MPC603RRX266LC

IC MPU MPC6XX 266MHZ 255FCCBGA
Part Description

PowerPC 603e Microprocessor IC MPC6xx 1 Core, 32-Bit 266MHz 255-FCCBGA (21x21)

Quantity 414 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC603
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC 603eDevice Package255-FCCBGA (21x21)ECCN3A991A2
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level1 (Unlimited)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 105°C (TA)Package / Case255-BCBGA, FCCBGAREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package255-FCCBGA (21×21)
Voltage – I/O3.3V

Overview of MPC603RRX266LC – IC MPU MPC6XX 266MHZ 255FCCBGA

The MPC603RRX266LC from NXP Semiconductors is a single-core, 32-bit PowerPC 603e microprocessor core running at 266 MHz in a compact 255-FCCBGA (21×21) surface-mount package. Designed for embedded and consumer applications, it combines a PowerPC architecture implementation with integrated power-management features for efficient operation.

Engineered for systems requiring deterministic 32-bit processing and floating-point support, the MPC603RRX266LC offers a balance of performance, low-power modes and a consumer-grade operating temperature range of 0 °C to 105 °C.

Key Features

  • PowerPC 603e Core Implements the PowerPC 603e 32-bit architecture with support for 32-bit effective addresses and standard integer and floating-point data types (8-, 16-, 32-bit integers; 32- and 64-bit floating point).
  • 266 MHz Clock Single-core operation at 266 MHz for embedded processing tasks.
  • Superscalar Execution Architecture capable of issuing and retiring up to three instructions per clock and integrating multiple execution units (integer unit, floating-point unit, branch processing unit) to improve instruction throughput.
  • Advanced Power Management Four software-controllable power-saving modes (nap, doze, sleep and a dynamic mode that places functional units into low-power states when idle) to reduce system power dissipation.
  • I/O and Supply 3.3 V I/O voltage suitable for common embedded system interfaces.
  • Compact Surface-Mount Package 255-FCCBGA (21×21) package, surface-mount design for space-constrained PCB layouts.
  • Consumer Qualification and RoHS Compliance Qualified for consumer applications and RoHS compliant for environmental compatibility.
  • Operating Temperature Range Rated for 0 °C to 105 °C to cover a wide range of consumer embedded environments.

Typical Applications

  • Embedded Consumer Devices Use as the main processor in consumer-focused embedded systems that require 32-bit processing and floating-point capabilities.
  • Control and Interface Processing Suitable for control tasks and user-interface management in compact, surface-mount designs.
  • Low-Power Embedded Systems Ideal for products that benefit from software-controlled power-saving modes to extend battery life or reduce thermal dissipation.

Unique Advantages

  • Balanced Performance and Efficiency: The PowerPC 603e core and 266 MHz clock provide capable 32-bit processing while built-in power modes help minimize energy use during idle periods.
  • Superscalar Architecture: Multiple execution units and the ability to issue and retire up to three instructions per clock improve throughput for mixed integer and floating-point workloads.
  • Floating-Point Support: Native support for 32- and 64-bit floating-point types via the integrated FPU enables precise numeric and signal-processing tasks.
  • Compact, Surface-Mount Packaging: The 255-FCCBGA (21×21) package supports compact board layouts and streamlined assembly for embedded product designs.
  • Consumer-Grade Qualification and Compliance: Consumer qualification and RoHS compliance simplify adoption in consumer-targeted product lines.
  • Wide Operating Range: Rated for 0 °C to 105 °C to meet typical consumer embedded thermal requirements.

Why Choose MPC603RRX266LC?

The MPC603RRX266LC is positioned for embedded and consumer applications that need a proven PowerPC 603e core with a balance of performance, integrated floating-point capability, and software-controlled power savings. Its compact 255-FCCBGA package and 3.3 V I/O make it suitable for space-constrained surface-mount designs.

For designers targeting consumer-grade embedded products, this NXP Semiconductors microprocessor delivers a reliable, RoHS-compliant option with configurable power modes and a robust thermal range, supporting scalable designs that combine processing capability with energy-conscious operation.

Request a quote or submit an inquiry to receive pricing and availability information for the MPC603RRX266LC.

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