MPC823CVR66B2T

IC MPU MPC8XX 66MHZ 256BGA
Part Description

PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)

Quantity 335 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC823
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPCDevice Package256-PBGA (23x23)Mounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C – 95°CPackage / CaseTray
Speed66MHzVoltage3.3V

Overview of MPC823CVR66B2T – IC MPU MPC8XX 66MHZ 256BGA

The MPC823CVR66B2T is a single‑core, 32‑bit PowerPC microprocessor operating at 66 MHz in a 256‑pin PBGA (23×23) package. It combines a high‑performance embedded PowerPC core with a dedicated Communication Processor Module (CPM) and integrated peripheral controllers to address portable, imaging and communications‑centric embedded designs.

Designed for embedded and industrial applications, this device offers integrated DRAM control, LCD and video display controllers, USB and Ethernet connectivity, and a RISC‑based CPM to offload communication and signal‑processing tasks for improved overall power efficiency and system integration.

Key Features

  • Processor Core – Single PowerPC 32‑bit core at 66 MHz providing an embedded PowerPC architecture implementation.
  • Communication Processor Module (CPM) – On‑chip RISC CPM for communications and imaging tasks; supports dedicated DMA channels and offloads peripheral processing from the main core.
  • Memory and Caches – Integrated DRAM controller and on‑chip instruction and data cache architecture (series datasheet references instruction and data cache implementations) to support efficient memory access patterns.
  • Connectivity – USB 1.x channel and a 10 Mbps Ethernet interface (single port) plus multiple serial channels as provided by the CPM for peripheral and network interfacing.
  • Display Support – Integrated LCD and video display controllers for direct display interfacing in mobile and embedded systems.
  • I/O Voltage – 3.3 V I/O boundary suitable for common embedded interfaces.
  • Package and Mounting – 256‑PBGA (23×23) surface‑mount package for compact board layouts.
  • Industrial Qualification – Listed as Industrial qualification for deployment in industrial embedded applications.
  • Graphics Acceleration – No dedicated graphics acceleration (suitable when display controller functionality is sufficient without external GPU).

Typical Applications

  • Portable and Mobile Devices – Low‑power architecture and integrated display interfaces support handheld and mobile computing products.
  • Image Capture and Processing – CPM’s RISC processing and DMA capabilities enable embedded image compression/decompression and related signal processing tasks.
  • Communications Equipment – USB and Ethernet connectivity combined with multiple serial channels make the device suitable for networked communication modules and gateways.
  • Industrial Embedded Systems – Industrial qualification and integrated DRAM and peripheral controllers simplify deployment in industrial control and HMI applications.

Unique Advantages

  • Integrated CPM for Peripheral Offload: The on‑chip Communication Processor Module handles imaging and communication tasks, reducing load on the PowerPC core and simplifying firmware partitioning.
  • Broad Peripheral Set: Built‑in USB, Ethernet, serial channels, and display controllers reduce external component count and simplify board design.
  • Compact PBGA Footprint: 256‑PBGA (23×23) package offers a dense, surface‑mount form factor for space‑constrained designs.
  • 3.3 V I/O Compatibility: Standard 3.3 V I/O boundary supports common peripheral interfaces without level‑translation complexity.
  • Industrial Qualification: Specified for industrial use, aligning with deployment requirements in industrial embedded applications.
  • System Efficiency: Two‑processor architecture and DMA support enable efficient peripheral handling and lower overall system power for embedded tasks.

Why Choose MPC823CVR66B2T?

The MPC823CVR66B2T positions itself as a highly integrated embedded microprocessor solution combining a PowerPC core with a RISC‑based Communication Processor Module and a broad set of on‑chip peripherals. Its 66 MHz PowerPC core, integrated DRAM support, display controllers, USB and Ethernet interfaces, and surface‑mount PBGA package make it well suited for compact, connectivity‑focused embedded and industrial designs.

Design teams looking to reduce BOM complexity, offload peripheral processing, and deploy robust embedded systems will find the MPC823CVR66B2T a practical choice for mobile computing, imaging, communications, and industrial applications where integration and proven architecture are key.

Request a quote or submit an inquiry to receive pricing and availability for the MPC823CVR66B2T and to discuss how it fits your next embedded design.

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