Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
LPC845M301JHI33YLPC845M301JHI33YNXP SemiconductorsIC MCU 32BIT 64KB FLASH 32HVQFNMicrocontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
30MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
984
LPC845M301JHI48ELPC845M301JHI48ENXP SemiconductorsIC MCU 32BIT 64KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
30MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Number of I/O:
42
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 2x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
958
LPC845M301JHI48KLPC845M301JHI48KNXP SemiconductorsIC MCU 32BIT 64KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
30MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Number of I/O:
42
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 2x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
692
LPC845M301JHI48YLPC845M301JHI48YNXP SemiconductorsIC MCU 32BIT 64KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
30MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Number of I/O:
42
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
319
N/ALPC865M201JBD64/0ENXP SemiconductorsIC MCU CORTEX M0+ LQFP64Microcontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
60MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
691
N/ALPC865M201JBD64/0KNXP SemiconductorsIC MCU 32BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
60MHz
Connectivity:
I2C, I3C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
330
N/ALPC865M201JHI33/0ENXP SemiconductorsIC MCU CORTEX M0+ HVQFN32Microcontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
60MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,239
N/ALPC865M201JHI33/0KNXP SemiconductorsIC MCU 32BIT 64KB FLASH 32VFQFNMicrocontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
60MHz
Connectivity:
I2C, I3C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
57
LPC865M201JHI48/0ELPC865M201JHI48/0ENXP SemiconductorsIC MCU CORTEX M0+ HVQFN48Microcontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
60MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
42
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,728
LPC865M201JHI48/0KLPC865M201JHI48/0KNXP SemiconductorsIC MCU 32BIT 64KB FLASH 48VFQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
60MHz
Connectivity:
I2C, I3C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
42
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
779
LPC8N04FHI24ELPC8N04FHI24ENXP SemiconductorsIC MCU 32BIT 32KB FLASH 24HVQFNMicrocontrollers24-HVQFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
8MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-HVQFN (4×4)
Package / Case:
24-VFQFN Exposed Pad
856
LPC8N04FHI24ZLPC8N04FHI24ZNXP SemiconductorsIC MCU 32BIT 32KB FLASH 24HVQFNMicrocontrollers24-HVQFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
8MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-HVQFN (4×4)
Package / Case:
24-VFQFN Exposed Pad
1,746
N/ALPM25P2F266AIntelIC MPU 266MHZMicroprocessorsN/AN/AN/A
Core Processor:
Pentium II
Number of Cores/Bus Width:
1 Core
Speed:
266MHz
RAM Controllers:
SDRAM
Display & Interface Controllers:
443BX
Voltage – I/O:
3.3V
Mounting Type:
Surface Mount
Package / Case:
Module
1,755
N/ALPM25P2F266BIntelIC MPU 266MHZMicroprocessorsN/AN/AN/A
Core Processor:
Pentium II
Number of Cores/Bus Width:
1 Core
Speed:
266MHz
RAM Controllers:
SDRAM
Display & Interface Controllers:
443BX
Voltage – I/O:
3.3V
Mounting Type:
Surface Mount
Package / Case:
Module
1,530
LS1012ASE7EKALS1012ASE7EKANXP SemiconductorsIC MPU QORIQ 600MHZ 211FCLGAMicroprocessors211-FCLGA (9.6x9.6)N/A0°C ~ 105°C
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
600MHz
RAM Controllers:
DDR3L
Ethernet:
GbE (2)
SATA:
SATA 6Gbps (1)
USB:
USB 2.0 (1), USB 3.0 + PHY
Operating Temperature:
0°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
211-VFLGA
Supplier Device Package:
211-FCLGA (9.6×9.6)
668
LS1012ASE7EKBLS1012ASE7EKBNXP SemiconductorsIC MPU QORIQ 600MHZ 211FCLGAMicroprocessors211-FCLGA (9.6x9.6)N/A0°C ~ 105°C
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
600MHz
RAM Controllers:
DDR3L
Ethernet:
GbE (2)
SATA:
SATA 6Gbps (1)
USB:
USB 2.0 (1), USB 3.0 + PHY
Operating Temperature:
0°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
211-VFLGA
Supplier Device Package:
211-FCLGA (9.6×9.6)
1,044
LS1012ASE7HKALS1012ASE7HKANXP SemiconductorsIC MPU QORIQ 800MHZ 211FCLGAMicroprocessors211-FCLGA (9.6x9.6)N/A0°C ~ 105°C
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
800MHz
RAM Controllers:
DDR3L
Ethernet:
GbE (2)
SATA:
SATA 6Gbps (1)
USB:
USB 2.0 (1), USB 3.0 + PHY
Operating Temperature:
0°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
211-VFLGA
Supplier Device Package:
211-FCLGA (9.6×9.6)
1,223
N/AN/ALS1012ASE7HKBNXP SemiconductorsIC MPU QORLQ LS1 800MHZ 211FCLGAMicroprocessors211-FCLGA (9.6x9.6)N/A0°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
800MHz
RAM Controllers:
DDR3L
Ethernet:
GbE (2)
SATA:
SATA 6Gbps (1)
USB:
USB 2.0 (1), USB 3.0 + PHY
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
211-VFLGA
Supplier Device Package:
211-FCLGA (9.6×9.6)
967
LS1012ASE7KKBLS1012ASE7KKBNXP SemiconductorsIC MPU QORIQ 1.0GHZ 211FCLGAMicroprocessors211-FCLGA (9.6x9.6)N/A0°C ~ 105°C
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.0GHz
RAM Controllers:
DDR3L
Ethernet:
GbE (2)
SATA:
SATA 6Gbps (1)
USB:
USB 2.0 (1), USB 3.0 + PHY
Operating Temperature:
0°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
211-VFLGA
Supplier Device Package:
211-FCLGA (9.6×9.6)
871
LS1012ASN7EKAN/ALS1012ASN7EKANXP SemiconductorsIC MPU QORIQ 600MHZ 211FCLGAMicroprocessors211-FCLGA (9.6x9.6)N/A0°C ~ 105°C
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
600MHz
RAM Controllers:
DDR3L
Ethernet:
GbE (2)
SATA:
SATA 6Gbps (1)
USB:
USB 2.0 (1), USB 3.0 + PHY
Operating Temperature:
0°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
211-VFLGA
Supplier Device Package:
211-FCLGA (9.6×9.6)
487

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