MPC755CVT400LE
| Part Description |
PowerPC Microprocessor IC MPC7xx 1 Core, 32-Bit 400MHz 360-FCPBGA (25x25) |
|---|---|
| Quantity | 176 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC755 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC | Device Package | 360-FCPBGA (25x25) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C – 105°C | Package / Case | Tray | ||
| Speed | 400MHz | Voltage | 2.5V, 3.3V |
Overview of MPC755CVT400LE – IC MPU MPC7XX 400MHZ 360FCPBGA
The MPC755CVT400LE is a PowerPC-based 32-bit microprocessor IC from NXP Semiconductors, delivered in a 360-FCPBGA (25×25) surface-mount package. It implements a single PowerPC core running at 400 MHz and is targeted for consumer and embedded designs that demand low-cost, low-power operation.
Designed with an integrated L2 cache interface and internal L2 tags plus a 60x bus interface, the MPC755CVT400LE provides a compact, system-friendly processor option with on-chip power and thermal management features to support energy-efficient embedded applications.
Key Features
- PowerPC Core — 1 Core, 32‑Bit: Single 32-bit processor core running at 400 MHz for deterministic embedded compute.
- On-chip Cache Architecture: 32-Kbyte instruction cache and 32-Kbyte data cache with internal L2 tags and a dedicated L2 cache interface to support expanded memory bandwidth and cache hierarchy.
- System Bus and Data Paths: 60x bus interface with a 32-bit address bus and 32-/64-bit data bus; 17-bit L2 address bus and 64-bit L2 data bus for system integration.
- Power and Thermal Management: Built-in support for doze, nap, sleep and dynamic power management modes plus thermal management mechanisms to optimize system power use.
- Debug and System Control: JTAG/COP interface and performance monitoring capabilities to support bring-up and runtime analysis.
- Clock and Timing: On-chip clock multiplier and a time base counter/decrementer for flexible system timing and frequency scaling.
- Package and Mounting: 360-FCPBGA (25×25) supplier device package, surface mount, supplied in tray format for production assembly.
- Operating Range: Specified operating temperature range of 0 °C to 105 °C, suitable for a wide range of consumer and embedded environments.
- Qualification: Consumer-grade qualification for cost-sensitive embedded applications.
Typical Applications
- Consumer Embedded Devices: Compact consumer systems that require a single 32-bit processor with on-chip power management and cache support.
- Low‑Power Control Systems: Embedded controllers and appliance control units that benefit from doze/nap/sleep modes to reduce system power consumption.
- System and Peripheral Controllers: Designs that require an integrated L2 cache interface and 60x bus connectivity for medium-complexity system integration.
Unique Advantages
- Integrated L2 Cache Interface: On-chip L2 tags and a dedicated L2 interface simplify memory subsystem design and improve cache scalability.
- Power-Management Suite: Hardware support for multiple low-power modes and dynamic power management reduces system power draw in standby and active operation.
- Compact BGA Package: 360-FCPBGA (25×25) surface-mount package supports dense PCB layouts and production-ready assembly in tray format.
- System Debug and Monitoring: JTAG/COP and performance monitoring features enable effective bring-up, debugging, and runtime performance analysis.
- Extended Operating Window: 0 °C to 105 °C operating range accommodates a variety of consumer and embedded deployment environments.
- Balanced Data Paths: 32-/64-bit data bus and 60x system interface provide flexible options for interfacing memory and peripherals.
Why Choose MPC755CVT400LE?
The MPC755CVT400LE balances a single 400 MHz PowerPC core with integrated cache infrastructure, system bus connectivity, and hardware power-management features to deliver a pragmatic solution for cost- and power-sensitive embedded designs. Its combination of on-chip L2 support, debug interfaces, and a compact 360-FCPBGA package makes it well suited for consumer and general embedded applications where board space, power efficiency, and system integration matter.
Engineers selecting the MPC755CVT400LE get a processor positioned for straightforward integration into embedded platforms, with on-chip capabilities that simplify memory and power design decisions while supporting production assembly requirements.
Request a quote or submit a procurement inquiry to obtain pricing, availability, and additional ordering information for the MPC755CVT400LE.

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