MPC823ZQ66B2T

The MPC823ZQ66B2T is a single‑core, 32‑bit PowerPC microprocessor operating at 66 MHz in a 256‑PBGA (23×23) surface‑mount package. It integrates an embedded PowerPC core with a dedicated Communication Processor Module (CPM) and a broad set of on‑chip peripherals, making it suited for embedded, portable and imaging/communication applications.

With integrated display controllers, USB and serial interfaces, DRAM support and RoHS compliance, this device delivers a compact, low‑power foundation for designs requiring combined processing and communications functionality within a single package.

Key Features

• Core and Performance – Single PowerPC core, 32‑bit, running at 66 MHz with embedded instruction and data caches to accelerate system performance.
• Communication Processor Module (CPM) – On‑chip RISC CPM for communications and signal‑processing tasks, allowing the core to offload peripheral and imaging operations.
• Caches & Memory Management – On‑chip caches (instruction and data) and memory management support including translation lookaside buffers and multiple page sizes for flexible virtual memory control.
• Bus and Data Width – Dynamic external bus sizing for 8‑, 16‑ and 32‑bit buses and twenty‑six external address lines for broad memory interfacing options.
• Interfaces – Integrated USB 1.x (1 channel), I2C port, serial peripheral interface and multiple serial channels for peripheral connectivity and control.
• Display and Multimedia – On‑chip LCD and video display controllers to support embedded user interfaces and basic video tasks.
• Networking – Single 10 Mbps Ethernet interface for basic network connectivity.
• Memory Controllers – DRAM controller support for external system memory.
• Package and Mounting – 256‑PBGA (23×23) package, surface mount, suitable for space‑constrained board designs.
• Power and Temperature – 3.3 V I/O and an operating temperature range of 0 °C to 95 °C for consumer applications.
• Compliance – RoHS compliant.

Typical Applications

• Portable devices – Integrated low‑power core and CPM make the device suited for portable systems that require imaging or communications processing while conserving power.
• Image capture and processing – CPM support for embedded signal processing enables image compression/decompression and related tasks in camera or scanner designs.
• Communication equipment – Multiple serial channels, I2C, USB 1.x and a 10 Mbps Ethernet interface support connectivity and control in communication peripherals.
• Embedded displays – Integrated LCD and video controllers simplify the implementation of user interfaces and basic video output in consumer devices.

Unique Advantages

• Integrated communications offload – The on‑chip CPM handles protocol and signal processing tasks, reducing load on the PowerPC core and simplifying software partitioning.
• Rich peripheral set on a single chip – USB, I2C, SPI, serial channels, Ethernet and display controllers minimize external component count and reduce BOM complexity.
• Flexible memory and bus support – Dynamic bus sizing and DRAM controller support allow integration with a variety of external memory configurations and system topologies.
• Compact, surface‑mount package – 256‑PBGA (23×23) packaging delivers high device density for compact embedded board layouts.
• Designed for embedded, low‑power systems – Architecture and on‑chip features support portable and consumer applications where power efficiency and integration matter.

Why Choose MPC823ZQ66B2T?

The MPC823ZQ66B2T combines a PowerPC core with a dedicated Communication Processor Module and a wide set of on‑chip peripherals to provide a highly integrated solution for embedded designs. Its mix of display controllers, serial interfaces, USB, Ethernet and DRAM support allows designers to consolidate system functions and reduce external components.

This device is well suited to engineers building consumer and portable products that require imaging, communications or embedded display capabilities while maintaining a compact board footprint and RoHS compliance. Backed by NXP Semiconductors product documentation, the MPC823ZQ66B2T is positioned for projects that demand integration, flexible memory interfacing and standard 3.3 V I/O operation.

Request a quote or submit an inquiry to receive pricing, availability and any additional technical information needed to evaluate the MPC823ZQ66B2T for your next embedded design.