 | | MPC603RRX200TC | NXP Semiconductors | IC MPU MPC6XX 200MHZ 255FCCBGA | Microprocessors | 255-FCCBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Supplier Device Package: 255-FCCBGA (21×21) | 521 | |
 | | MPC603RRX266LC | NXP Semiconductors | IC MPU MPC6XX 266MHZ 255FCCBGA | Microprocessors | 255-FCCBGA (21x21) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Supplier Device Package: 255-FCCBGA (21×21) | 13 | |
 | | MPC603RRX266TC | NXP Semiconductors | IC MPU MPC6XX 266MHZ 255FCCBGA | Microprocessors | 255-FCCBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Supplier Device Package: 255-FCCBGA (21×21) | 1,053 | |
 | | MPC603RRX300LC | NXP Semiconductors | IC MPU MPC6XX 300MHZ 255FCCBGA | Microprocessors | 255-FCCBGA (21x21) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Supplier Device Package: 255-FCCBGA (21×21) | 1,385 | |
 | | MPC603RZT200LC | NXP Semiconductors | IC MPU MPC6XX 200MHZ 255BGA | Microprocessors | 255-PBGA (23x23) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 255-PBGA (23×23) | 216 | |
 | | MPC7410HX400LE | NXP Semiconductors | IC MPU MPC74XX 400MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 640 | |
 | | MPC7410HX450LE | NXP Semiconductors | IC MPU MPC74XX 450MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-CBGA (25×25) | 1,058 | |
 | | MPC7410HX500LE | NXP Semiconductors | IC MPU MPC74XX 500MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-CBGA (25×25) | 652 | |
 | | MPC7410RX500LE | NXP Semiconductors | IC MPU MPC74XX 500MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-CBGA (25×25) | 1,467 | |
 | | MPC7410THX400LE | NXP Semiconductors | IC MPU MPC74XX 400MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-CBGA (25×25) | 1,959 | |
 | | MPC7410THX450NE | NXP Semiconductors | IC MPU MPC74XX 450MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-CBGA (25×25) | 1,441 | |
 | | MPC7410THX500LE | NXP Semiconductors | IC MPU MPC74XX 500MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-CBGA (25×25) | 132 | |
 | | MPC7410VS500LE | NXP Semiconductors | IC MPU MPC74XX 500MHZ 360FCCLGA | Microprocessors | 360-FCCLGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25×25) | 260 | |
| N/A | | MPC745BPX300LE | NXP Semiconductors | IC MPU MPC7XX 300MHZ 255FCPBGA | Microprocessors | 255-FCPBGA (21x21) | 2.5V, 3.3V | 0°C – 105°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,751 | |
| N/A | | MPC745BPX350LE | NXP Semiconductors | IC MPU MPC7XX 350MHZ 255FCPBGA | Microprocessors | 255-FCPBGA (21x21) | N/A | 0°C ~ 105°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 255-BBGA, FCBGA Supplier Device Package: 255-FCPBGA (21×21) | 1,967 | |
| N/A | | MPC745BVT300LE | NXP Semiconductors | IC MPU MPC7XX 300MHZ 255FCPBGA | Microprocessors | 255-FCPBGA (21x21) | 2.5V, 3.3V | 0°C – 105°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 864 | |
| N/A | | MPC745CPX350LE | NXP Semiconductors | IC MPU MPC7XX 350MHZ 255FCPBGA | Microprocessors | 255-FCPBGA (21x21) | 2.5V, 3.3V | 0°C – 105°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,738 | |
| N/A | | MPC745CVT350LE | NXP Semiconductors | IC MPU MPC7XX 350MHZ 255FCPBGA | Microprocessors | 255-FCPBGA (21x21) | 2.5V, 3.3V | 0°C – 105°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 723 | |
 | | MPC755BPX300LE | NXP Semiconductors | IC MPU MPC7XX 300MHZ 360FCPBGA | Microprocessors | 360-FCPBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BBGA, FCBGA Supplier Device Package: 360-FCPBGA (25×25) | 1,133 | |
 | | MPC755BPX350LE | NXP Semiconductors | IC MPU MPC7XX 350MHZ 360FCPBGA | Microprocessors | 360-FCPBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BBGA, FCBGA Supplier Device Package: 360-FCPBGA (25×25) | 670 | |