LAV-AT-300E-1CSG484I
| Part Description |
Avant-E Field Programmable Gate Array (FPGA) IC 230 2723840 306000 484-BGA, FCCSPBGA |
|---|---|
| Quantity | 1,411 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCCSP (12x12) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA, FCCSPBGA | Number of I/O | 230 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 306000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-300E-1CSG484I – Avant-E Field Programmable Gate Array (FPGA) IC
The LAV-AT-300E-1CSG484I is an Avant‑E FPGA IC from Lattice Semiconductor Corporation, implemented in a 484‑pin FCCSP/BGA package. It delivers a high logic element count, on‑chip embedded memory, and extensive I/O connectivity suitable for industrial and embedded system designs.
Designed for applications that require programmable logic, high‑speed serial interfaces and robust thermal performance, this device combines approximately 306,000 logic elements, roughly 2.72 Mbits of embedded memory, and 230 I/O pins with a specified operating range of -40 °C to 100 °C.
Key Features
- Logic Capacity – Approximately 306,000 logic elements for complex programmable logic implementations.
- On‑Chip Memory – Approximately 2.72 Mbits of embedded RAM to support buffering, packet handling and state storage.
- I/O Density – 230 I/O pins to enable broad connectivity to peripherals, sensors and host interfaces.
- High‑Speed Interfaces – Datasheet includes hardened PCIe characteristics and sysI/O timing and electrical specifications, with PCIe sections covering 2.5, 5, 8 and 16 Gbps operation.
- Programmable I/O Features – On‑chip programmable termination and multiple sysI/O differential and single‑ended interface specifications referenced in the platform datasheet.
- Power – Specified supply voltage listed as 820 mV in the product data.
- Thermal & Grade – Industrial grade device with an operating temperature range of -40 °C to 100 °C.
- Package – 484‑BGA / 484‑FCCSP package, supplier device package noted as 484‑FCCSP (12×12), surface‑mount mounting.
- Reliability & Compliance – RoHS compliant; datasheet references ESD performance and detailed DC/switching characteristics for system design.
Typical Applications
- Industrial Control – Use the device’s industrial temperature rating and high logic density for programmable control, motor drive logic and factory automation functions.
- Embedded Compute & Acceleration – Leverage the large logic element count and embedded RAM for custom compute pipelines, data path acceleration and protocol handling.
- High‑Speed Interface Bridging – Implement host interfaces and bridging functions that use the device’s sysI/O and hardened PCIe characteristics across multiple link speeds.
- Sensor & I/O Aggregation – Deploy the 230 I/Os for aggregating sensors, ADC/DAC front ends and diverse peripheral connections in space‑constrained boards.
Unique Advantages
- High Logic Density: Approximately 306,000 logic elements enable complex logic designs without adding external programmable devices.
- Integrated Memory: Approximately 2.72 Mbits of embedded RAM reduces the need for external buffering and simplifies dataflow architectures.
- Broad I/O Support: 230 I/Os plus documented sysI/O electrical and timing characteristics allow flexible interfacing to modern peripherals and high‑speed links.
- Hardened High‑Speed Interfaces: Datasheet coverage for PCIe operation across 2.5–16 Gbps provides design guidance for deploying high‑throughput system links.
- Industrial Temperature Range: Rated for -40 °C to 100 °C to meet demanding environmental requirements in industrial deployments.
- Compact, Surface‑Mount Package: 484‑FCCSP (12×12) package supports dense board layouts while maintaining extensive I/O.
Why Choose LAV-AT-300E-1CSG484I?
The LAV-AT-300E-1CSG484I positions itself as a high‑capacity Avant‑E FPGA option for designs that need substantial programmable logic, embedded memory and flexible I/O in a compact industrial‑rated package. Its combination of approximately 306,000 logic elements, roughly 2.72 Mbits of RAM and 230 I/Os provides a strong foundation for embedded compute, high‑speed interface implementation and industrial control systems.
Backed by Lattice’s Avant platform documentation, the device includes detailed electrical, timing and interface specifications (including on‑chip programmable termination, sysI/O characteristics and hardened PCIe sections) to support system integration and reliable deployment across industrial temperature ranges.
Request a quote or submit a request for pricing and availability to evaluate the LAV-AT-300E-1CSG484I for your next design.