MPC755BVT300LE

The MPC755BVT300LE is a single‑core, 32‑bit PowerPC microprocessor running at 300 MHz in a 360‑FCPBGA (25×25) surface‑mount package. Designed as part of the MPC755 family from NXP Semiconductors, this device implements the PowerPC instruction set architecture and is targeted for low‑cost, low‑power embedded systems.

Its on‑chip integration—including L2 tag support, a dedicated L2 cache interface and a 60x bus—combined with power management features makes it suited to consumer and embedded applications requiring efficient processing and system integration across a 0 °C to 105 °C operating range.

Key Features

• Core & Architecture PowerPC RISC core, single 32‑bit core operating at 300 MHz, implementing the PowerPC instruction set architecture.
• Memory & Cache Internal L2 tag with a dedicated L2 cache interface and 60x bus; 32‑Kbyte instruction cache and 32‑Kbyte data cache as described in the MPC755 hardware documentation.
• Power Management Supports doze, nap, sleep and dynamic power management modes and includes thermal/power management features to optimize energy use in embedded systems.
• Performance & Timing On‑chip Time Base Counter/Decrementer and clock multiplier support, plus performance monitoring capabilities for system tuning and diagnostics.
• Execution & Math Units Integrates integer and floating‑point execution units, branch processing and instruction dispatch resources consistent with the MPC755 family architecture.
• Debug & Test JTAG/COP interface for debug and boundary‑scan test access as provided in the MPC755 hardware specification.
• Package & Mounting 360‑FCPBGA (25×25) supplier device package, surface mount; packaged in tray format.
• Qualification & Temperature Consumer qualification with an operating temperature range of 0 °C to 105 °C.
• Graphics No dedicated graphics acceleration.

Typical Applications

• Embedded Control Single‑core PowerPC performance and on‑chip cache/interface support system control tasks in compact embedded platforms.
• Low‑Power Consumer Devices Power management modes and a consumer qualification make the device suitable for cost‑sensitive consumer electronics that require efficient processing.
• Network and I/O Controllers The dedicated L2 cache interface and 60x bus support system designs that need a tightly integrated processor and bus architecture for control and I/O functions.

Unique Advantages

• Efficient power management: Built‑in doze, nap, sleep and dynamic power management features help reduce system power consumption when full performance is not required.
• Integrated L2 support: Internal L2 tag and dedicated L2 cache interface simplify memory hierarchy design and speed data access over the 60x bus.
• Proven PowerPC architecture: Implements the PowerPC ISA with integrated integer and floating‑point units for predictable execution behavior in embedded software.
• Compact BGA packaging: 360‑FCPBGA (25×25) surface‑mount package enables high‑density designs while supporting tray delivery.
• Operational temperature range: 0 °C to 105 °C supports deployment in a wide range of consumer and industrial environments.
• Debug and monitoring: JTAG/COP interface and performance monitoring options facilitate development, testing and system optimization.

Why Choose MPC755BVT300LE?

The MPC755BVT300LE strikes a balance between integration, power efficiency and predictable PowerPC‑based performance for embedded and consumer applications. With dedicated L2 cache support, a 60x bus interface and a suite of power management features, it simplifies system design where efficient processing and lower BOM complexity are priorities.

This device is a practical option for designers building low‑cost, low‑power embedded systems who require a single 32‑bit PowerPC core with documented hardware features and NXP Semiconductors product support through the MPC755 family documentation.

Request a quote or submit an inquiry to obtain pricing, availability and ordering information for the MPC755BVT300LE.