 | | LPC845M301JHI33Y | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b; D/A 1x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 984 | |
 | | LPC845M301JHI48E | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 48HVQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b; D/A 2x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 958 | |
 | | LPC845M301JHI48K | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 48HVQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b; D/A 2x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 692 | |
 | | LPC845M301JHI48Y | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 48HVQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b; D/A 1x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 319 | |
| N/A | | LPC865M201JBD64/0E | NXP Semiconductors | IC MCU CORTEX M0+ LQFP64 | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 691 | |
| N/A | | LPC865M201JBD64/0K | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: I2C, I3C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 330 | |
| N/A | | LPC865M201JHI33/0E | NXP Semiconductors | IC MCU CORTEX M0+ HVQFN32 | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 1,239 | |
| N/A | | LPC865M201JHI33/0K | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 32VFQFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: I2C, I3C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 57 | |
 | | LPC865M201JHI48/0E | NXP Semiconductors | IC MCU CORTEX M0+ HVQFN48 | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,728 | |
 | | LPC865M201JHI48/0K | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 48VFQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: I2C, I3C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 779 | |
 | | LPC8N04FHI24E | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 24HVQFN | Microcontrollers | 24-HVQFN (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.72V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 24-HVQFN (4×4) Package / Case: 24-VFQFN Exposed Pad | 856 | |
 | | LPC8N04FHI24Z | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 24HVQFN | Microcontrollers | 24-HVQFN (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.72V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 24-HVQFN (4×4) Package / Case: 24-VFQFN Exposed Pad | 1,746 | |
| N/A | | LPM25P2F266A | Intel | IC MPU 266MHZ | Microprocessors | N/A | N/A | N/A | Core Processor: Pentium II Number of Cores/Bus Width: 1 Core Display & Interface Controllers: 443BX Mounting Type: Surface Mount | 1,755 | |
| N/A | | LPM25P2F266B | Intel | IC MPU 266MHZ | Microprocessors | N/A | N/A | N/A | Core Processor: Pentium II Number of Cores/Bus Width: 1 Core Display & Interface Controllers: 443BX Mounting Type: Surface Mount | 1,530 | |
 | | LS1012ASE7EKA | NXP Semiconductors | IC MPU QORIQ 600MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 668 | |
 | | LS1012ASE7EKB | NXP Semiconductors | IC MPU QORIQ 600MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 1,044 | |
 | | LS1012ASE7HKA | NXP Semiconductors | IC MPU QORIQ 800MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 1,223 | |
| N/A | N/A | LS1012ASE7HKB | NXP Semiconductors | IC MPU QORLQ LS1 800MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 967 | |
 | | LS1012ASE7KKB | NXP Semiconductors | IC MPU QORIQ 1.0GHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 871 | |
 | N/A | LS1012ASN7EKA | NXP Semiconductors | IC MPU QORIQ 600MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 487 | |