 | | MPC5554MVR132R2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 156 | |
| N/A | | MPC5554MVR80 | NXP Semiconductors | IC | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 382 | |
 | N/A | MPC5554MZP112 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 1,523 | |
 | | MPC5554MZP132 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 516 | |
 | | MPC5554MZP132R2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 394 | |
 | | MPC5554MZP80 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 84 | |
 | | MPC555LFAVR40 | NXP Semiconductors | IC MCU 32BIT 448KB FLASH 272PBGA | Microcontrollers | 272-PBGA (27x27) | N/A | -55°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x10b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 1,738 | |
 | | MPC555LFAZP40 | NXP Semiconductors | IC MCU 32BIT 448KB FLASH 272PBGA | Microcontrollers | 272-PBGA (27x27) | N/A | -55°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x10b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 1,721 | |
 | | MPC555LFCVR40 | NXP Semiconductors | IC MCU 32BIT 448KB FLASH 272PBGA | Microcontrollers | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 1,786 | |
 | | MPC555LFCZP40 | NXP Semiconductors | IC MCU 32BIT 448KB FLASH 272PBGA | Microcontrollers | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 1,033 | |
 | | MPC555LFMVR40 | NXP Semiconductors | IC MCU 32BIT 448KB FLASH 272PBGA | Microcontrollers | 272-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 396 | |
 | | MPC555LFMZP40 | NXP Semiconductors | IC MCU 32BIT 448KB FLASH 272PBGA | Microcontrollers | 272-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 1,384 | |
 | | MPC555LFMZP40R2 | NXP Semiconductors | IC MCU 32BIT 448KB FLASH 272PBGA | Microcontrollers | 272-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 894 | |
 | | MPC5565MVZ132 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 1,103 | |
 | | MPC5566MVR132 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 1,485 | |
 | | MPC5566MZP132 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 1,445 | |
 | | MPC5566MZP144 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 1,158 | |
 | N/A | MPC5567MVR132 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 846 | |
 | | MPC561CVR40 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.5V ~ 2.7V Data Converters: A/D 32x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 209 | |
 | | MPC561CZP40 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.5V ~ 2.7V Data Converters: A/D 32x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) | 70 | |