MPC8245LVV300D

IC MPU MPC82XX 300MHZ 352TBGA
Part Description

PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 300MHz 352-TBGA (35x35)

Quantity 1,849 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8245
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC 603eDevice Package352-TBGA (35x35)ECCN3A991A2
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 105°C (TA)Package / Case352-LBGARAM ControllersSDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed300MHz
Supplier Device Package352-TBGA (35×35)Voltage – I/O3.3V

Overview of MPC8245LVV300D – IC MPU MPC82XX 300MHZ 352TBGA

The MPC8245LVV300D is a single‑core PowerPC MPC603e microprocessor IC operating at 300 MHz, offered in a 352‑TBGA (35×35) surface‑mount package. The device integrates a 32‑bit superscalar core with peripheral logic including a PCI bridge and a high‑performance memory controller, making it suitable for embedded system designs that require on‑chip system interfaces and memory support.

Packaged for consumer‑grade applications, the MPC8245LVV300D provides on‑chip SDRAM controller support, standard I/O interfaces such as I2C and DUART, and system features like DMA, interrupt control and ECC—helping reduce external component count and simplify board design.

Key Features

  • Core & Architecture 32‑bit PowerPC 603e superscalar processor core, single core at 300 MHz.
  • Memory Subsystem Integrated memory controller with SDRAM support and on‑chip ECC controller; 16‑Kbyte instruction and 16‑Kbyte data caches are included in the processor core.
  • PCI Integration Integrated PCI bridge and PCI bus interface to support system designs using PCI peripherals; peripheral logic includes a PCI arbiter and message unit.
  • Peripheral Logic On‑chip DUART, DMA controller, programmable interrupt controller (PIC), timers, and a message unit with I2O functionality.
  • System & Debug JTAG/COP interface and power management features are provided for system control and debug.
  • I/O and Interfaces Standard serial and control interfaces including I2C and multiple serial interrupt lines for external device control.
  • Package & Mounting 352‑TBGA (35×35) package case, surface‑mount mounting type suitable for compact embedded assemblies.
  • Electrical & Environmental 3.3 V I/O signaling and an operating temperature range of 0 °C to 105 °C; RoHS compliant and consumer‑qualified.

Typical Applications

  • Embedded systems with PCI peripherals Use the integrated PCI bridge to connect standard PCI devices while keeping system integration on a single chip.
  • Memory‑centric embedded controllers On‑chip SDRAM controller and ECC support simplify designs that require fast, reliable external memory.
  • Communications and control modules DUART, DMA, interrupt controller and I2C support common control and serial communication tasks in embedded modules.

Unique Advantages

  • Highly integrated solution: Combines a PowerPC 603e core with a PCI bridge, memory controller and a broad set of peripheral logic to reduce BOM and board complexity.
  • Balanced performance and system support: 300 MHz core with instruction and data caches plus floating‑point support provides compute capability alongside integrated system interfaces.
  • Robust memory handling: SDRAM controller with ECC support improves data integrity for memory‑dependent embedded applications.
  • Broad peripheral set: Built‑in DUART, DMA, PIC, timers and I2C enable flexible system I/O and control without extensive external logic.
  • Documented hardware specifications: Device features and electrical/thermal characteristics are published in the hardware specification and reference documentation to support system design and validation.

Why Choose MPC8245LVV300D?

The MPC8245LVV300D positions itself as a compact, integrated processor solution for embedded designs that need a PowerPC MPC603e core together with on‑chip PCI bridging and memory controller functionality. Its combination of a 300 MHz superscalar core, on‑chip peripherals and memory support streamlines system architecture and reduces external component count.

This device is well suited to designers targeting consumer‑grade embedded applications that require standard I/O interfaces, SDRAM support and reliable system control features. Backed by published hardware specifications and reference documentation, the MPC8245LVV300D provides verifiable electrical and physical characteristics to support development and deployment.

Request a quote or submit an RFQ for pricing and availability of the MPC8245LVV300D to begin specifying this integrated PowerPC solution into your next embedded design.

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