MPC8241LVR166D
| Part Description |
PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 166MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 640 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8241 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC 603e | Device Package | 357-PBGA (25x25) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 105°C (TA) | Package / Case | 357-BBGA | RAM Controllers | SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 166MHz | ||
| Supplier Device Package | 357-PBGA (25×25) | Voltage – I/O | 3.3V |
Overview of MPC8241LVR166D – IC MPU MPC82XX 166MHZ 357BGA
The MPC8241LVR166D is a single‑core, 32‑bit microprocessor based on the PowerPC 603e architecture, running at 166 MHz. It integrates a high‑performance processor core with peripheral logic—most notably a PCI bridge and a memory controller—designed for embedded systems that require PCI‑based peripheral connectivity and SDRAM support.
Targeted for embedded applications, this device delivers a balanced combination of processing capability, on‑chip integration and standard interfaces to simplify system design and accelerate time to market.
Key Features
- PowerPC 603e Core Superscalar 32‑bit processor core operating at 166 MHz, providing the processing foundation for embedded applications.
- Integrated PCI Bridge On‑chip PCI interface enables direct connection to PCI peripherals, simplifying system architectures that use standard PCI devices.
- Memory Controller and SDRAM Support Built‑in memory controller supports ROM and SDRAM, enabling straightforward system memory integration with data path ECC functionality referenced in the hardware specification.
- On‑chip Peripheral Logic Peripheral integration includes DUART, DMA controller, interrupt controller (PIC), message unit with I2O capability and an I2C controller for common embedded I/O and control tasks.
- Cache and MMU Includes 16‑KB instruction and 16‑KB data caches plus memory management support to improve effective system performance.
- System and Debug Support JTAG/COP interface and power management facilities provide support for system bring‑up, debugging and runtime control.
- I/O Voltage and Mounting 3.3 V I/O signaling and surface‑mount 357‑ball PBGA package (25 × 25 mm) for high‑density board designs.
- Operating Range and Compliance Qualified for consumer applications with an operating temperature range of 0 °C to 105 °C and RoHS compliance for environmental requirements.
Typical Applications
- PCI‑based Embedded Systems Use the integrated PCI bridge to connect standard PCI peripherals directly for compact, PCI‑centric embedded designs.
- Industrial Control and Automation On‑chip DMA, interrupt controller and I2C support enable real‑time control, sensor interfacing and communications in industrial equipment.
- Communications and Networking Equipment The processor core combined with message units and serial interfaces supports protocol handling and peripheral messaging tasks.
- General Purpose Embedded Devices A balanced mix of processing, memory controller support and peripheral logic suits a variety of embedded applications requiring SDRAM and standard I/O.
Unique Advantages
- Highly Integrated Solution: Combines a PowerPC 603e core with peripheral logic and a PCI bridge, reducing external component count and board complexity.
- Memory Subsystem Flexibility: Built‑in support for ROM and SDRAM with ECC‑capable data path simplifies memory design and improves data integrity options.
- Standard Peripheral Interfaces: On‑chip I2C, DUART, DMA and interrupt controllers provide common interfaces required by embedded systems, accelerating development.
- Compact, Surface‑Mount Package: 357‑PBGA (25 × 25 mm) package supports high‑density PCB layouts while offering a robust platform for complex embedded designs.
- Environmentally Compliant: RoHS compliance addresses regulatory and environmental considerations for modern electronic products.
Why Choose MPC8241LVR166D?
The MPC8241LVR166D positions itself as a practical platform for embedded designers who need a proven PowerPC 603e core combined with integrated system‑level functions such as a PCI bridge and SDRAM memory controller. Its on‑chip peripheral logic reduces external BOM and simplifies board design for applications that rely on PCI peripherals and common serial/control interfaces.
This device suits developers and system integrators building consumer‑grade embedded systems that require reliable processing, standard I/O and a compact package footprint, while benefiting from RoHS compliance and an operating range up to 105 °C.
Request a quote or submit a purchase inquiry to obtain pricing, availability and lead‑time information for the MPC8241LVR166D.

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