MPC603RRX266TC

IC MPU MPC6XX 266MHZ 255FCCBGA
Part Description

PowerPC 603e Microprocessor IC MPC6xx 1 Core, 32-Bit 266MHz 255-FCCBGA (21x21)

Quantity 1,492 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC603
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC 603eDevice Package255-FCCBGA (21x21)ECCN3A991A2
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level1 (Unlimited)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case255-BCBGA, FCCBGAREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package255-FCCBGA (21×21)
Voltage – I/O3.3V

Overview of MPC603RRX266TC – PowerPC 603e 32‑Bit 266 MHz Microprocessor

The MPC603RRX266TC is a PowerPC 603e single‑core, 32‑bit microprocessor from NXP Semiconductors, specified at 266 MHz and supplied in a 255‑FCCBGA (21×21) surface‑mount package. It is offered with industrial qualification and an extended operating temperature range, making it suitable for embedded designs that require reliable, sustained performance.

Built on the PowerPC 603e architecture, the device provides a balance of performance and power management suited to embedded and industrial applications. On‑chip power‑saving modes and an implementation optimized for low power help reduce system-level energy consumption while maintaining processing capability.

Key Features

  • Core & Architecture — PowerPC 603e single core, 32‑bit processor delivering 266 MHz operation for deterministic embedded processing.
  • Performance Engine — Superscalar design and multiple execution units enable concurrent instruction throughput; the 603e architecture supports out‑of‑order execution and high instruction issue rates as described in the device family documentation.
  • Power Management — Four software‑controllable power‑saving modes (nap, doze, sleep and a dynamic low‑power mode) to reduce power dissipation during idle conditions.
  • Voltage I/O — 3.3 V I/O signaling compatible with common embedded system voltage domains.
  • Package & Mounting — 255‑FCCBGA (21×21) package in a surface‑mount form factor for compact board integration.
  • Industrial Qualification — Qualified for industrial applications with an operating temperature range of −40°C to 105°C.
  • RoHS Compliant — Conforms to RoHS environmental requirements.
  • No Graphics Acceleration — Designed as a general‑purpose embedded CPU; graphics acceleration is not included.

Typical Applications

  • Embedded Control Systems — Suitable for control and processing tasks in embedded platforms that require 32‑bit processing at 266 MHz.
  • Industrial Automation — Industrial‑qualified temperature range and package make it appropriate for automation and instrumentation controllers.
  • Communication Equipment — Useful in network and communications products that need a compact, single‑core PowerPC processor.

Unique Advantages

  • Balanced Performance and Efficiency: 266 MHz operation combined with PowerPC 603e architectural features provides effective compute throughput while enabling power‑saving modes.
  • Industrial‑Grade Temperature Range: Rated from −40°C to 105°C for deployment in temperature‑challenging environments.
  • Compact BGA Packaging: 255‑FCCBGA (21×21) package allows for high‑density, surface‑mount integration on space‑constrained PCBs.
  • Proven Architecture: PowerPC 603e design includes multiple execution units and advanced instruction management to support embedded workloads.
  • System-Level Power Controls: Multiple software‑selectable low‑power modes reduce system energy use during idle periods.
  • Environmental Compliance: RoHS compliance supports regulatory and corporate sustainability goals.

Why Choose MPC603RRX266TC?

The MPC603RRX266TC targets embedded and industrial designs that need a reliable, single‑core 32‑bit PowerPC processor with a 266 MHz clock speed, industrial qualification and compact BGA packaging. Its combination of architectural throughput and software‑controllable power modes makes it a practical choice for applications that balance performance with energy efficiency.

Backed by NXP Semiconductors and documented through the MPC603 family hardware specifications, the MPC603RRX266TC is suited for engineers specifying robust processing in embedded systems requiring extended temperature operation and surface‑mount integration.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the MPC603RRX266TC.

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