MPC603RRX200LC

The MPC603RRX200LC is a PowerPC 603e single-core, 32-bit microprocessor offered by NXP Semiconductors for embedded and consumer applications. It delivers a 200 MHz core frequency in a compact 255-FCCBGA (21 × 21 mm) surface-mount package and is RoHS compliant.

Designed for embedded consumer designs that require a single PowerPC 603e RISC core, this device provides defined operating conditions (core Vdd specified at 2.5 ±5%) and an I/O voltage of 3.3 V, with an operating temperature range specified from 0 °C to 105 °C.

Key Features

• Core PowerPC 603e single 32-bit core, supporting 200 MHz operation as specified for this part number.
• Performance 200 MHz core clock speed for deterministic single-core processing in embedded consumer systems.
• Power Supply Core supply specified in the part documentation as Vdd = 2.5 ±5%; I/O voltage listed as 3.3 V.
• Package & Mounting 255-FCCBGA package (255-ball, 21 × 21 mm) optimized for surface-mount PCB assembly.
• Temperature Range Operational range specified from 0 °C to 105 °C (Tj range in the part specification).
• Qualification & Compliance Consumer-qualified device; RoHS compliant.
• Graphics No graphics acceleration (device does not include dedicated graphics acceleration).

Typical Applications

• Embedded Consumer Devices — Single-core 32-bit RISC processing for control, protocol handling or embedded application logic in consumer products.
• Single-Core Control Systems — Deterministic 200 MHz CPU for control and coordination tasks in compact electronic systems.
• Embedded Development Platforms — Suitable for developers and integrators targeting the PowerPC 603e architecture in a 255-ball BGA form factor.

Unique Advantages

• Proven PowerPC 603e Architecture: Offers a single 32-bit RISC core at 200 MHz for predictable embedded processing.
• Defined Power Domains: Core Vdd specified at 2.5 ±5% and I/O at 3.3 V, enabling clear power-supply design and segregation.
• Compact BGA Package: 255-FCCBGA (21 × 21 mm) provides a high-density surface-mount footprint for space-constrained designs.
• Wide Operating Range: Specified operation up to 105 °C supports consumer applications with elevated thermal requirements.
• Regulatory Compliance: RoHS status compliant for environmentally conscious designs.
• Consumer Qualification: Part is specified for consumer-grade applications where that qualification is required.

Why Choose MPC603RRX200LC?

The MPC603RRX200LC positions the PowerPC 603e core in a compact, surface-mount 255-FCCBGA package with clearly specified electrical and thermal conditions, making it suitable for embedded and consumer designs that require a single 32-bit RISC processor at 200 MHz. Its combination of defined core and I/O supply voltages, consumer qualification, and RoHS compliance supports straightforward system integration and regulatory alignment.

Available from NXP Semiconductors with part-specific documentation detailing operating conditions and known errata, the MPC603RRX200LC is appropriate for engineers and procurement teams seeking a documented PowerPC 603e solution in a BGA form factor.

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