Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCF51QM64VLFMCF51QM64VLFNXP SemiconductorsIC MCU 32BIT 64KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
Coldfire V1
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 2x16b, 12x16b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
454
MCF51QU128VHSMCF51QU128VHSNXP SemiconductorsIC MCU 32BIT 128KB FLSH 44MAPLGAMicrocontrollers44-MAPLGA (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
Coldfire V1
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 11x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-MAPLGA (5×5)
Package / Case:
44-VFLGA Exposed Pad
685
MCF51QU128VLHMCF51QU128VLHNXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
Coldfire V1
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 19x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
101
MCF51QU128VLHRMCF51QU128VLHRNXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
Coldfire V1
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 19x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
770
MCF51QU32VFMMCF51QU32VFMNXP SemiconductorsIC MCU 32BIT 32KB FLASH 32QFNMicrocontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
Coldfire V1
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
380
MCF51QU32VHSMCF51QU32VHSNXP SemiconductorsIC MCU 32BIT 32KB FLASH 44MAPLGAMicrocontrollers44-MAPLGA (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
Coldfire V1
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 11x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-MAPLGA (5×5)
Package / Case:
44-VFLGA Exposed Pad
1,125
MCF51QU64VHSMCF51QU64VHSNXP SemiconductorsIC MCU 32BIT 64KB FLASH 44MAPLGAMicrocontrollers44-MAPLGA (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
Coldfire V1
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 11x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-MAPLGA (5×5)
Package / Case:
44-VFLGA Exposed Pad
921
MCF51QU64VLFMCF51QU64VLFNXP SemiconductorsIC MCU 32BIT 64KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
Coldfire V1
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 13x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
894
MCF51QU64VLFRMCF51QU64VLFRNXP SemiconductorsIC MCU 32BIT 64KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
Coldfire V1
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 13x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
598
MCF5206AB25AMCF5206AB25ANXP SemiconductorsIC MPU MCF520X 25MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
RAM Controllers:
DRAM
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
897
MCF5206AB33AMCF5206AB33ANXP SemiconductorsIC MPU MCF520X 33MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
RAM Controllers:
DRAM
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
554
MCF5206EAB40MCF5206EAB40NXP SemiconductorsIC MPU MCF520X 40MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
225
MCF5206EAB54MCF5206EAB54NXP SemiconductorsIC MPU MCF520X 54MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
54MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
1,394
MCF5206ECAB40MCF5206ECAB40NXP SemiconductorsIC MPU MCF520X 40MHZ 160QFPMicroprocessors160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
1,905
MCF5206ECFT40MCF5206ECFT40NXP SemiconductorsIC MPU MCF520X 40MHZ 160QFPMicroprocessors160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
733
MCF5206EFT40MCF5206EFT40NXP SemiconductorsIC MPU MCF520X 40MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
818
MCF5206EFT54MCF5206EFT54NXP SemiconductorsIC MPU MCF520X 54MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
54MHz
RAM Controllers:
DRAM
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
885
MCF5206FT16AMCF5206FT16ANXP SemiconductorsIC MPU MCF520X 16MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
1,092
MCF5206FT33AMCF5206FT33ANXP SemiconductorsIC MPU MCF520X 33MHZ 160QFPMicroprocessors160-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
RAM Controllers:
DRAM
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-QFP (28×28)
346
MCF5207CVM166MCF5207CVM166NXP SemiconductorsIC MCU 32BIT ROMLESS 144MAPBGAMicrocontrollers144-MAPBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166.67MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
30
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-MAPBGA (13×13)
Package / Case:
144-LBGA
616

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