a single device, reducing board complexity.
• Integrated memory: Approximately 1.74 Mbits of embedded RAM provides local storage for buffering and low‑latency data paths.
• Broad I/O capability: 230 I/Os with documented sysI/O electrical characteristics support a variety of single‑ended and differential interfaces.
• Documented high‑speed interfaces: Datasheet coverage for hardened PCIe at multiple speeds and differential I/O standards simplifies high‑speed system design and validation.
• Compact packaging: 484‑ball FCBGA (19×19) surface‑mount package balances I/O count and board area for dense designs.
• Regulatory readiness: RoHS compliance supports global manufacturing and procurement requirements.

Why Choose LAV-AT-200E-3LBG484C?

The LAV-AT-200E-3LBG484C positions itself as a commercially graded, feature‑rich FPGA option for engineers building compact, high‑I/O embedded systems. With 196,000 logic elements, approximately 1.74 Mbits of embedded RAM, and extensive sysI/O and clocking documentation, it is well suited to designs that require on‑device programmability, high‑speed protocol handling, and flexible I/O signaling.

Designers benefit from the Avant platform documentation (DC/switching characteristics, PLL and oscillator timing, programmable termination, and hardened PCIe performance) to accelerate development and validation, while RoHS compliance and a compact 484‑ball FCBGA package support streamlined manufacturing and assembly.

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