MPC755BRX300LE

The MPC755BRX300LE is a single‑core PowerPC microprocessor operating at 300 MHz, packaged in a 360‑CBGA (25×25) surface‑mount package. Designed for embedded applications, it targets low‑cost, low‑power systems and integrates on‑chip features to simplify system design.

Built on the MPC7xx family architecture, the device implements the PowerPC instruction set and is supplied by NXP Semiconductors. It is RoHS compliant and specified for consumer qualification with an operating temperature range of 0 °C to 105 °C.

Key Features

• Core and Performance – Single PowerPC core, 32‑bit architecture running at 300 MHz for predictable embedded processing performance.
• Cache and L2 Interface – On‑chip 32 KB instruction cache and 32 KB data cache with internal L2 tag and a dedicated L2 cache interface plus a 60x bus for system memory expansion.
• Power Management – Hardware support for doze, nap, sleep and dynamic power management modes to help reduce system power consumption in embedded deployments.
• System and Debug – Includes JTAG/COP interface, time base counter/decrementer, clock multiplier and performance monitoring facilities for system control and debug.
• Package and Mounting – 360‑CBGA (25×25) supplier device package; package cases include 360‑BCBGA and FCCBGA variants. Surface mount mounting type facilitates compact board designs.
• Environmental and Qualification – RoHS compliant and consumer‑qualified with specified operating temperature from 0 °C to 105 °C.
• Graphics – No graphics acceleration (for clarity in graphics‑independent embedded roles).

Typical Applications

• Low‑cost Embedded Systems – Targeted for cost‑sensitive designs that require a PowerPC core and basic on‑chip cache and bus interfaces.
• Consumer Electronics Control – Suitable for consumer devices needing a 300 MHz PowerPC processor with power management modes and RoHS compliance.
• Compact Board Designs – The 360‑CBGA surface‑mount package supports space‑constrained system boards requiring an integrated processor solution.

Unique Advantages

• Integrated L2 Tag and Dedicated L2 Interface – Simplifies memory hierarchy design and enables straightforward L2 cache implementation via the 60x bus.
• Power Management Modes – Doze, nap, sleep and dynamic power management options help reduce active power draw in battery‑sensitive or energy‑conscious designs.
• Compact Surface‑Mount Package – 360‑CBGA (25×25) packaging provides a high‑density footprint for embedded systems requiring small form factors.
• Clear Thermal Range for Consumer Designs – Specified 0 °C to 105 °C operating range supports consumer products exposed to elevated ambient temperatures.
• Standards‑Oriented Debug and Monitoring – JTAG/COP and performance monitoring features allow deterministic system bring‑up and diagnostics.
• RoHS Compliant – Meets common environmental requirements for modern electronics manufacturing.

Why Choose MPC755BRX300LE?

The MPC755BRX300LE combines a 300 MHz PowerPC core with on‑chip caches, a dedicated L2 interface and hardware power management to deliver a compact, energy‑aware processor option for embedded and consumer systems. Its packaging and surface‑mount form factor suit space‑constrained boards while the documented hardware specifications support system‑level integration.

This part is appropriate for designers seeking a documented, consumer‑qualified PowerPC MPU from NXP Semiconductors with clear thermal and environmental markers, enabling predictable integration in low‑cost, low‑power embedded designs.

Request a quote or submit an RFQ to obtain pricing and availability for MPC755BRX300LE and to discuss volume or lead‑time requirements.