MPC7410HX500LE

IC MPU MPC74XX 500MHZ 360CBGA
Part Description

PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 500MHz 360-CBGA (25x25)

Quantity 1,136 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC7410
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC G4Device Package360-CBGA (25x25)ECCN3A991A2
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level1 (Unlimited)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 105°C (TA)Package / Case360-BCBGA, FCCBGAREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed500MHzSupplier Device Package360-CBGA (25×25)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MPC7410HX500LE – IC MPU MPC74XX 500MHZ 360CBGA

The MPC7410HX500LE is a single‑core PowerPC G4 microprocessor optimized for computing and embedded systems applications. It implements the 32‑bit PowerPC architecture at a 500 MHz core frequency and is supplied in a 360‑CBGA (25×25) surface‑mount package.

Designed for applications that benefit from enhanced memory subsystem bandwidth, configurable L2 cache options and hardware multiprocessing features, the MPC7410 series provides a balanced combination of performance and system integration for consumer‑grade embedded designs. The device is RoHS compliant and rated for operation from 0 °C to 105 °C.

Key Features

  • PowerPC G4 Core – Single 32‑bit PowerPC G4 core operating at 500 MHz for general compute and control tasks.
  • AltiVec Technology – Implementation of the AltiVec instruction set as part of the MPC7410 architecture to support vector processing.
  • Enhanced Memory Subsystem – Improvements in memory subsystem bandwidth and an optional high‑bandwidth MPX bus interface to support higher throughput designs.
  • Hardware Multiprocessing Support – Full hardware‑based multiprocessing capability with a five‑state cache coherency protocol (four MESI states plus a fifth shared intervention state).
  • L2 Cache Flexibility – Configurable direct‑mapped SRAM capability for the L2 interface, support for a 32‑bit L2 interface and an additional L2 address pin for extended range.
  • Floating‑Point Unit Improvements – Floating‑point unit enhancements providing equalized latency for double‑ and single‑precision multiply operations.
  • Package and Mounting – Supplied in a 360‑CBGA (25×25) surface‑mount package (360‑BCBGA / FCCBGA package case options noted).
  • Operational Range and Compliance – Consumer qualification with an operating temperature range of 0 °C to 105 °C and RoHS compliance.

Typical Applications

  • Embedded Systems – Control and processing tasks in embedded platforms that require a 32‑bit PowerPC core with enhanced memory subsystem options.
  • Computing Appliances – Single‑core computing devices and appliances that leverage AltiVec and improved floating‑point behavior for signal or data processing.
  • Multiprocessing Designs – Systems that can take advantage of hardware multiprocessing and cache coherency features for clustered or multi‑processor configurations.
  • High‑Bandwidth Interfaces – Applications requiring optional MPX bus connectivity or flexible L2 cache configurations to increase data throughput.

Unique Advantages

  • Vector Processing Capability: AltiVec implementation enables vectorized workloads and data‑parallel operations where applicable.
  • Balanced Floating‑Point Performance: FPU improvements that equalize multiply latency for single‑ and double‑precision operations simplify numeric performance expectations.
  • Advanced Cache Coherency: Hardware‑based multiprocessing with a five‑state coherency protocol supports robust multi‑processor cache management.
  • Flexible L2 Options: Configurable direct‑mapped SRAM and a 32‑bit L2 interface provide design flexibility for memory performance tuning.
  • Standard CBGA Packaging: 360‑CBGA (25×25) surface‑mount package facilitates deployment in space‑constrained board designs.
  • RoHS Compliant: Meets RoHS requirements for lead‑free designs and global environmental standards for electronic assemblies.

Why Choose MPC7410HX500LE?

The MPC7410HX500LE positions itself as a practical PowerPC G4 solution for designers who need a 500 MHz 32‑bit core with advanced memory and multiprocessing features. Its combination of AltiVec support, enhanced memory subsystem options and configurable L2 cache makes it suitable for embedded and computing applications that require deterministic processing and flexible system integration.

With RoHS compliance, a broad operating temperature range (0 °C to 105 °C), and package options that support typical surface‑mount assembly, the MPC7410HX500LE offers a straightforward path for integrating the MPC7410 series into consumer‑oriented embedded designs while relying on published hardware specifications and documentation for system implementation.

Request a quote or submit a pricing inquiry to receive lead‑time, availability and ordering information for the MPC7410HX500LE.

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