Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC603RRX200TCMPC603RRX200TCNXP SemiconductorsIC MPU MPC6XX 200MHZ 255FCCBGAMicroprocessors255-FCCBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA, FCCBGA
Supplier Device Package:
255-FCCBGA (21×21)
521
MPC603RRX266LCMPC603RRX266LCNXP SemiconductorsIC MPU MPC6XX 266MHZ 255FCCBGAMicroprocessors255-FCCBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA, FCCBGA
Supplier Device Package:
255-FCCBGA (21×21)
13
MPC603RRX266TCMPC603RRX266TCNXP SemiconductorsIC MPU MPC6XX 266MHZ 255FCCBGAMicroprocessors255-FCCBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA, FCCBGA
Supplier Device Package:
255-FCCBGA (21×21)
1,053
MPC603RRX300LCMPC603RRX300LCNXP SemiconductorsIC MPU MPC6XX 300MHZ 255FCCBGAMicroprocessors255-FCCBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA, FCCBGA
Supplier Device Package:
255-FCCBGA (21×21)
1,385
MPC603RZT200LCMPC603RZT200LCNXP SemiconductorsIC MPU MPC6XX 200MHZ 255BGAMicroprocessors255-PBGA (23x23)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
255-BBGA
Supplier Device Package:
255-PBGA (23×23)
216
MPC7410HX400LEMPC7410HX400LENXP SemiconductorsIC MPU MPC74XX 400MHZ 360CBGAMicroprocessors360-CBGA (25x25)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
640
MPC7410HX450LEMPC7410HX450LENXP SemiconductorsIC MPU MPC74XX 450MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
1,058
MPC7410HX500LEMPC7410HX500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
652
MPC7410RX500LEMPC7410RX500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
1,467
MPC7410THX400LEMPC7410THX400LENXP SemiconductorsIC MPU MPC74XX 400MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
1,959
MPC7410THX450NEMPC7410THX450NENXP SemiconductorsIC MPU MPC74XX 450MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
1,441
MPC7410THX500LEMPC7410THX500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
132
MPC7410VS500LEMPC7410VS500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360FCCLGAMicroprocessors360-FCCLGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-CLGA, FCCLGA
Supplier Device Package:
360-FCCLGA (25×25)
260
N/AMPC745BPX300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Mounting Type:
Surface Mount
1,751
N/AMPC745BPX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
255-BBGA, FCBGA
Supplier Device Package:
255-FCPBGA (21×21)
1,967
N/AMPC745BVT300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Mounting Type:
Surface Mount
864
N/AMPC745CPX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
1,738
N/AMPC745CVT350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
723
MPC755BPX300LEMPC755BPX300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BBGA, FCBGA
Supplier Device Package:
360-FCPBGA (25×25)
1,133
MPC755BPX350LEMPC755BPX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BBGA, FCBGA
Supplier Device Package:
360-FCPBGA (25×25)
670

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