MPC603RRX300LC

IC MPU MPC6XX 300MHZ 255FCCBGA
Part Description

PowerPC 603e Microprocessor IC MPC6xx 1 Core, 32-Bit 300MHz 255-FCCBGA (21x21)

Quantity 354 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC603
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC 603eDevice Package255-FCCBGA (21x21)ECCN3A991A2
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level1 (Unlimited)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 105°C (TA)Package / Case255-BCBGA, FCCBGAREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed300MHzSupplier Device Package255-FCCBGA (21×21)
Voltage – I/O3.3V

Overview of MPC603RRX300LC – IC MPU MPC6XX 300MHZ 255FCCBGA

The MPC603RRX300LC is a PowerPC 603e microprocessor offered by NXP Semiconductors for embedded, consumer applications. It features a single 32‑bit PowerPC 603e core running at 300 MHz, delivering deterministic processing performance for control and compute tasks.

Designed for compact surface‑mount integration, the device provides a balanced combination of core performance, defined supply domains, and a consumer temperature qualification suitable for a range of embedded product designs.

Key Features

  • Core PowerPC 603e RISC core, single 32‑bit processor delivering a 300 MHz operating frequency for control and application processing.
  • Performance 300 MHz core frequency as specified for the MPC603RRX300LC part number.
  • Supply Domains Core supply (Vdd) specified at 2.5 V ±5% per the part specification; I/O voltage listed as 3.3 V in the component specifications.
  • Package & Mounting 255‑FCCBGA package (255‑BCBGA) in a 21x21 array; surface‑mount device for compact board implementation.
  • Operating Temperature Qualified for consumer grade operation from 0 °C to 105 °C.
  • Qualification & Compliance Consumer qualification and RoHS‑compliant status.

Typical Applications

  • Embedded Consumer Electronics Core processing and control functions in consumer devices where a single 32‑bit RISC core at 300 MHz is appropriate.
  • Control & Automation Deterministic processing for embedded control tasks within the device’s consumer temperature range.
  • Compact Board Designs Surface‑mount 255‑FCCBGA package supports space‑constrained PCB layouts.

Unique Advantages

  • Proven PowerPC 603e Architecture: Single 32‑bit core with a defined 300 MHz frequency for predictable processing capability.
  • Dual Supply Compatibility: Distinct core Vdd (2.5 V ±5%) and 3.3 V I/O allow integration with common system power rails.
  • Compact BGA Packaging: 255‑FCCBGA (21x21) surface‑mount package minimizes board footprint while supporting robust BGA connections.
  • Consumer Temperature Range: Qualified for 0 °C to 105 °C operation to meet typical consumer embedded product environments.
  • RoHS Compliant: Meets lead‑free and environmental compliance requirements for modern electronics manufacturing.

Why Choose MPC603RRX300LC?

The MPC603RRX300LC positions itself as a balanced embedded microprocessor choice for consumer‑grade designs that require a single 32‑bit PowerPC 603e core operating at 300 MHz. Its defined supply domains, compact 255‑FCCBGA package, and RoHS compliance make it suitable for compact, production‑oriented embedded designs.

This part is ideal for developers and procurement teams seeking a documented MPC603 family device with clear electrical and environmental specifications and consumer qualification for mainstream embedded product lines.

Request a quote or submit an inquiry to obtain pricing and availability for the MPC603RRX300LC. Our team can assist with lead times and ordering details to support your design and production schedule.

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