MPC8241LZQ266D

IC MPU MPC82XX 266MHZ 357BGA
Part Description

PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 357-PBGA (25x25)

Quantity 1,291 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8241
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC 603eDevice Package357-PBGA (25x25)ECCN3A991A2
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 105°C (TA)Package / Case357-BBGARAM ControllersSDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed266MHz
Supplier Device Package357-PBGA (25×25)Voltage – I/O3.3V

Overview of MPC8241LZQ266D – IC MPU MPC82XX 266MHZ 357BGA

The MPC8241LZQ266D is a single‑core PowerPC-based microprocessor integrating a 32‑bit MPC603e core running at 266 MHz. It combines a high‑performance processor core with peripheral logic—including a PCI bridge and a memory controller—targeted at embedded consumer applications.

Designed for systems that require integrated PCI support, SDRAM memory interfacing and on‑chip peripheral controllers, the device delivers a compact, RoHS‑compliant solution in a 357‑pin PBGA (25×25) package with a 3.3 V I/O interface and an operating range of 0 °C to 105 °C.

Key Features

  • Core  32‑bit PowerPC MPC603e superscalar core delivering a 266 MHz operating frequency for general embedded processing tasks.
  • Memory subsystem  Integrated high‑performance memory controller with support for ROM and SDRAM; on‑chip 16‑KB instruction cache and 16‑KB data cache to improve code and data throughput.
  • PCI integration  On‑chip PCI bridge and PCI bus interface to simplify connection of standard PCI peripherals and accelerate system design.
  • Peripheral logic  Includes DUART, DMA controller, interrupt controller (PIC), timers, message unit with I2O support, and an I2C controller for common embedded I/O and communication tasks.
  • System reliability  ECC controller and configuration registers provide data integrity and system configuration capabilities.
  • Package and mounting  Supplied in a 357‑PBGA (25×25) package, surface‑mount ready for compact board designs.
  • Electrical and environmental  3.3 V I/O signalling and RoHS compliance; rated operating temperature from 0 °C to 105 °C for consumer‑grade deployments.

Typical Applications

  • PCI‑based embedded systems  Ideal for compact platforms that require direct interfacing to PCI peripherals and standard PCI I/O.
  • Consumer embedded products  Suited to consumer‑grade electronics that benefit from an integrated processor, memory controller and peripheral set.
  • SDRAM‑based designs  Systems that use SDRAM and ROM for program and data storage can leverage the on‑chip memory controller and cache resources.
  • Communication and control modules  Applications that need serial interfaces, interrupt management and DMA can use the integrated DUART, PIC and DMA controller.

Unique Advantages

  • Highly integrated platform: Combines a PowerPC MPC603e core with peripheral logic (PCI bridge, memory controller, DUART, DMA, PIC, I2C) to reduce BOM and board complexity.
  • PCI connectivity built‑in: On‑chip PCI bridge accelerates integration of standard PCI peripherals without an external bridge component.
  • Memory performance: Dedicated memory controller plus 16‑KB instruction and 16‑KB data caches help improve effective system throughput with SDRAM and ROM.
  • Robust system control: Integrated interrupt controller, message unit and timers support deterministic control and communication tasks in embedded systems.
  • Compact packaging: 357‑PBGA (25×25) surface‑mount package supports dense board layouts while providing the necessary I/O and power pins.
  • RoHS compliant: Environmentally compliant manufacturing for modern production requirements.

Why Choose MPC8241LZQ266D?

The MPC8241LZQ266D positions itself as a compact, integrated solution for embedded consumer applications that require PCI connectivity, SDRAM support and a capable PowerPC core. Its combination of an MPC603e processor core, on‑chip peripheral logic and memory controller simplifies system architecture and shortens design cycles.

This device is suitable for designers seeking a single‑chip approach to reduce external components and manage board real‑estate while maintaining a clear upgrade path within the MPC82xx family and benefiting from documented hardware specifications and configuration options.

If you would like pricing, lead‑time or to submit a request for quotation for the MPC8241LZQ266D, please request a quote or submit your RFQ and our team will respond with the next steps.

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