MPC755BPX300LE

The MPC755BPX300LE is a PowerPC-based microprocessor featuring a single 32-bit core running at 300 MHz, delivered in a 360‑FCPBGA (25×25) surface-mount package. It belongs to the MPC755 family and is targeted for low-cost, low-power embedded designs.

Designed with on-chip support for L2 cache tagging and a dedicated L2 cache interface plus a 60x bus, the device integrates power-management capabilities (doze, nap, sleep, dynamic power management) and system-oriented features to streamline embedded processor implementations.

Key Features

• Core & Performance – PowerPC 32‑bit single core operating at 300 MHz, suitable for deterministic embedded workloads.
• Memory & Cache – On‑chip L2 tags with a dedicated L2 cache interface and 60x bus support; includes 32‑Kbyte instruction and 32‑Kbyte data cache structures as described in the MPC755 documentation.
• Power & Thermal Management – Supports doze, nap, sleep and dynamic power management modes and includes on‑chip thermal/power management circuitry. Rated for operation from 0 °C to 105 °C.
• System & Debug – Integrates Time Base counter/decrementer, clock multiplier, JTAG/COP interface and performance monitoring facilities for development and system diagnostics.
• Compute Subsystems – Architected with integer and floating‑point units, reorder/completion resources and dedicated load/store units as described in the MPC755 hardware specifications.
• Package & Mounting – 360‑FCPBGA (25×25) supplier device package, surface‑mount mounting type for compact board integration.
• Qualification & Compliance – Consumer qualification with RoHS compliance.
• Graphics – No graphics acceleration, focused on CPU-centric embedded processing.

Typical Applications

• Embedded systems – Single‑core PowerPC processing for control, protocol handling and real‑time tasks in compact embedded platforms.
• Consumer devices – Consumer‑qualified processor for low‑cost, low‑power consumer electronics that require a 300 MHz PowerPC core.
• Low‑power designs – Systems that benefit from integrated power modes (doze, nap, sleep, dynamic power management) to reduce runtime power consumption.

Unique Advantages

• Integrated L2 support – On‑chip L2 tag logic plus a dedicated L2 cache interface and 60x bus simplify external cache implementations and memory subsystem design.
• Power management modes – Built‑in doze, nap, sleep and dynamic power management options enable designers to optimize energy usage for battery‑sensitive or thermal‑constrained applications.
• Compact BGA footprint – 360‑FCPBGA (25×25) surface‑mount package supports high‑density PCB layouts for space‑constrained designs.
• System visibility and debug – JTAG/COP interface and performance monitoring features support development, bring‑up and diagnostic workflows.
• RoHS compliant – Meets RoHS requirements for environmental compliance in consumer and embedded markets.
• Thermal operating range – Rated for operation from 0 °C to 105 °C to accommodate a range of deployed ambient conditions.

Why Choose MPC755BPX300LE?

The MPC755BPX300LE provides a compact, PowerPC 32‑bit single‑core solution at 300 MHz with integrated L2 tag support, a dedicated L2 cache interface and system‑level features that reduce external component requirements. Its on‑chip power management and debug capabilities make it a practical choice for consumer‑qualified embedded designs that need reliable CPU performance in a small BGA package.

Engineers specifying the MPC755BPX300LE can leverage its controlled operating range, RoHS compliance and the MPC755 family architecture to deliver consistent, power‑aware embedded platforms with clear system‑level integration points.

Request a quote or submit an inquiry to receive pricing, availability and lead‑time information for the MPC755BPX300LE.