MPC823CZQ66B2T

IC MPU MPC8XX 66MHZ 256BGA
Part Description

PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)

Quantity 625 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC823
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPCDevice Package256-PBGA (23x23)
Display & Interface ControllersLCD, VideoECCN3A991A2Ethernet10Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 95°C (TA)Package / Case256-BBGARAM ControllersDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed66MHz
Supplier Device Package256-PBGA (23×23)USBUSB 1.x (1)Voltage – I/O3.3V

Overview of MPC823CZQ66B2T – IC MPU MPC8XX 66MHZ 256BGA

The MPC823CZQ66B2T is a single-core, 32-bit PowerPC microprocessor in a 256-pin PBGA (23×23) package, rated for industrial use. Operating at 66 MHz with 3.3 V I/O, it integrates an embedded PowerPC core and a dedicated communication processor module (CPM) to deliver a compact, low-power system-on-chip solution for embedded and portable designs.

Designed for applications that require on-chip peripherals and efficient peripheral offload, the device combines processor performance with integrated interfaces for imaging, display, communication and memory control to simplify system design and reduce BOM count.

Key Features

  • PowerPC Core  Single-issue, 32-bit embedded PowerPC core operating at 66 MHz with on-chip instruction and data caches and an integrated memory management unit (MMU).
  • Communication Processor Module (CPM)  On-chip RISC CPM for communications and signal-processing tasks, providing dedicated processing and DMA-style data movement to offload the main core.
  • Caches & Memory Management  On-chip instruction and data caches and fully associative TLBs with multiple page-size support, plus DRAM controller support for external memory.
  • Peripheral Interfaces  Integrated USB 1.x channel, I2C port, serial channels and a serial peripheral interface for broad peripheral connectivity.
  • Display & Imaging  Built-in LCD and video display controller functions and CPM support for embedded imaging tasks such as compression/decompression.
  • Networking  Supports a 10 Mbps Ethernet interface (single port) for basic networking and connectivity requirements.
  • Flexible External Bus  Dynamic bus sizing for 8-, 16- and 32-bit external buses with 26 external address lines and support for multiple endianness modes.
  • Static, Low-Power Design  Completely static design operation across 0–75 MHz, enabling low-power modes and flexible clock control.
  • Industrial Qualification & Temperature Range  Industrial-qualified device rated for operation from −40 °C to 95 °C.
  • Package & Mounting  256-PBGA (23×23) surface-mount package suitable for compact embedded boards.

Typical Applications

  • Portable and Mobile Devices  Low-power, integrated processor and peripheral functions make it suitable for portable image capture and communication endpoints.
  • Embedded Networking Equipment  Single-port 10 Mbps Ethernet plus serial and USB interfaces support basic networking and communication appliances.
  • Imaging and Display Systems  On-chip CPM plus LCD/video controllers enable image compression/decompression and direct display drive in compact systems.
  • Industrial Embedded Controllers  Industrial qualification and −40 °C to 95 °C rating suit embedded control and monitoring equipment in harsh environments.

Unique Advantages

  • Integrated Two-Processor Architecture: PowerPC core plus CPM allow parallel processing of application code and communication/image tasks, reducing software complexity and offloading real-time workloads.
  • On-Chip Peripherals Reduce BOM: USB, I2C, serial channels, DRAM controller and display interfaces minimize the need for external companion chips.
  • Flexible Memory and Bus Support: Dynamic external bus sizing, multiple page sizes and fully associative TLBs simplify porting and memory configuration across systems.
  • Industrial-Grade Reliability: Industrial qualification and wide operating temperature range support long-term deployment in demanding environments.
  • Compact, Surface-Mount Package: 256-PBGA (23×23) package enables high-density board layouts for space-constrained designs.

Why Choose MPC823CZQ66B2T?

The MPC823CZQ66B2T combines an embedded PowerPC core with a dedicated communications RISC CPM and an array of on-chip peripherals to deliver a highly integrated microprocessor solution for embedded and portable systems. Its mix of display, imaging, communication and memory interfaces simplifies system design while the static, low-power architecture supports flexible power and clock management.

This device is ideal for designers seeking an industrial-qualified, compact processor package that reduces external component count and supports imaging, display and communication workstreams in a single-chip solution.

Request a quote or submit an inquiry for availability and lead times for the MPC823CZQ66B2T to begin integrating this industrial-grade PowerPC MPU into your next embedded design.

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