MPC8241LVR266D
| Part Description |
PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 187 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8241 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC 603e | Device Package | 357-PBGA (25x25) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 105°C (TA) | Package / Case | 357-BBGA | RAM Controllers | SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 266MHz | ||
| Supplier Device Package | 357-PBGA (25×25) | Voltage – I/O | 3.3V |
Overview of MPC8241LVR266D – PowerPC 603e 266 MHz 32‑Bit MPU
The MPC8241LVR266D from NXP Semiconductors is an integrated microprocessor combining a 32‑bit PowerPC 603e superscalar core running at 266 MHz with a rich peripheral logic block. The device integrates a PCI bridge and a high‑performance memory controller, making it well suited for embedded designs that require on‑chip system interfaces and straightforward integration of PCI peripherals.
Designed for consumer‑grade embedded applications, the MPC8241LVR266D offers on‑chip support for SDRAM, serial interfaces and system management features to simplify board design and accelerate time to market.
Key Features
- Core 32‑bit PowerPC 603e superscalar processor core operating at 266 MHz with integrated instruction and data caches (16‑Kbyte each as documented in the series specification).
- Memory and Storage High‑performance memory controller with support for SDRAM and ROM; on‑chip ECC controller and memory system facilities described in the MPC8241 hardware specification.
- Peripheral Integration Integrated peripheral logic including a PCI bridge, DMA controller, interrupt controller (PIC), timers and DUART to reduce external component count and simplify system design.
- Interfaces On‑chip I2C controller plus PCI bus interface and serial interrupt support to connect a wide range of standard peripherals.
- System and Debug JTAG/COP debug support, performance monitoring and PLL configuration options referenced in the device documentation to aid development and optimization.
- Package and Mounting Supplied in a 357‑ball PBGA package (25×25 mm) for surface‑mount assembly, enabling compact board layouts.
- Power and Operating Range 3.3 V I/O voltage and an operating temperature range of 0 °C to 105 °C suitable for consumer‑grade embedded environments.
- Compliance RoHS compliant for environmental conformity.
Typical Applications
- PCI‑based Embedded Systems Use the on‑chip PCI bridge to integrate standard PCI peripherals with minimal external logic.
- Consumer Embedded Devices Ideal for consumer applications requiring a balanced mix of processing performance and peripheral integration (device is qualified as Consumer).
- Communications and Networking Appliances Leverage the PCI interface, DMA and interrupt logic to support data‑path processing and peripheral expansion.
- System Controllers with SDRAM Built‑in SDRAM controller and ECC support make the part suitable for designs requiring external volatile memory with data integrity features.
Unique Advantages
- Highly integrated peripheral logic: Combines PCI bridge, memory controller, DMA, DUART and interrupt controllers on‑chip to reduce BOM and board complexity.
- Proven PowerPC core: The PowerPC 603e core provides a superscalar 32‑bit architecture at 266 MHz with on‑chip caches for responsive embedded performance.
- Flexible memory support: On‑chip SDRAM and ROM support plus ECC controller simplify memory subsystem design and reliability.
- Development and debug features: JTAG/COP, PLL configuration and performance monitoring capabilities help accelerate bring‑up and system optimization.
- Compact BGA package: 357‑ball PBGA (25×25 mm) enables dense board layouts while supporting surface‑mount assembly processes.
- Regulatory readiness: RoHS compliance supports regulatory and supply‑chain requirements for environmental standards.
Why Choose MPC8241LVR266D?
The MPC8241LVR266D positions itself as a balanced, integrated solution for embedded designs that need a PowerPC 603e processor with on‑chip system interfaces. Its combination of a 266 MHz superscalar core, integrated PCI bridge, SDRAM support and a broad set of peripherals reduces external components and shortens development cycles.
For engineers and procurement teams targeting consumer‑grade embedded products that require reliable processing, peripheral integration, and a compact PBGA package, the MPC8241LVR266D offers a practical, documented platform with clear system design guidance provided in the MPC8241 hardware specification.
Request a quote or submit a pricing inquiry to obtain availability and lead‑time information for MPC8241LVR266D.

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