Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC564MVR56R2MPC564MVR56R2NXP SemiconductorsIC MCU 32BIT 512KB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,367
MPC564MZP56MPC564MZP56NXP SemiconductorsIC MCU 32BIT 512KB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,547
MPC564MZP56R2MPC564MZP56R2NXP SemiconductorsIC MCU 32BIT 512KB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,823
MPC564MZP66MPC564MZP66NXP SemiconductorsIC MCU 32BIT 512KB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
520
MPC564MZP66R2MPC564MZP66R2NXP SemiconductorsIC MCU 32BIT 512KB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,488
MPC565CVR56MPC565CVR56NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
884
MPC565CZP40MPC565CZP40NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,800
MPC565CZP56MPC565CZP56NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,848
MPC565MVR56MPC565MVR56NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
503
MPC565MVR56R2MPC565MVR56R2NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
130
MPC565MZP56MPC565MZP56NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,116
MPC565MZP56R2MPC565MZP56R2NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,977
MPC566AVR56MPC566AVR56NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-55°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
73
MPC566AZP56MPC566AZP56NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-55°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,496
MPC566CVR40MPC566CVR40NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,446
MPC566CVR56MPC566CVR56NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
669
MPC566CZP56MPC566CZP56NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,248
MPC566MVR56MPC566MVR56NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,020
MPC566MZP56MPC566MZP56NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,449
MPC603RRX200LCMPC603RRX200LCNXP SemiconductorsIC MPU MPC6XX 200MHZ 255FCCBGAMicroprocessors255-FCCBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA, FCCBGA
Supplier Device Package:
255-FCCBGA (21×21)
1,925

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