Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC5554MVR132R2MPC5554MVR132R2NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
156
N/AMPC5554MVR80NXP SemiconductorsICMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
382
MPC5554MZP112N/AMPC5554MZP112NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
112MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,523
MPC5554MZP132MPC5554MZP132NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
516
MPC5554MZP132R2MPC5554MZP132R2NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
394
MPC5554MZP80MPC5554MZP80NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
82MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
84
MPC555LFAVR40MPC555LFAVR40NXP SemiconductorsIC MCU 32BIT 448KB FLASH 272PBGAMicrocontrollers272-PBGA (27x27)N/A-55°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
RAM Size:
26K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-PBGA (27×27)
Package / Case:
272-BBGA
1,738
MPC555LFAZP40MPC555LFAZP40NXP SemiconductorsIC MCU 32BIT 448KB FLASH 272PBGAMicrocontrollers272-PBGA (27x27)N/A-55°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
RAM Size:
26K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-PBGA (27×27)
Package / Case:
272-BBGA
1,721
MPC555LFCVR40MPC555LFCVR40NXP SemiconductorsIC MCU 32BIT 448KB FLASH 272PBGAMicrocontrollers272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
RAM Size:
26K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-PBGA (27×27)
Package / Case:
272-BBGA
1,786
MPC555LFCZP40MPC555LFCZP40NXP SemiconductorsIC MCU 32BIT 448KB FLASH 272PBGAMicrocontrollers272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
RAM Size:
26K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-PBGA (27×27)
Package / Case:
272-BBGA
1,033
MPC555LFMVR40MPC555LFMVR40NXP SemiconductorsIC MCU 32BIT 448KB FLASH 272PBGAMicrocontrollers272-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
RAM Size:
26K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-PBGA (27×27)
Package / Case:
272-BBGA
396
MPC555LFMZP40MPC555LFMZP40NXP SemiconductorsIC MCU 32BIT 448KB FLASH 272PBGAMicrocontrollers272-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
RAM Size:
26K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-PBGA (27×27)
Package / Case:
272-BBGA
1,384
MPC555LFMZP40R2MPC555LFMZP40R2NXP SemiconductorsIC MCU 32BIT 448KB FLASH 272PBGAMicrocontrollers272-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
RAM Size:
26K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-PBGA (27×27)
Package / Case:
272-BBGA
894
MPC5565MVZ132MPC5565MVZ132NXP SemiconductorsIC MCU 32BIT 2MB FLASH 324PBGAMicrocontrollers324-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
192
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-PBGA (23×23)
Package / Case:
324-BBGA
1,103
MPC5566MVR132MPC5566MVR132NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,485
MPC5566MZP132MPC5566MZP132NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,445
MPC5566MZP144MPC5566MZP144NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
144MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,158
MPC5567MVR132N/AMPC5567MVR132NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
238
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
846
MPC561CVR40MPC561CVR40NXP SemiconductorsIC MCU 32BIT ROMLESS 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
64
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
209
MPC561CZP40MPC561CZP40NXP SemiconductorsIC MCU 32BIT ROMLESS 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
64
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
70

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